US6014316A
Expired / Lapsed
US
⏱️ 0.0 years remaining
IC stack utilizing BGA contacts
Assignee: Nytell Software LLC
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Filing: 1998-06-10
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Granted: 2000-01-11
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Expires: 2018-06-10
Abstract
Abstract A structure and process are disclosed in which IC chip-containing layers are stacked to create electronic density. Each layer is fabricated by forming one or more flexible circuit around a TSOP. Each flexible circuit contains conductors which are disposed to connect with TSOP leads, transpose signals to or from various locations on the top or bottom of the TSOP, and/or terminate in ball grid contacts for connection to other layers in the stack. The flexible circuit is bonded to the TSOP such that ball grid contacts are exposed on the top and bottom of the TSOP, and the ball grid array contacts on the bottom of the lowest layer are disposed to facilitate connection with a PCB or other circuitry.
Inventors
- 👤 Floyd K. Eide
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 14:16
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/18; H05K1/189; H05K3/00; H05K3/30; H05K3/32; H05K3/325; H05K3/326; H10; H10W; H10W90/00; H10W70/00; H10W70/40; H10W70/60; H10W90/701; H10W90/721; H10W90/722
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
88 words
A stack of IC chip-enclosing layers, comprising: an IC-containing layer comprising: a TSOP containing one or more IC chips and having I/O terminals thereon, and a flexible circuit, with exposed solderable contacts for connection to the TSOP terminals and ball grid contacts for connection with other layers in the stack, formed to fit over each terminal-bearing side of the TSOP; and a second IC-containing layer with ball grid contacts, supported on top of the lower layer and connected to the first layer via their respective ball grid contacts.
Claim 2
Dependent Claim
88 words
A stack of IC chip-enclosing layers, comprising: an IC-containing layer comprising: a TSOP containing one or more IC chips and having I/O terminals thereon, and a flexible circuit, with exposed solderable contacts for connection to the TSOP terminals and ball grid contacts for connection with other layers in the stack, formed to fit over each terminal-bearing side of the TSOP; and a second IC-containing layer with ball grid contacts, supported on top of the lower layer and connected to the first layer via their respective ball grid contacts.
Claim 3
Dependent Claim
22 words
The structure of claim 1 in which: additional IC chip-containing layers are supported and connected on the top of the second layer.
Claim 4
Dependent Claim
38 words
The structure of claim 1 in which: the ball grid contacts on the upper surface of one or more layers do not all electrically connect with the corresponding ball grid contacts on the lower surface of the layer.
Claim 5
Dependent Claim
17 words
The structure of claim 1 in which: flat bump connectors are used instead of ball grid connectors.
Claim 6
Dependent Claim
32 words
The structure of claim 1, in which: one or more terminal-bearing sides of the TSOP in one or more layers are mechanically rounded to increase the bending radius of the flexible circuit.
Claim 7
Independent Claim
106 words
A method of manufacturing an IC-containing layer ready for stacking with other layers in order to provide a dense electronic package comprising the steps of: fabricating, a flexible circuit including a top and a bottom surface with electrical conductors disposed to provide a desired connector geometry for connection of a TSOP with other layers; a ball grid array covering one of said top and bottom surface; forming the flexible circuit so that it fits over a lead-bearing side of a TSOP; and bonding the flexible circuit to the TSOP so as to align exposed conductors of the flexible circuit in solderable contact with the TSOP leads.
Claim 8
Independent Claim
106 words
A method of manufacturing an IC-containing layer ready for stacking with other layers in order to provide a dense electronic package comprising the steps of: fabricating, a flexible circuit including a top and a bottom surface with electrical conductors disposed to provide a desired connector geometry for connection of a TSOP with other layers; a ball grid array covering one of said top and bottom surface; forming the flexible circuit so that it fits over a lead-bearing side of a TSOP; and bonding the flexible circuit to the TSOP so as to align exposed conductors of the flexible circuit in solderable contact with the TSOP leads.
Claim 9
Dependent Claim
24 words
The method of claim 6 which also comprises: fabricating, forming, and bonding a second flexible circuit over the other lead-bearing side of a TSOP.
Claim 10
Dependent Claim
25 words
The method of claim 7 in which the flexible circuits provide a ball grid array covering substantially the entire top and bottom of the layer.
Claim 11
Dependent Claim
27 words
The method of claim 6 which also comprises: stacking a plurality of the layers; and electrically interconnecting conductors in each layer with conductors in the adjacent layer.
Claim 12
Dependent Claim
13 words
The method of claim 9 in which pre-testing is performed on said TSOP's.
Claim 13
Dependent Claim
29 words
The method of claim 9 which also comprises: testing, prior to stacking, for performance of the circuitry of each layer to establish the layer as a known good element.
Claim 14
Dependent Claim
29 words
The method of claim 11 in which the performance testing includes testing at extreme temperatures, testing through thermal cycles and thermal shock, and testing for performance under humidity conditions.
References Cited (Backward Citations)
US4833568A
Cited
US5166866A
Cited
US5568363A
Cited
US5484959A
Cited
US5631193A
Cited
US5736780A
Cited
US5790380A
Cited
US5767528A
Cited
JPH10303251A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-01-10 | 2003-07-12 | 2004-01-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-01-10 | 2007-07-12 | 2008-01-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-01-10 | 2011-07-12 | 2012-01-11 | $7700.00 | Window Closed / Lapsed |