US5790380A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for fabricating a multiple chip module using orthogonal reorientation of connection planes
Assignee: International Business Machines Corp
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Filing: 1995-12-15
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Granted: 1998-08-04
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Expires: 2015-12-15
Abstract
Abstract A multiple chip module architecture capable of forming structures having selectable aspect ratios which themselves form the basis for higher levels of integration in analogous manner. The modular architecture uses a flexible interconnect of patterned copper on polymer to successively reorient the connection plane between successive levels, permitting the selective stacking of module levels to create the desired aspect ratio of the multiple chip module. Interconnection between levels may be accomplished by solder reflow, direct dendritic bonding, or connection through a dendritic interposer.
Inventors
- 👤 Richard Francis Frankeny
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 02:10
CPC Classifications
H; H10; H10W; H10W72/00; H10W70/00; H10W70/60; H10W70/67; H10W70/688; H05; H05K; H05K7/00; H05K7/02; H05K7/023; H10W90/00
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
186 words
A method for fabricating a multiple chip module, comprising the steps of: enclosing multiple first level modules within a second support media, the first level modules characterized in their having: a first support media enclosing a chip to electrically route chip input/output connections from a first plane, defined by pads on the chip, to a second plane, orthogonal to the first plane; and first contacts distributed in the second plane on the first support media; bending the second support media to route connections with the first contacts of the multiple first level modules in the second plane to positions coplanar with the first plane; orienting second contacts on the second support media of the second level module to be coplanar with the first plane; enclosing multiple second level modules within a third support media; bending the third support media to route connections with the second contacts of the multiple second level modules situated coplanar with the first plane to positions coplanar with the second plane; and orienting third contacts on the third support media of the third level module to be coplanar with the second plane.
Claim 2
Independent Claim
186 words
A method for fabricating a multiple chip module, comprising the steps of: enclosing multiple first level modules within a second support media, the first level modules characterized in their having: a first support media enclosing a chip to electrically route chip input/output connections from a first plane, defined by pads on the chip, to a second plane, orthogonal to the first plane; and first contacts distributed in the second plane on the first support media; bending the second support media to route connections with the first contacts of the multiple first level modules in the second plane to positions coplanar with the first plane; orienting second contacts on the second support media of the second level module to be coplanar with the first plane; enclosing multiple second level modules within a third support media; bending the third support media to route connections with the second contacts of the multiple second level modules situated coplanar with the first plane to positions coplanar with the second plane; and orienting third contacts on the third support media of the third level module to be coplanar with the second plane.
Claim 3
Dependent Claim
24 words
The method recited in claim 1, wherein the second support media is composed of a flexible polymer having an attached pattern of electrical wiring.
Claim 4
Dependent Claim
45 words
The method recited in claim 2, wherein the step of enclosing multiple first level modules within the second support media concludes with a connection between first contacts of the first support media and the pattern of electrical wiring on the second support media through solder.
Claim 5
Dependent Claim
45 words
The method recited in claim 2, wherein the step of enclosing multiple first level modules within the second support media concludes with a connection between first contacts of the first support media and the pattern of electrical wiring on the second support media by dendrites.
References Cited (Backward Citations)
US3141999A
Cited
US3065384A
Cited
US3139559A
Cited
US3070729A
Cited
US3113248A
Cited
US3105869A
Cited
US4495546A
Cited
JPS59194460A
Cited
US4862249A
Cited
US4833568A
Cited
US5137461A
Cited
DE3931238A1
Cited
US5313416A
Cited
US5229916A
Cited
US5448511A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-08-03 | 2002-02-02 | 2002-08-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-08-03 | 2006-02-02 | 2006-08-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-08-03 | 2010-02-02 | 2010-08-04 | $7700.00 | Window Closed / Lapsed |