US5313416A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor memory control device and method of mounting same in high density
Assignee: Mitsubishi Electric Corp
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Filing: 1992-07-01
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Granted: 1994-05-17
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Expires: 2012-07-01
Abstract
Abstract A semiconductor memory control device includes a flexible circuit board having a plurality of panels and folded so that the panels are stacked on one another, a plurality of semiconductor elements mounted on the flexible circuit board, and a package enclosing the flexible circuit board and the plurality of semiconductor elements. A method of mounting semiconductor memory control devices in high density includes mounting a plurality of semiconductor elements on a flexible circuit board, forming an internally mounted module by folding the flexible circuit board in panels that are stacked in multiple layers, and enclosing the internally mounted module in a package.
Inventors
- 👤 Masatoshi Kimura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 17:27
CPC Classifications
H; H05; H05K; H05K5/00; H05K5/02; H05K5/0256; H05K5/026; H05K1/00; H05K1/18; H05K1/189; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/67; H10W70/688; H10W90/00; H05K1/02; H05K1/11; H05K1/117; H05K1/118; H05K2201/00; H05K2201/04; H05K2201/042; H05K2201/07; H05K2201/0707; H05K2201/0715; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09445; H05K2201/10; H05K2201/10007; H05K2201/10159; H05K2201/10189; H05K2201/10613; H05K2201/10621; H05K2201/10689
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
64 words
A semiconductor memory control device comprising: a flexible circuit board folded to form layers of panels stacked relative to one another; a plurality of semiconductor elements mounted on the flexible circuit board; and a package body enclosing the flexible circuit board and the plurality of semiconductor elements and including a sheathing frame having grooves engaging edges of the panels of the flexible circuit board.
Claim 2
Dependent Claim
64 words
A semiconductor memory control device comprising: a flexible circuit board folded to form layers of panels stacked relative to one another; a plurality of semiconductor elements mounted on the flexible circuit board; and a package body enclosing the flexible circuit board and the plurality of semiconductor elements and including a sheathing frame having grooves engaging edges of the panels of the flexible circuit board.
Claim 3
Dependent Claim
31 words
The semiconductor memory control device according to claim 1 comprising a connector connected to portions of the flexible circuit board, the plurality of semiconductor elements being electrically connected to the connector.
Claim 4
Dependent Claim
17 words
The semiconductor memory control device according to claim 2 wherein the connector includes two rows of electrodes.
Claim 5
Dependent Claim
17 words
The semiconductor memory control device according to claim 2 wherein the connector includes four rows of electrodes.
Claim 6
Dependent Claim
24 words
The semiconductor memory control device according to claim 1 wherein each of the panels of the flexible circuit board has substantially the same size.
Claim 7
Dependent Claim
39 words
The semiconductor memory control device according to claim 1 wherein each of the panels of the flexible circuit board is rectangular, and each of the panels is connected to another panel along short sides of the respective rectangular panels.
Claim 8
Dependent Claim
40 words
The semiconductor memory control device according to claim 1 wherein each of the panels of the flexible circuit board is rectangular, and at least one panel is connected to an adjacent panel along long sides of the respective rectangular panels.
Claim 9
Dependent Claim
67 words
A semiconductor memory control device comprising: a flexible circuit board folded to form layers of panels stacked relative to one another wherein an outermost panel of the folded flexible circuit board is free of semiconductor elements and is a ground plane; a plurality of semiconductor elements mounted on the flexible circuit board; and a package body enclosing the flexible circuit board and the plurality of semiconductor elements.
Claim 10
Dependent Claim
67 words
A semiconductor memory control device comprising: a flexible circuit board folded to form layers of panels stacked relative to one another wherein an outermost panel of the folded flexible circuit board is free of semiconductor elements and is a ground plane; a plurality of semiconductor elements mounted on the flexible circuit board; and a package body enclosing the flexible circuit board and the plurality of semiconductor elements.
Claim 11
Dependent Claim
46 words
The semiconductor memory control device according to claim 8 wherein the package comprises a sheathing frame including grooves engaging edges of the panels of the flexible circuit board having a plurality of semiconductor elements mounted thereon and obverse and reverse panels mounted on the sheathing frame.
Claim 12
Dependent Claim
31 words
The semiconductor memory control device according to claim 8 comprising a connector connected to portions of the flexible circuit board, the plurality of semiconductor elements being electrically connected to the connector.
Claim 13
Dependent Claim
24 words
The semiconductor memory control device according to claim 4 wherein each of the panels of the flexible circuit board has substantially the same size.
Claim 14
Dependent Claim
39 words
The semiconductor memory control device according to claim 8 wherein each of the panels of the flexible circuit board is rectangular, and each of the panels is connected to another panel along short sides of the respective rectangular panels.
Claim 15
Dependent Claim
40 words
The semiconductor memory control device according to claim 8 wherein each of the panels of the flexible circuit board is rectangular, and at least one panel is connected to an adjacent panel along long sides of the respective rectangular panels.
Claim 16
Dependent Claim
94 words
A semiconductor memory control device comprising: a flexible circuit board folded to form layers of panels stacked relative to one another wherein at least one panel of the flexible circuit board is free of semiconductor elements and is a shield disposed between two other panels of the flexible circuit board on which semiconductor elements are mounted for shielding the semiconductor elements on the two panels from each other; a plurality of semiconductor elements mounted on the flexible circuit board; and a package body enclosing the flexible circuit board and the plurality of semiconductor elements.
Claim 17
Dependent Claim
94 words
A semiconductor memory control device comprising: a flexible circuit board folded to form layers of panels stacked relative to one another wherein at least one panel of the flexible circuit board is free of semiconductor elements and is a shield disposed between two other panels of the flexible circuit board on which semiconductor elements are mounted for shielding the semiconductor elements on the two panels from each other; a plurality of semiconductor elements mounted on the flexible circuit board; and a package body enclosing the flexible circuit board and the plurality of semiconductor elements.
Claim 18
Dependent Claim
31 words
The semiconductor memory control device according to claim 14 comprising a connector connected to portions of the flexible circuit board, the plurality of semiconductor elements being electrically connected to the connector.
Claim 19
Dependent Claim
24 words
The semiconductor memory control device according to claim 14 wherein each of the panels of the flexible circuit board has substantially the same size.
Claim 20
Dependent Claim
46 words
The semiconductor memory control device according to claim 14 wherein the packaged comprises a sheathing frame including grooves engaging edges of the panels of the flexible circuit board having a plurality of semiconductor elements mounted thereon and obverse and reverse panels mounted on the sheathing frame.
Claim 21
Dependent Claim
39 words
The semiconductor memory control device according to claim 14 wherein each of the panels of the flexible circuit board si rectangular, and each of the panels is connected to another panel along short sides of the respective rectangular panels.
Claim 22
Dependent Claim
40 words
The semiconductor memory control device according to claim 14 wherein each of the panels of the flexible circuit board is rectangular, and at least one panel is connected to an adjacent panel along long sides of the respective rectangular panels.
Claim 23
Independent Claim
82 words
A method of mounting semiconductor memory control devices in high density comprising: mounting a plurality of semiconductor elements on a flexible circuit board including a plurality of panels; forming an internally mounted module by folding the flexible circuit board to form multiple panels stacked relative to one another; and enclosing the internally mounted module in a package comprising a sheathing frame having grooves including inserting edges of the flexible circuit board having a plurality of semiconductor elements mounted thereon in the grooves.
Claim 24
Independent Claim
82 words
A method of mounting semiconductor memory control devices in high density comprising: mounting a plurality of semiconductor elements on a flexible circuit board including a plurality of panels; forming an internally mounted module by folding the flexible circuit board to form multiple panels stacked relative to one another; and enclosing the internally mounted module in a package comprising a sheathing frame having grooves including inserting edges of the flexible circuit board having a plurality of semiconductor elements mounted thereon in the grooves.
Claim 25
Dependent Claim
25 words
The mounting method according to claim 20 wherein the flexible circuit board is folded so that all of the panels have substantially the same size.
Claim 26
Dependent Claim
20 words
The mounting method according to claim 20 wherein an outermost panel of the flexible circuit board is a ground plane.
Claim 27
Dependent Claim
24 words
The mounting method according to claim 20 wherein shield layers for shielding semiconductor elements are formed on some panels of the flexible circuit board.
Claim 28
Dependent Claim
56 words
The mounting method according to claim 20 wherein the flexible circuit board includes a plurality of rectangular panels and at least one panel is connected to an adjacent panel along long sides of the respective rectangular panels including folding the flexible circuit board along the long sides of the rectangular panels connected along those long sides.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-05-16 | 1997-11-15 | 1998-05-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-05-16 | 2001-11-15 | 2002-05-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-05-16 | 2005-11-15 | 2006-05-17 | $7700.00 | Window Closed / Lapsed |