Patent US2528741A successfully refreshed from Google Patents.
US6538211B2
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Multi-layer circuits and methods of manufacture thereof
Assignee: World Properties Inc
•
Filing: 2001-12-13
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Granted: 2003-03-25
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Expires: 2021-12-13
Abstract
Abstract A multi-layer circuit comprises a circuit and a resin covered conductive layer disposed on the circuit, wherein the resin covered conductive layer comprises a liquid crystalline polymer resin laminated to a conductive layer. Such multi-layer circuits are particularly useful for high density circuit applications.
Inventors
- 👤 Michael E. St. Lawrence
- 👤 Scott D. Kennedy
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 03:15
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4652; H05K3/4655; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0141; H05K2201/0183; H05K2201/0195; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0358; Y; Y10; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/24942; Y10T428/2495
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
69 words
A multi-layer circuit comprising a first circuit comprising a first conductive circuit layer disposed on a dielectric layer; and a resin covered conductive layer disposed on the first circuit, wherein the resin covered conductive layer comprises a liquid crystalline polymer layer laminated to a conductive layer, and wherein the liquid crystalline polymer layer is disposed on a side of the first conductive circuit layer opposite to the dielectric layer.
Claim 2
Dependent Claim
69 words
A multi-layer circuit comprising a first circuit comprising a first conductive circuit layer disposed on a dielectric layer; and a resin covered conductive layer disposed on the first circuit, wherein the resin covered conductive layer comprises a liquid crystalline polymer layer laminated to a conductive layer, and wherein the liquid crystalline polymer layer is disposed on a side of the first conductive circuit layer opposite to the dielectric layer.
Claim 3
Dependent Claim
41 words
The multi-layer circuit of claim 1 , wherein the conductive layer is a metal selected from the group consisting of copper, aluminum iron, nickel, stainless steel, silver, zinc, manganese, and alloys and mixtures comprising at least one of the foregoing metals.
Claim 4
Dependent Claim
13 words
The multi-layer circuit of claim 2 , wherein the conductive layer is copper.
Claim 5
Dependent Claim
22 words
The multi-layer circuit of claim 1 , wherein the conductive layer has a thickness of about 9 micrometers to about 70 micrometers.
Claim 6
Dependent Claim
22 words
The multi-layer circuit of claim 4 , wherein the conductive layer has a thickness of about 9 micrometers to about 36 micrometers.
Claim 7
Dependent Claim
24 words
The multi-layer circuit of claim 1 , wherein the liquid crystalline polymer layer has a thickness of about 25 micrometers to about 150 micrometers.
Claim 8
Dependent Claim
19 words
The multi-layer circuit of claim 1 , wherein the liquid crystalline polymer comprises a copolymer of hydroxy benzoate/hydroxy napthoate.
Claim 9
Dependent Claim
26 words
The multi-layer circuit of claim 1 , wherein the liquid crystalline polymer layer has substantially the same X-Y coefficient of thermal expansion as the conductive layer.
Claim 10
Dependent Claim
15 words
The multi-layer circuit of claim 1 , wherein the first circuit is a flexible circuit.
Claim 11
Dependent Claim
47 words
The multi-layer circuit of claim 1 , wherein the first circuit further comprises a second conductive layer disposed on a side of the dielectric layer opposite to the first conductive circuit layer, wherein the second conductive layer may be etched to form a second conductive circuit layer.
Claim 12
Dependent Claim
23 words
The multi-layer circuit of claim 10 , further comprising a second circuit adhered to the first circuit by an adhesive or bond ply.
Claim 13
Dependent Claim
40 words
The multi-layer circuit of claim 11 , further comprising an additional resin covered conductive layer disposed on the second circuit, wherein the additional resin covered conductive layer comprises a second liquid crystalline polymer layer laminated to a third conductive layer.
Claim 14
Dependent Claim
20 words
The multi-layer circuit of claim 12 , wherein the second liquid crystalline polymer layer is disposed on the second circuit.
Claim 15
Dependent Claim
45 words
The multi-layer circuit of claim 11 , wherein the second circuit comprises a second dielectric layer disposed between a third conductive circuit layer and a third conductive layer, wherein the third conductive layer may comprise a fourth conductive circuit layer or a ground plane layer.
Claim 16
Dependent Claim
40 words
The multi-layer circuit of claim 14 , further comprising an additional resin covered conductive layer disposed on the second circuit, wherein the additional resin covered conductive layer comprises a second liquid crystalline polymer layer laminated to a fourth conductive layer.
Claim 17
Dependent Claim
20 words
The multi-layer circuit of claim 15 , wherein the second liquid crystalline polymer layer is disposed on the second circuit.
Claim 18
Dependent Claim
177 words
A multi-layer circuit comprising a first circuit having a first side and a second side, the first circuit comprising a first conductive circuit layer disposed on a dielectric layer, and a second conductive circuit layer or a ground plane layer disposed on a side of the dielectric layer opposite the first conductive circuit layer; a first resin covered conductive layer disposed on the first side of the first circuit, wherein the first resin covered conductive layer comprises a first liquid crystalline polymer layer laminated to a first conductive layer, and wherein the first liquid crystalline polymer layer is disposed on a side of the first conductive circuit layer opposite to the dielectric layer; and a second resin covered conductive layer disposed on the second side of the first circuit, wherein the second resin covered conductive layer comprises a second liquid crystalline polymer layer laminated to a second conductive layer, and wherein the second liquid crystalline polymer layer is disposed on a side of the second conductive circuit layer or ground plane layer opposite to the dielectric layer.
Claim 19
Dependent Claim
177 words
A multi-layer circuit comprising a first circuit having a first side and a second side, the first circuit comprising a first conductive circuit layer disposed on a dielectric layer, and a second conductive circuit layer or a ground plane layer disposed on a side of the dielectric layer opposite the first conductive circuit layer; a first resin covered conductive layer disposed on the first side of the first circuit, wherein the first resin covered conductive layer comprises a first liquid crystalline polymer layer laminated to a first conductive layer, and wherein the first liquid crystalline polymer layer is disposed on a side of the first conductive circuit layer opposite to the dielectric layer; and a second resin covered conductive layer disposed on the second side of the first circuit, wherein the second resin covered conductive layer comprises a second liquid crystalline polymer layer laminated to a second conductive layer, and wherein the second liquid crystalline polymer layer is disposed on a side of the second conductive circuit layer or ground plane layer opposite to the dielectric layer.
Claim 20
Dependent Claim
53 words
A multi-layer circuit comprising a first circuit comprising a conductive circuit layer and a dielectric layer; and a resin covered conductive layer comprising: a second liquid crystalline polymer layer disposed between a conductive layer and a first liquid crystalline polymer layer; wherein the resin covered conductive layer is disposed on the first circuit.
Claim 21
Dependent Claim
53 words
A multi-layer circuit comprising a first circuit comprising a conductive circuit layer and a dielectric layer; and a resin covered conductive layer comprising: a second liquid crystalline polymer layer disposed between a conductive layer and a first liquid crystalline polymer layer; wherein the resin covered conductive layer is disposed on the first circuit.
Claim 22
Dependent Claim
32 words
The multi-layer circuit of claim 18 , wherein the first circuit further comprises a second conductive circuit layer disposed on a side of the dielectric layer opposite to the conductive circuit layer.
Claim 23
Dependent Claim
25 words
The multi-layer circuit of claim 18 , wherein the second liquid crystalline polymer layer has a melt temperature higher than the first crystalline polymer layer.
Claim 24
Dependent Claim
21 words
The multi-layer circuit of claim 18 , wherein the first liquid crystalline polymer layer is adhered to the conductive circuit layer.
Claim 25
Dependent Claim
69 words
A multi-layer circuit comprising a first circuit comprising a first conductive circuit layer disposed on a dielectric layer; and a resin covered conductive layer disposed on the circuit, wherein the resin covered conductive layer comprises a first liquid crystalline polymer layer laminated to a conductive layer and the first liquid crystalline polymer layer is adhered to a side of the dielectric layer opposite to the first conductive circuit layer.
Claim 26
Dependent Claim
69 words
A multi-layer circuit comprising a first circuit comprising a first conductive circuit layer disposed on a dielectric layer; and a resin covered conductive layer disposed on the circuit, wherein the resin covered conductive layer comprises a first liquid crystalline polymer layer laminated to a conductive layer and the first liquid crystalline polymer layer is adhered to a side of the dielectric layer opposite to the first conductive circuit layer.
Claim 27
Dependent Claim
90 words
A multi-layer circuit comprising a first circuit comprising a conductive circuit layer disposed on a dielectric layer; a first resin covered conductive layer comprising a first liquid crystalline polymer layer laminated to a first conductive layer; and a second resin covered conductive layer comprising a second liquid crystalline polymer layer laminated to a second conductive layer; wherein the first liquid crystalline polymer layer is disposed on a first side of the first circuit and the second liquid crystalline polymer layer is disposed on a second side of the first circuit.
Claim 28
Dependent Claim
90 words
A multi-layer circuit comprising a first circuit comprising a conductive circuit layer disposed on a dielectric layer; a first resin covered conductive layer comprising a first liquid crystalline polymer layer laminated to a first conductive layer; and a second resin covered conductive layer comprising a second liquid crystalline polymer layer laminated to a second conductive layer; wherein the first liquid crystalline polymer layer is disposed on a first side of the first circuit and the second liquid crystalline polymer layer is disposed on a second side of the first circuit.
Claim 29
Dependent Claim
26 words
The multi-layer circuit of claim 23 , wherein the first liquid crystalline polymer layer and the second liquid crystalline polymer layer comprise different liquid crystalline polymers.
Claim 30
Dependent Claim
27 words
The mulit-layer circuit of claim 23 , wherein the first liquid crystalline polymer layer and the second liquid crystalline polymer layer comprise the same liquid crystalline polymer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-03-24 | 2006-09-23 | 2007-03-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-03-24 | 2010-09-23 | 2011-03-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-03-24 | 2014-09-23 | 2015-03-25 | $7700.00 | Window Closed / Lapsed |