US5544773A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method
Assignee: TOAGOUSEI Co Ltd
•
Filing: 1994-06-02
•
Granted: 1996-08-13
•
Expires: 2014-06-02
Abstract
Abstract Provided is a method for making a multilayer printed circuit board having blind holes which comprises heat laminating a copper foil and an inner layer panel previously provided with circuit patterns on one or both sides thereof by processing a copper-clad laminate, a resin layer soluble in an aqueous alkali solution and having a flowability upon heating being present between said copper foil and said inner layer panel, forming via holes in the surface copper foil by etching and then dissolving the resin layer under said via holes with an aqueous alkali solution and removing the resin layer, thereby to form blind holes in which the copper foil on the inner layer panel is exposed. Further provided is a copper foil used for making multilayer printed circuit boards, which is provided with a resin layer soluble in an aqueous alkali solution and having flowability upon heating on its roughened surface.
Inventors
- 👤 Youichi Haruta
- 👤 Tomio Kambayashi
- 👤 Hitoshi Kato
- 👤 Hiromu Taguchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 16:15
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4652; H05K3/4655; H05K3/0011; H05K3/0017; H05K3/002; H05K2201/00; H05K2201/01; H05K2201/0183; H05K2201/0195; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/0358; H05K2201/0364; H05K2201/0376; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09509; H05K2203/00; H05K2203/07; H05K2203/0779; H05K2203/0786; H05K2203/0793; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H05K3/42; H05K3/425; H05K3/427; H05K3/4673; H05K3/4676
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
138 words
A method for making a multilayer printed circuit board having blind holes, which comprises laminating a copper foil and an inner layer panel together by means of an uncured resin layer under heating, said inner panel being a copper-clad laminate having circuit patterns on one or both sides thereof, said resin layer being soluble in an aqueous alkali solution and having a flowability upon heating; forming via holes in the surface of the copper foil by etching; and then dissolving and removing the resin layer under said via holes with an aqueous alkali solution thereby selectively removing the resin and forming blind holes in which the copper foil of the inner layer panel is exposed and thereafter curing the remaining resin layer; and electrically interconnecting the copper foil through the blind holes by conductive plating or conductive paste.
Claim 2
Independent Claim
138 words
A method for making a multilayer printed circuit board having blind holes, which comprises laminating a copper foil and an inner layer panel together by means of an uncured resin layer under heating, said inner panel being a copper-clad laminate having circuit patterns on one or both sides thereof, said resin layer being soluble in an aqueous alkali solution and having a flowability upon heating; forming via holes in the surface of the copper foil by etching; and then dissolving and removing the resin layer under said via holes with an aqueous alkali solution thereby selectively removing the resin and forming blind holes in which the copper foil of the inner layer panel is exposed and thereafter curing the remaining resin layer; and electrically interconnecting the copper foil through the blind holes by conductive plating or conductive paste.
Claim 3
Dependent Claim
36 words
A method according to claim 1, wherein said copper foil has a roughened surface, said roughened surface being coated with the said resin layer which is soluble in an aqueous solution and has flowability upon heating.
Claim 4
Dependent Claim
33 words
A method according to claim 1, wherein after the blind holes in which the copper surface of the inner layer panel is exposed are formed, the blind holes are further washed with acid.
Claim 5
Dependent Claim
36 words
A method according to claim 1, wherein the resin layer soluble in an aqueous alkali solution and having flowability upon heating comprises a resin mainly composed of a novolak epoxy acrylate or methacrylate having carboxyl group.
Claim 6
Dependent Claim
50 words
A method according to claim 1, wherein the resin layer soluble in an aqueous alkali solution and having flowability upon heating has a two-layer structure comprising a first resin layer having low flowability upon heating and a second resin layer having high flowability upon heating compared to the first layer.
Claim 7
Dependent Claim
57 words
A method according to claim 1, wherein the resin layer soluble in an aqueous alkali solution and having flowability upon heating comprises 100 parts by weight of a novolak type epoxy acrylate or methacrylate having carboxyl group, 20 to 200 parts by weight of a filler and 1 to 10 parts by weight of a curing agent.
Claim 8
Dependent Claim
84 words
A method according to claim 1, wherein the resin layer soluble in an aqueous alkali solution and having flowability upon heating comprises 100 parts by weight of a novolak epoxy acrylate or methacrylate having carboxyl group, 0.5 to 10 parts by weight of an active energy ray curing reaction initiator, 0.5 to 10 parts by weight of an active energy ray curing reaction sensitizer, 20 to 200 parts by weight of a filler and 1 to 10 parts by weight of a curing agent.
Claim 9
Dependent Claim
20 words
A method according to claim 6 or 7, which additionally comprises 20 to 120 parts by weight of urethane acrylate.
Claim 10
Dependent Claim
22 words
A method according to claim 6 or 7, which additionally comprises 20 to 60 parts by weight of a brominated carbonate oligomer.
References Cited (Backward Citations)
JPS59213196A
Cited
US4597988A
Cited
US4501689A
Cited
US5009982B1
Cited
US5009982A
Cited
US4601783A
Cited
US4915983A
Cited
US4722959A
Cited
US4642160A
Cited
US4988605A
Cited
US4775444A
Cited
JPH03160784A
Cited
US4978422A
Cited
US5347712A
Cited
US5017271A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-08-13 | 2000-02-12 | 2000-08-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-08-13 | 2004-02-12 | 2004-08-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-08-13 | 2008-02-12 | 2008-08-13 | $7700.00 | Window Closed / Lapsed |