US4601783A
Expired / Lapsed
US
⏱️ 0.0 years remaining
High concentration sodium permanganate etch batch and its use in desmearing and/or etching printed circuit boards
Assignee: MacDermid Acumen Inc
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Filing: 1985-05-31
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Granted: 1986-07-22
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Expires: 2005-05-31
Abstract
Abstract Aqueous, alkaline, liquid solutions consisting essentially of NaMnO4 and NaOH provide high etch rates for, e.g., printed circuit boards. The solutions can be used to desmear and etchback, and produce manganese residues on the surface of the board which are readily removed by acid neutralization alone.
Inventors
- 👤 Gerald Krulik
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 23:46
CPC Classifications
C; C09; C09K; C09K13/00; H; H05; H05K; H05K3/00; H05K3/0011; H05K3/0017; H05K3/002; C08; C08J; C08J7/00; C08J7/12; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/22; C23G; C23G1/00; C23G1/14; H05K3/0055; H05K2203/00; H05K2203/07; H05K2203/0779; H05K2203/0786; H05K2203/0793; H05K2203/0796
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
50 words
An aqueous, alkaline, liquid solution consisting essentially of water, at least about 75 grams/liter of NaMnO 4 and NaOH in an amount sufficient so that the removal of substantially all of the manganese residues from the surface of a material contacted with said solution can be accomplished by acid neutralization.
Claim 2
Dependent Claim
50 words
An aqueous, alkaline, liquid solution consisting essentially of water, at least about 75 grams/liter of NaMnO 4 and NaOH in an amount sufficient so that the removal of substantially all of the manganese residues from the surface of a material contacted with said solution can be accomplished by acid neutralization.
Claim 3
Dependent Claim
19 words
A solution according to claim 1 which contains from about 75 g/l to about 400 g/l NaMnO 4 .
Claim 4
Dependent Claim
19 words
A solution according to claim 2 which contains from about 100 g/l to about 200 g/l NaMnO 4 .
Claim 5
Dependent Claim
14 words
A solution according to claim 3 which contains about 160 g/l NaMnO 4 .
Claim 6
Dependent Claim
14 words
A solution according to claim 1 which contains at least about 40 g/l NaOH.
Claim 7
Dependent Claim
17 words
A solution according to claim 5 which contains from about 40 g/l to about 400 g/l NaOH.
Claim 8
Dependent Claim
17 words
A solution according to claim 6 which contains from about 40 g/l to about 150 g/l NaOH.
Claim 9
Dependent Claim
12 words
A solution according to claim 7 which contains about 60 g/l NaOH.
Claim 10
Dependent Claim
30 words
A solution according to claim 1 which contains from about 100 g/l to about 200 g/l of NaMnO 4 , and from about 40 g/l to about 160 g/l NaOH.
Claim 11
Dependent Claim
18 words
A solution according to claim 1 which contains about 160 g/l NaMnO 4 and about 60 g/l NaOH.
Claim 12
Dependent Claim
66 words
A process for preparing a resinous substrate for subsequent metallization which comprises contacting said substrate with an aqueous, alkaline liquid solution consisting essentially of water, at least about 75 g/l of NaMnO 4 and NaOH in an amount sufficient so that the removal of substantially all of the manganese residues from the surface of a material contacted with said solution can be accomplished by acid neutralization.
Claim 13
Dependent Claim
66 words
A process for preparing a resinous substrate for subsequent metallization which comprises contacting said substrate with an aqueous, alkaline liquid solution consisting essentially of water, at least about 75 g/l of NaMnO 4 and NaOH in an amount sufficient so that the removal of substantially all of the manganese residues from the surface of a material contacted with said solution can be accomplished by acid neutralization.
Claim 14
Dependent Claim
74 words
An improved process for desmearing resin from the inside walls of holes formed in resinous substrates wherein the improvement comprises contacting the substrate with an aqueous, alkaline liquid solution consisting essentially of water, at least about 75 g/l of NaMnO 4 and NaOH in an amount sufficient so that the removal of substantially all of the manganese residues from the surface of a material contacted with said solution can be accomplished by acid neutralization.
Claim 15
Dependent Claim
74 words
An improved process for desmearing resin from the inside walls of holes formed in resinous substrates wherein the improvement comprises contacting the substrate with an aqueous, alkaline liquid solution consisting essentially of water, at least about 75 g/l of NaMnO 4 and NaOH in an amount sufficient so that the removal of substantially all of the manganese residues from the surface of a material contacted with said solution can be accomplished by acid neutralization.
Claim 16
Dependent Claim
69 words
An improved hole cleaning process for multilayer circuit boards wherein the improvement comprises contacting the multilayer circuit board with an aqueous, alkaline liquid solution consisting essentially of water, at least about 75 g/l of NaMnO 4 and NaOH in an amount sufficient so that the removal of substantially all of the manganese residues from the surface of a material contacted with said solution can be accomplished by acid neutralization.
Claim 17
Dependent Claim
69 words
An improved hole cleaning process for multilayer circuit boards wherein the improvement comprises contacting the multilayer circuit board with an aqueous, alkaline liquid solution consisting essentially of water, at least about 75 g/l of NaMnO 4 and NaOH in an amount sufficient so that the removal of substantially all of the manganese residues from the surface of a material contacted with said solution can be accomplished by acid neutralization.
Claim 18
Dependent Claim
68 words
A process for etching back the surface of a circuit board which comprises contacting the circuit board with an aqueous, alkaline liquid solution consisting essentially of water, at least about 75 g/l of NaMnO 4 and NaOH in an amount sufficient so that the removal of substantially all of the manganese residues from the surface of a material contacted with said solution can be accomplished by acid neutralization.
Claim 19
Dependent Claim
68 words
A process for etching back the surface of a circuit board which comprises contacting the circuit board with an aqueous, alkaline liquid solution consisting essentially of water, at least about 75 g/l of NaMnO 4 and NaOH in an amount sufficient so that the removal of substantially all of the manganese residues from the surface of a material contacted with said solution can be accomplished by acid neutralization.
References Cited (Backward Citations)
US1969678A
Cited
US2908557A
Cited
US3293148A
Cited
US3489625A
Cited
US3457107A
Cited
US3625758A
Cited
US3425947A
Cited
US3506397A
Cited
US3598630A
Cited
US3647699A
Cited
US3652351A
Cited
US3689303A
Cited
US3833414A
Cited
US4042729A
Cited
GB1479556A
Cited
US4054693A
Cited
US4073740A
Cited
US4294651A
Cited
US4430154A
Cited
US4425380A
Cited
EP0109920A2
Cited
GB2134140A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-07-21 | 1990-01-20 | 1990-07-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-07-21 | 1994-01-20 | 1994-07-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-07-21 | 1998-01-20 | 1998-07-22 | $7700.00 | Window Closed / Lapsed |