Method for improving insulation resistance of printed circuits

Claim 2

In a process for fabricating a printed circuit, wherein a printed circuit board composed of an insulating substrate material having a thin metal foil layer adhered to at least one planar surface thereof is selectively etched to produce a printed circuit having a predetermined pattern of conductive areas and insulating areas composed of said insulating substrate material, the improvement comprising contacting said insulating areas, after said etching, with an alkaline permanganate aqueous solution for a time and at conditions effective to remove from said insulating areas a sufficient quantity of metal species associated therewith so as to improve the electrical resistance afforded by said insulating areas in the printed circuit, and thereafter neutralizing residual manganese species on said printed circuit.

Claim 3

The process according to claim 1 wherein said thin metal foil layer is comprised of copper.

Claim 4

The process according to claim 2 wherein said insulating substrate material is comprised of an epoxy resin.

Claim 5

The process according to claim 3 wherein said insulating substrate material is comprised of glass-reinforced epoxy resin.

Claim 6

The process according to any of claims 1 to 4 wherein said alkaline permanganate aqueous solution contains from about 20 to about 150 g/l of permanganate and has a pH of from about 8 to about 13.

Claim 7

The process according to any of claims 1 to 4 wherein said neutralizing of residual manganese species comprises contacting with a reducing agent the areas of the printed circuit contacted with said alkaline permanganate aqueous solution.

Claim 8

The process according to any of claims 1 to 4 wherein said contacting of said insulating areas with an alkaline permanganate aqueous solution comprises immersion of the printed circuit in said alkaline permanganate aqueous solution.

Claim 9

The process according to any of claims 1 to 4 wherein said selective etching removes from said board said metal foil layer and electroless metal built up thereon in the fabrication of the printed circuit.

Claim 10

The process according to any of claims 1 to 4 wherein said conductive areas of said printed circuit comprise an outer-facing layer of tin-lead, and wherein said contacting of non-conductive areas with said alkaline permanganate aqueous solution after etching is carried out after reflow and fusing of said tin-lead layer.

Claim 11

In a process for fabricating a printed circuit, wherein a planar printed circuit board composed of an epoxy resin insulating substrate material having a thin layer of copper foil adhered to at least one planar surface thereof is selectively etched to selectively expose surface areas of said epoxy resin insulating substrate material to act as insulating areas on said printed circuit, the improvement comprising contacting said exposed surface areas of said epoxy resin insulating substrate material, after said etching, with an alkaline permanganate aqueous solution having a pH of at least about 8 and from about 20 to about 150 g/l of permanganate, for a time and at conditions effective to remove from said exposed surface areas of epoxy resin insulating substrate material a sufficient quantity of metal species associated therewith so as to improve the electrical resistance afforded by said insulating areas in the printed circuit, and thereafter neutralizing residual manganese species on said printed circuit.

Claim 12

In a process for fabricating a printed circuit, wherein a planar printed circuit board composed of an epoxy resin insulating substrate material having a thin layer of copper foil adhered to at least one planar surface thereof is selectively etched to selectively expose surface areas of said epoxy resin insulating substrate material to act as insulating areas on said printed circuit, the improvement comprising contacting said exposed surface areas of said epoxy resin insulating substrate material, after said etching, with an alkaline permanganate aqueous solution having a pH of at least about 8 and from about 20 to about 150 g/l of permanganate, for a time and at conditions effective to remove from said exposed surface areas of epoxy resin insulating substrate material a sufficient quantity of metal species associated therewith so as to improve the electrical resistance afforded by said insulating areas in the printed circuit, and thereafter neutralizing residual manganese species on said printed circuit.