Method for producing liquid crystalline polymer microspheres
Abstract
Abstract Translated from Japanese (57)【要約】 【構成】 自己配向性を有する液晶高分子と溶媒に可溶 な非液晶性高分子とを重量比30:70ないし10:9 0の範囲で混合したのち、液晶性高分子及び非液晶性高 分子の融解温度以上でかつ液晶性高分子が液晶状態を維 持しうる温度に加熱して押出成形し、次いで非液晶性高 分子を溶媒で溶解除去することにより、平均粒子径0. 5〜10μmをもつ液晶性高分子微小球状体を製造す る。 【効果】 上記球状体は、融液状態で液晶を形成し、液 晶ドメイン内で分子鎖が配列した液晶構造から固化する ことで、規則性があり、表面が平滑な固体構造を示す新 規なものであって、耐熱性や耐薬品性や耐溶剤性に優れ ているので、粉末成形用原料、焼結成形用原料、熱可塑 性高分子材料及び熱硬化性高分子材料の充てん材、耐熱 性塗料やエナメル、接着剤の充てん材などに有用であ る。 (57) [Summary] [Structure] A liquid crystal polymer having self-alignment property and a non-liquid crystal polymer soluble in a solvent are contained in a weight ratio of 30:70 to 10: 9. After mixing in the range of 0, the mixture is extruded by heating to a temperature above the melting temperature of the liquid crystalline polymer and the non-liquid crystalline polymer and at a temperature at which the liquid crystalline polymer can maintain the liquid crystal state, and then the non-liquid crystalline polymer. Are dissolved and removed with a solvent to give an average particle diameter of 0. A liquid crystalline polymer microsphere having 5 to 10 μm is produced. [Effect] The spherical body is a novel one that has a regular structure and a solid structure with a smooth surface by forming a liquid crystal in a melt state and solidifying from a liquid crystal structure in which molecular chains are arranged in a liquid crystal domain. However, since it has excellent heat resistance, chemical resistance, and solvent resistance, it is a powder molding raw material, a sintering molding raw material, a filler of a thermoplastic polymer material and a thermosetting polymer material, and a heat resistant coating. It is also useful as a filling material for enamel and adhesives.
Inventors
- 👤 Michiyuki Kiyoutani
- 👤 陸征 京谷
- 👤 Akira Kaido
- 👤 彰 海藤
- 👤 Kazuo Nakayama
- 👤 和郎 中山
Bibliographic Details
Claims Analysis
Total Claims: 0References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.