EP1044800A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Metal laminate for a circuit board
Assignee: Kuraray Co Ltd
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Filing: 2000-03-27
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Granted: —
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Expires: 2020-03-27
Abstract
Abstract A method of producing a metal laminate for a circuit board includes a first step of press-bonding a thermotropic liquid crystal polymer film 1 having a segment orientation ratio SOR within a range not smaller than 0.90 and smaller than 1.15 along the longitudinal direction of the film, to a metal sheet 3 between hot rolls while the thermotropic liquid crystal polymer film 1 is in a tense or non-tense state; and a second step of heating the laminate obtained in the first step to a temperature not lower than the melting point of the thermotropic liquid crystal polymer film.
Inventors
- 👤 Minoru Onodera
- 👤 Tadao Yoshikawa
- 👤 Takeichi Tsudaka
- 👤 Toshiaki Sato
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-01 10:07
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; B; B32; B32B; B32B37/00; B32B37/14; B32B37/16; B32B37/20; B32B37/203; B32B15/00; B32B15/04; B32B15/08; B32B38/00; B32B38/0036; H05K3/02; H05K3/022; B32B2305/00; B32B2305/55; B32B2309/00; B32B2309/02; B32B2309/04; B32B2309/08; B32B2309/10; B32B2309/105; B32B2310/00; B32B2310/04; B32B2310/0445; B32B2311/00; B32B2457/00; B32B2457/08; B32B38/18; B32B38/1875; B32B38/1883; C; C09; C09K; C09K2323/00; C09K2323/02; C09K2323/06; C09K2323/061
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
139 words
A method of producing a metal laminate for a circuit board, the
metal laminate having a metal sheet bonded to at least one surface of a film
made of a thermotropic polymer capable of forming an optically anisotropic
melt phase (which fun is hereinafter referred to as a thermotropic liquid
crystal polymer film), the method comprising: a first step of press-bonding a thermotropic liquid crystal polymer film
having a segment orientation ratio SOR within a range not smaller than
1.03 and smaller than 1.15 along a longitudinal direction of the film, to said
metal sheet between hot rolls while said thermotropic liquid crystal polymer
film is in a tense state; and a second step of heating the laminate obtained in the first step to a
temperature not lower than a melting point of the thermotropic liquid
crystal polymer film.
Claim 2
Independent Claim
117 words
A method of producing a metal laminate for a circuit board, the
metal laminate having a metal sheet bonded to at least one surface of a
thermotropic liquid crystal polymer film, the method comprising: a first step of press-bonding a thermotropic liquid crystal polymer film
having a segment orientation ratio SOR within a range not smaller than
0.90 and smaller than 1.03 along a longitudinal direction of the film, to said
metal sheet between hot rolls while said thermotropic liquid crystal polymer
film is in a non-tense state; and a second step of heating the laminate obtained in the first step to a
temperature not lower than a melting point of the thermotropic liquid
crystal polymer film.
Claim 3
Dependent Claim
40 words
The method of producing the metal laminate for the circuit board
as claimed in Claim 1, wherein the metal laminate is a single-sided metal
laminate having the metal sheet bonded to one surface of the thermotropic
liquid crystal polymer film.
Claim 4
Dependent Claim
40 words
The method of producing the metal laminate for the circuit board
as claimed in Claim 2, wherein the metal laminate is a single-sided metal
laminate having the metal sheet bonded to one surface of the thermotropic
liquid crystal polymer film.
Claim 5
Dependent Claim
40 words
The method of producing the metal laminate for the circuit board
as claimed in Claim 1, wherein the metal laminate is a double-sided metal
laminate having the metal sheet bonded to both surfaces of the thermotropic
liquid crystal polymer film.
Claim 6
Dependent Claim
40 words
The method of producing the metal laminate for the circuit board
as claimed in Claim 2, wherein the metal laminate is a double-sided metal
laminate having the metal sheet bonded to both surfaces of the thermotropic
liquid crystal polymer film.
Claim 7
Dependent Claim
50 words
The method of producing the metal laminate for the circuit board
as claimed in Claim 3, wherein the thermotropic liquid crystal polymer film
is press-bonded to the metal sheet between a hot metal roll and a
heat-resistant rubber roll whose roll surface has a hardness not smaller
than 80 degrees.
Claim 8
Dependent Claim
50 words
The method of producing the metal laminate for the circuit board
as claimed in Claim 4, wherein the thermotropic liquid crystal polymer film
is press-bonded to the metal sheet between a hot metal roll and a
heat-resistant rubber roll whose roll surface has a hardness not smaller
than 80 degrees.
Claim 9
Dependent Claim
20 words
A metal laminate for a circuit board, obtainable by the method as
claimed in any of Claims 1 to 8.
References Cited (Backward Citations)
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