US6531337B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing a semiconductor structure having stacked semiconductor devices
Assignee: Micron Technology Inc
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Filing: 2000-07-24
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Granted: 2003-03-11
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Expires: 2020-07-24
Abstract
Abstract A semiconductor structure includes flip chips or other semiconductor devices that are mounted on printed circuit boards. The printed circuit boards are stacked to increase the circuit density of the semiconductor structure. The printed circuit boards include cavities or openings to accommodate the flip chips or semiconductor devices and thus reduce the overall size of the semiconductor structure. The flip chips or semiconductor devices from adjacent printed circuit boards may extend into the cavities or openings or simply occupy the cavities or openings from the same printed circuit board.
Inventors
- 👤 Salman Akram
- 👤 Jerry Michael Brooks
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 10:18
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10D; H10D62/00; H10D62/10; H10D62/117; H10W70/688; H10W90/00; H10W90/401; H10W90/701; H10W70/682; H10W70/685; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/60; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/941; H10W72/9415; H10W90/20; H10W90/22; H10W90/291; H10W90/297; H10W90/721; H10W90/724; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
169 words
A method of manufacturing a semiconductor structure comprising the steps of: providing a base substrate having a first surface; forming a first plurality of base substrate bond pads on said first surface of said base substrate; providing a first substrate having a first surface, a second surface, and at least one cavity formed within said first surface of said first substrate; forming a first plurality of first substrate bond pads on said first surface of said first substrate; providing at least one semiconductor device having a plurality of semiconductor device bond pads; coupling at least one of said plurality of semiconductor device bond pads to at least one of said first plurality of base substrate bond pads; positioning said first substrate over said first surface of said base substrate such that said semiconductor device is generally within said at least one cavity; and coupling at least one of said first plurality of first substrate bond pads to at least one of said first plurality of base substrate bond pads.
Claim 2
Independent Claim
169 words
A method of manufacturing a semiconductor structure comprising the steps of: providing a base substrate having a first surface; forming a first plurality of base substrate bond pads on said first surface of said base substrate; providing a first substrate having a first surface, a second surface, and at least one cavity formed within said first surface of said first substrate; forming a first plurality of first substrate bond pads on said first surface of said first substrate; providing at least one semiconductor device having a plurality of semiconductor device bond pads; coupling at least one of said plurality of semiconductor device bond pads to at least one of said first plurality of base substrate bond pads; positioning said first substrate over said first surface of said base substrate such that said semiconductor device is generally within said at least one cavity; and coupling at least one of said first plurality of first substrate bond pads to at least one of said first plurality of base substrate bond pads.
Claim 3
Dependent Claim
69 words
The method of claim 1 , further comprising the steps of: forming a second plurality of first substrate bond pads on said second surface of said first substrate; providing a second semiconductor device having a plurality of second semiconductor device bond pads; and, coupling at least one of said plurality of second semiconductor device bond pads to at least one of said second plurality of first substrate bond pads.
Claim 4
Dependent Claim
82 words
The method of claim 1 , wherein said step of coupling at least one of said plurality of semiconductor device bond pads to at least one of said first plurality of base substrate bond pads comprises the step of electrically and physically coupling said at least one semiconductor device to said base substrate using solder balls to couple at least one of said plurality of semiconductor device bond pads to at least one of said first plurality of base substrate bond pads.
Claim 5
Dependent Claim
80 words
The method of claim 1 , wherein said step of coupling at least one of said first plurality of first substrate bond pads to at least one of said first plurality of base substrate bond pads comprises the step of electrically and physically coupling said first substrate to said base substrate using solder balls to couple at least one of said first plurality of first substrate bond pads at least one of said first plurality of base substrate bond pads.
Claim 6
Independent Claim
87 words
A method of manufacturing a semiconductor structure comprising the steps of: providing a first substrate having at least one opening; forming a plurality of first substrate bond pads on a surface of said first substrate; providing an interconnect device; coupling said interconnect device to said first substrate generally over said at least one opening; providing at least one semiconductor device having a plurality of semiconductor device bond pads; and coupling said at least one semiconductor device to said interconnect device generally over said at least one opening.
Claim 7
Independent Claim
87 words
A method of manufacturing a semiconductor structure comprising the steps of: providing a first substrate having at least one opening; forming a plurality of first substrate bond pads on a surface of said first substrate; providing an interconnect device; coupling said interconnect device to said first substrate generally over said at least one opening; providing at least one semiconductor device having a plurality of semiconductor device bond pads; and coupling said at least one semiconductor device to said interconnect device generally over said at least one opening.
Claim 8
Dependent Claim
73 words
The method of claim 5 , wherein said step of coupling said at least one semiconductor device to said interconnect device generally over said at least one opening comprises the step of electrically and physically coupling said at least one semiconductor device to said interconnect device using solder balls coupling at least one of said plurality of semiconductor device bond pads to at least one of said plurality of first substrate bond pads.
Claim 9
Dependent Claim
14 words
The method of claim 6 , wherein said interconnect device comprises a flex circuit.
Claim 10
Dependent Claim
49 words
The method of claim 5 , wherein said step of coupling said at least one semiconductor device to said interconnect device generally over said at least one opening comprises the step of electrically and physically coupling said at least one semiconductor device to said interconnect device using TAB tape.
Claim 11
Independent Claim
87 words
A method of manufacturing a semiconductor structure comprising the steps of: providing a first substrate having at least one opening; forming a plurality of first substrate bond pads on a surface of said first substrate; providing an interconnect device; coupling said interconnect device to said first substrate generally over said at least one opening; providing at least one semiconductor device having a plurality of semiconductor device bond pads; and coupling said at least one semiconductor device to said interconnect device generally within said at least one opening.
Claim 12
Independent Claim
87 words
A method of manufacturing a semiconductor structure comprising the steps of: providing a first substrate having at least one opening; forming a plurality of first substrate bond pads on a surface of said first substrate; providing an interconnect device; coupling said interconnect device to said first substrate generally over said at least one opening; providing at least one semiconductor device having a plurality of semiconductor device bond pads; and coupling said at least one semiconductor device to said interconnect device generally within said at least one opening.
Claim 13
Dependent Claim
81 words
The method of claim 9 , wherein said interconnect device comprises a plurality of interconnect device contacts, and wherein said step of coupling said interconnect device to said first substrate generally over said at least one opening comprises the step of electrically and physically coupling said interconnect device to said first surface of said first substrate with at least one of said plurality of interconnect device contacts being electrically coupled to at least one said plurality of first substrate bond pads.
Claim 14
Dependent Claim
74 words
The method of claim 10 , wherein said step of coupling said at least one semiconductor device to said interconnect device generally within said at least one opening comprises the step of physically and electrically coupling said at least one semiconductor device to said interconnect device using solder balls coupling at least one of said plurality of first semiconductor device bond pads to at least one of said plurality of first interconnect device contacts.
Claim 15
Dependent Claim
24 words
The method of claim 9 , wherein said interconnect device is physically but not electrically coupled to said first surface of said first substrate.
Claim 16
Dependent Claim
40 words
The method of claim 12 , wherein said step of coupling said interconnect device to said first substrate generally over said at least one opening comprises the step of coupling said interconnect device to another surface of said first substrate.
Claim 17
Dependent Claim
38 words
The method of claim 13 , further comprising the step of electrically coupling at least one said plurality of semiconductor bond pads to at least one of said plurality of first substrate bond pads using a bond wire.
Claim 18
Dependent Claim
99 words
The method of claim 9 , wherein said plurality of semiconductor device bond pads are positioned on a frontside of said first semiconductor device, and wherein said step of coupling said at least one semiconductor device to said interconnect device generally within said at least one opening comprises the step of electrically coupling a backside of said at least one semiconductor device to said first interconnect device, and further comprising the step of electrically coupling at least one said plurality of semiconductor bonds to at least one of said plurality of first substrate bond pads using a bond wire.
Claim 19
Dependent Claim
47 words
A method of manufacturing a semiconductor structure according to claim 5 , wherein said interconnect device is coupled to said substrate generally over said at least one opening by positioning said interconnect device on top of said first substrate and generally over said at least one opening.
Claim 20
Dependent Claim
45 words
A method of manufacturing a semiconductor structure according to claim 5 , wherein said interconnect device is coupled to said substrate generally over said at least one opening by positioning said interconnect device underneath said first substrate and generally over said at least one opening.
Claim 21
Dependent Claim
79 words
A method of manufacturing a semiconductor structure according to claim 5 , further comprising: providing a base substrate having a first surface; forming a first plurality of base substrate bond pads on said first surface of said base substrate; and, coupling at least one of said plurality of first substrate bond pads to at least one of said first plurality of base substrate bond pads such that said interconnect device lies between said semiconductor device and said base substrate.
Claim 22
Dependent Claim
47 words
A method of manufacturing a semiconductor structure according to claim 9 , wherein said interconnect device is coupled to said substrate generally over said at least one opening by positioning said interconnect device on top of said first substrate and generally over said at least one opening.
Claim 23
Dependent Claim
45 words
A method of manufacturing a semiconductor structure according to claim 9 , wherein said interconnect device is coupled to said substrate generally over said at least one opening by positioning said interconnect device underneath said first substrate and generally over said at least one opening.
Claim 24
Dependent Claim
79 words
A method of manufacturing a semiconductor structure according to claim 9 , further comprising: providing a base substrate having a first surface; forming a first plurality of base substrate bond pads on said first surface of said base substrate; and, coupling at least one of said plurality of first substrate bond pads to at least one of said first plurality of base substrate bond pads such that said interconnect device lies between said semiconductor device and said base substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-03-10 | 2006-09-09 | 2007-03-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-03-10 | 2010-09-09 | 2011-03-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-03-10 | 2014-09-09 | 2015-03-11 | $7700.00 | Window Closed / Lapsed |