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US6528892B2 Expired / Lapsed US ⏱️ 0.0 years remaining

Land grid array stiffener use with flexible chip carriers

Assignee: GlobalFoundries US Inc
•
Filing: 2001-06-05
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Granted: 2003-03-04
•
Expires: 2021-06-05
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Abstract

Abstract A flexible chip carrier with contact pads on its upper surface matching those of the chip with said pads conductively connected to land grid array (LGA) pads on its lower surface matching the those of a card or PCB. The chip carrier is provided with a stiffening layer at the LGA interface. The stiffening layer is mechanically attached to the lower surface of the chip carrier. Holes are formed in the stiffening layer to expose the LGA pads. The holes are then filled with a conductive adhesive material. Compliant LGA bumps are applied to the uncured conductive adhesive material which material is then cured.

Inventors

  • 👤 David Vincent Caletka
  • 👤 Krishna NMN Darbha
  • 👤 William NMN Infantolino
  • 👤 Eric Arthur Johnson

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 11:06
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/688; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20

Claims Analysis

Total Claims: 23
Claim 1
Independent Claim 140 words
A chip carrier, comprising: a first layer of flexible dielectric material having a chip site on one surface thereof and having an array of LGA contacts on the other surface thereof with each contact arranged to be aligned for conductive contact with respective ones of an LGA array of contacts on a substrate thereof; and a second layer of stiffening material attached to said other surface of said first layer of dielectric material to provide stiffening support for said first layer, said second layer of stiffening material arranged to have openings aligned with and extending to each contact of said array of LGA contacts on said first layer of dielectric material with each of said openings having formed therein conductive material including an LGA conductor for conductive connection to respective contacts of said LGA array of contacts on said substrate.
Claim 2
Dependent Claim 140 words
A chip carrier, comprising: a first layer of flexible dielectric material having a chip site on one surface thereof and having an array of LGA contacts on the other surface thereof with each contact arranged to be aligned for conductive contact with respective ones of an LGA array of contacts on a substrate thereof; and a second layer of stiffening material attached to said other surface of said first layer of dielectric material to provide stiffening support for said first layer, said second layer of stiffening material arranged to have openings aligned with and extending to each contact of said array of LGA contacts on said first layer of dielectric material with each of said openings having formed therein conductive material including an LGA conductor for conductive connection to respective contacts of said LGA array of contacts on said substrate.
Claim 3
Dependent Claim 18 words
The chip carrier as set forth in claim 1 wherein said LGA conductor is a compliant LGA conductor.
Claim 4
Dependent Claim 29 words
The chip carrier as set forth in claim 2 wherein said second layer of material is a non-conductive highly-filled plastic layer transfer-molded directly onto said first layer of material.
Claim 5
Dependent Claim 29 words
The chip carrier as set forth in claim 1 wherein said second layer of stiffening material is attached to said first layer of dielectric material by a non-conductive adhesive.
Claim 6
Dependent Claim 23 words
The chip carrier as set forth in claim 4 wherein said second layer of material is a glass reinforced epoxy circuit board material.
Claim 7
Dependent Claim 21 words
The chip carrier as set forth in claim 4 wherein said second layer of material is a layer of epoxy material.
Claim 8
Dependent Claim 20 words
The chip carrier as set forth in claim 4 wherein said second layer of material is a layer ceramic material.
Claim 9
Dependent Claim 21 words
The chip carrier as set forth in claim 4 wherein said second layer of material is a layer of cermet material.
Claim 10
Dependent Claim 29 words
The chip carrier as set forth in claim 1 wherein said second layer of material is a non-conductive highly-filled plastic layer transfer-molded directly onto said first layer of material.
Claim 11
Dependent Claim 175 words
A chip carrier, comprising: a first layer of flexible dielectric material having a chip site on one surface thereof and having an array of LGA contacts on the other surface thereof with each contact arranged to be aligned for conductive contact with respective ones of an LGA array of contacts on a substrate therefor; a peripheral chip carrier stiffener surrounding said chip site on said one surface of said first layer of dielectric material for stiffening said first layer of flexible dielectric material; and an areal layer of stiffening material attached to the said other surface of said first layer of dielectric material to provide areal stiffening support for said first layer of dielectric material, said areal layer of stiffening material having openings therethrough aligned with an extending to each contact of said array of LGA contacts on said first layer of dielectric material with each of said openings having formed therein a compliant LGA conductor in conductive contact with respective contacts of said array of LGA contacts on said first layer of dielectric material.
Claim 12
Dependent Claim 175 words
A chip carrier, comprising: a first layer of flexible dielectric material having a chip site on one surface thereof and having an array of LGA contacts on the other surface thereof with each contact arranged to be aligned for conductive contact with respective ones of an LGA array of contacts on a substrate therefor; a peripheral chip carrier stiffener surrounding said chip site on said one surface of said first layer of dielectric material for stiffening said first layer of flexible dielectric material; and an areal layer of stiffening material attached to the said other surface of said first layer of dielectric material to provide areal stiffening support for said first layer of dielectric material, said areal layer of stiffening material having openings therethrough aligned with an extending to each contact of said array of LGA contacts on said first layer of dielectric material with each of said openings having formed therein a compliant LGA conductor in conductive contact with respective contacts of said array of LGA contacts on said first layer of dielectric material.
Claim 13
Dependent Claim 27 words
The chip carrier as set forth in claim 10 wherein said areal layer of stiffening material is selected from among metal, FR4, epoxy, ceramic and cermet materials.
Claim 14
Dependent Claim 28 words
The chip carrier as set forth in claim 11 wherein said areal layer of stiffening material is attached to said first layer of material by a non-conductive adhesive.
Claim 15
Dependent Claim 30 words
The chip carrier as set forth in claim 10 wherein said areal layer of stiffening material is a non-conductive highly-filled plastic layer transfer-molded directly onto said first layer of material.
Claim 16
Dependent Claim 19 words
The chip carrier as set forth in claim 10 wherein said first layer of flexible dielectric material comprises polytetrofluoroethylene.
Claim 17
Dependent Claim 157 words
A chip carrier, comprising: a first layer of flexible dielectric material having a chip site on one surface thereof and having an array of LGA contacts on the other surface thereof with each contact arranged to be aligned for conductive contact with respective ones of an LGA array of contacts on a substrate thereof; and a second layer of stiffening material attached to said other surface of said first layer of dielectric material to provide stiffening support for said first layer, said second layer of stiffening material arranged to have openings aligned with and extending to each contact of said array of LGA contacts on said first layer of dielectric material with each of said openings being larger than said contacts with the walls of said openings lined with an insulating material and having formed therein conductive material including an LGA conductor for conductive connection to respective contacts of said LGA array of contacts on said substrate.
Claim 18
Dependent Claim 157 words
A chip carrier, comprising: a first layer of flexible dielectric material having a chip site on one surface thereof and having an array of LGA contacts on the other surface thereof with each contact arranged to be aligned for conductive contact with respective ones of an LGA array of contacts on a substrate thereof; and a second layer of stiffening material attached to said other surface of said first layer of dielectric material to provide stiffening support for said first layer, said second layer of stiffening material arranged to have openings aligned with and extending to each contact of said array of LGA contacts on said first layer of dielectric material with each of said openings being larger than said contacts with the walls of said openings lined with an insulating material and having formed therein conductive material including an LGA conductor for conductive connection to respective contacts of said LGA array of contacts on said substrate.
Claim 19
Dependent Claim 21 words
The chip carrier as set forth in claim 15 wherein said second layer of stiffening material is a layer of metal.
Claim 20
Dependent Claim 224 words
A chip carrier, comprising: a first layer of flexible dielectric material having a chip site on one surface thereof and having an array of LGA contacts on the other surface thereof with each contact arranged to be aligned for conductive contact with respective ones of an LGA array of contacts on a substrate therefor; a peripheral chip carrier stiffener surrounding said chip site on said one surface of said first layer of dielectric material for stiffening said first layer of flexible dielectric material; and an areal layer of stiffening material attached to the said other surface of said first layer of dielectric material to provide areal stiffening support for said first layer of dielectric material, said areal layer of stiffening material having openings therethrough aligned with and extending to each contact of said array of LGA contacts on said first layer of dielectric material with each of said openings having formed therein a compliant LGA conductor connected to respective ones of said array of LGA contacts on said first layer of dielectric material through conductive material with said conductive material in each of said openings being in frictional contact with the walls of said openings so as to offer resistance to said compliant conductors when said compliant conductors are in conductive contact with respective ones of said LGA array of contacts on said substrate.
Claim 21
Dependent Claim 224 words
A chip carrier, comprising: a first layer of flexible dielectric material having a chip site on one surface thereof and having an array of LGA contacts on the other surface thereof with each contact arranged to be aligned for conductive contact with respective ones of an LGA array of contacts on a substrate therefor; a peripheral chip carrier stiffener surrounding said chip site on said one surface of said first layer of dielectric material for stiffening said first layer of flexible dielectric material; and an areal layer of stiffening material attached to the said other surface of said first layer of dielectric material to provide areal stiffening support for said first layer of dielectric material, said areal layer of stiffening material having openings therethrough aligned with and extending to each contact of said array of LGA contacts on said first layer of dielectric material with each of said openings having formed therein a compliant LGA conductor connected to respective ones of said array of LGA contacts on said first layer of dielectric material through conductive material with said conductive material in each of said openings being in frictional contact with the walls of said openings so as to offer resistance to said compliant conductors when said compliant conductors are in conductive contact with respective ones of said LGA array of contacts on said substrate.
Claim 22
Dependent Claim 227 words
A chip carrier, comprising: a first layer of flexible dielectric material having a chip site on one surface thereof and having an array of LGA contacts on the other surface thereof with each contact arranged to be aligned for conductive contact with respective ones of an LGA array of contacts on a substrate therefor; a peripheral chip carrier stiffener surrounding said chip site on said one surface of said first layer of dielectric material for stiffening said first layer of flexible dielectric material; and an areal layer of stiffening material attached to the said other surface of said first layer of dielectric material to provide areal stiffening support for said first layer of dielectric material, said areal layer of stiffening material having openings therethrough aligned with and extending to each contact of said array of LGA contacts on said first layer of dielectric material with each of said openings having formed therein a compliant LGA conductor connected to respective ones of said array of LGA contacts on said first layer of dielectric material and with each of said openings being tapered outwardly in the direction of said array of LGA contacts on said first layer of dielectric material so as to offer resistance to said compliant conductors when said compliant conductors are in conductive contact with respective ones of said LGA array of contacts on said substrate.
Claim 23
Dependent Claim 227 words
A chip carrier, comprising: a first layer of flexible dielectric material having a chip site on one surface thereof and having an array of LGA contacts on the other surface thereof with each contact arranged to be aligned for conductive contact with respective ones of an LGA array of contacts on a substrate therefor; a peripheral chip carrier stiffener surrounding said chip site on said one surface of said first layer of dielectric material for stiffening said first layer of flexible dielectric material; and an areal layer of stiffening material attached to the said other surface of said first layer of dielectric material to provide areal stiffening support for said first layer of dielectric material, said areal layer of stiffening material having openings therethrough aligned with and extending to each contact of said array of LGA contacts on said first layer of dielectric material with each of said openings having formed therein a compliant LGA conductor connected to respective ones of said array of LGA contacts on said first layer of dielectric material and with each of said openings being tapered outwardly in the direction of said array of LGA contacts on said first layer of dielectric material so as to offer resistance to said compliant conductors when said compliant conductors are in conductive contact with respective ones of said LGA array of contacts on said substrate.

References Cited (Backward Citations)

US5394009A Cited
US5648893A Cited
US5586006A Cited
US5806181A Cited
US5493237A Cited
US5467253A Cited
US5722160A Cited
US5818699A Cited
US5841194A Cited
US5940966A Cited
US6014317A Cited
US6002168A Cited
US6057175A Cited
US5991161A Cited
US6097611A Cited
US6037044A Cited
US6075710A Cited
US6384485B1 Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2006-03-03 2006-09-02 2007-03-04 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2010-03-03 2010-09-02 2011-03-04 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2014-03-03 2014-09-02 2015-03-04 $7700.00 Window Closed / Lapsed

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