US5586006A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together
Assignee: Fujitsu Ltd
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Filing: 1995-12-15
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Granted: 1996-12-17
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Expires: 2015-12-15
Abstract
Abstract A multi-chip module includes a base board, a thin-film multi-layer circuit board which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked, circuit elements mounted on a main surface of the thin-film multi-layer circuit board, and terminals which are attached to the main surface of the thin-film multi-layer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted.
Inventors
- 👤 Kiyotaka Seyama
- 👤 Shunichi Kikuchi
- 👤 Makoto Sumiyoshi
- 👤 Naoki Yasuda
- 👤 Minoru Hirano
- 👤 Hitoshi Nori
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 09:32
CPC Classifications
H; H10; H10W; H10W90/00; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H10W90/701; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0317; H05K2201/10; H05K2201/10227; H05K2201/1031; H05K2201/10318; H05K2201/10431; H05K2201/10439; H05K2201/10477; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3426; H05K3/3431; H05K3/3436; H05K3/36; H05K3/368; H05K3/46; H05K3/4644; H05K3/467; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/60; H10W74/00; H10W90/20; H10W90/22; H10W90/288; H10W90/751; H10W90/754; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 33
Claim 1
Independent Claim
183 words
A multi-chip module, comprising: a base board; a thin-film multi-layer circuit board which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked, wherein said thin-film multi-layer circuit board includes at least one of said wiring conductors which extends to a main external surface thereof; circuit elements mounted on said main external surface of the thin-film multi-layer circuit board; and terminals which are attached to the main surface of the thin-film multi-layer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted, wherein the terminals are attached and supported between said at least one of said wiring conductors of the thin-film multi-layer circuit board and said circuits on said wiring board, wherein said wiring conductors are located at different layer levels, and have longitudinally extending portions and laterally extending portions, and wherein said wiring conductors are electrically connected to each other by way of said longitudinally extending portions passing through via holes formed in the insulating layers.
Claim 2
Dependent Claim
183 words
A multi-chip module, comprising: a base board; a thin-film multi-layer circuit board which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked, wherein said thin-film multi-layer circuit board includes at least one of said wiring conductors which extends to a main external surface thereof; circuit elements mounted on said main external surface of the thin-film multi-layer circuit board; and terminals which are attached to the main surface of the thin-film multi-layer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted, wherein the terminals are attached and supported between said at least one of said wiring conductors of the thin-film multi-layer circuit board and said circuits on said wiring board, wherein said wiring conductors are located at different layer levels, and have longitudinally extending portions and laterally extending portions, and wherein said wiring conductors are electrically connected to each other by way of said longitudinally extending portions passing through via holes formed in the insulating layers.
Claim 3
Dependent Claim
14 words
The multi-chip module as claimed in claim 1, wherein said terminals comprise lead members.
Claim 4
Dependent Claim
14 words
The multi-chip module as claimed in claim 1, wherein said terminals comprise leadless members.
Claim 5
Dependent Claim
38 words
The multi-chip module as claimed in claim 1, wherein said terminals are soldered to wiring conductors of the thin-film multi-layer circuit board facing the wiring board, so that the terminals are supported by the thin-film multi-layer circuit board.
Claim 6
Dependent Claim
38 words
The multi-chip module as claimed in claim 2, wherein said terminals are soldered to wiring conductors of the thin-film multi-layer circuit board facing the wiring board, so that the terminals are supported by the thin-film multi-layer circuit board.
Claim 7
Dependent Claim
26 words
The multi-chip module as claimed in claim 3, wherein said terminals are soldered to wiring conductors of the thin-film multi-layer circuit board facing the wiring board.
Claim 8
Dependent Claim
30 words
The multi-chip module as claimed in claim 1, wherein wiring conductors of the thin-film multi-layer circuit board facing the wiring board comprise pad areas to which said terminals are connected.
Claim 9
Dependent Claim
30 words
The multi-chip module as claimed in claim 2, wherein wiring conductors of the thin-film multi-layer circuit board facing the wiring board comprise pad areas to which said terminals are connected.
Claim 10
Dependent Claim
30 words
The multi-chip module as claimed in claim 3, wherein wiring conductors of the thin-film multi-layer circuit board facing the wiring board comprise pad areas to which said terminals are connected.
Claim 11
Dependent Claim
30 words
The multi-chip module as claimed in claim 4, wherein wiring conductors of the thin-film multi-layer circuit board facing the wiring board comprise pad areas to which said terminals are connected.
Claim 12
Dependent Claim
27 words
The multi-chip module as claimed in claim 2, wherein said lead members comprise lead pins vertically extending from the main surface of the thin-film multi-layer circuit board.
Claim 13
Dependent Claim
16 words
The multi-chip module as claimed in claim 2, wherein said lead members comprise flat-type lead pins.
Claim 14
Dependent Claim
15 words
The multi-chip module as claimed in claim 2, wherein said lead members comprise wire leads.
Claim 15
Dependent Claim
16 words
The multi-chip module as claimed in claim 2, wherein said lead members comprise tape-automated bonding leads.
Claim 16
Dependent Claim
34 words
The multi-chip module as claimed in claim 1, wherein said terminals are located in peripheral areas on the main surface of the thin-film multi-layer circuit board so that said terminals surround the circuit elements.
Claim 17
Dependent Claim
34 words
The multi-chip module as claimed in claim 2, wherein said terminals are located in peripheral areas on the main surface of the thin-film multi-layer circuit board so that said terminals surround the circuit elements.
Claim 18
Dependent Claim
34 words
The multi-chip module as claimed in claim 3, wherein said terminals are located in peripheral areas on the main surface of the thin-film multi-layer circuit board so that said terminals surround the circuit elements.
Claim 19
Dependent Claim
34 words
The multi-chip module as claimed in claim 4, wherein said terminals are located in peripheral areas on the main surface of the thin-film multi-layer circuit board so that said terminals surround the circuit elements.
Claim 20
Dependent Claim
34 words
The multi-chip module as claimed in claim 7, wherein said terminals are located in peripheral areas on the main surface of the thin-film multi-layer circuit board so that said terminals surround the circuit elements.
Claim 21
Dependent Claim
30 words
The multi-chip module as claimed in claim 1, further comprising a cover which is formed on the main surface of the thin-film multi-layer circuit board and covers the circuit elements.
Claim 22
Dependent Claim
30 words
The multi-chip module as claimed in claim 2, further comprising a cover which is formed on the main surface of the thin-film multi-layer circuit board and covers the circuit elements.
Claim 23
Dependent Claim
30 words
The multi-chip module as claimed in claim 3, further comprising a cover which is formed on the main surface of the thin-film multi-layer circuit board and covers the circuit elements.
Claim 24
Dependent Claim
30 words
The multi-chip module as claimed in claim 4, further comprising a cover which is formed on the main surface of the thin-film multi-layer circuit board and covers the circuit elements.
Claim 25
Dependent Claim
30 words
The multi-chip module as claimed in claim 7, further comprising a cover which is formed on the main surface of the thin-film multi-layer circuit board and covers the circuit elements.
Claim 26
Dependent Claim
30 words
The multi-chip module as claimed in claim 15, further comprising a cover which is formed on the main surface of the thin-film multi-layer circuit board and covers the circuit elements.
Claim 27
Dependent Claim
36 words
The multi-chip module as claimed in claim 1, further comprising a cooling structure which is formed on a second surface of the base board opposite to the first surface thereof and which cools the multi-chip module.
Claim 28
Dependent Claim
36 words
The multi-chip module as claimed in claim 2, further comprising a cooling structure which is formed on a second surface of the base board opposite to the first surface thereof and which cools the multi-chip module.
Claim 29
Dependent Claim
36 words
The multi-chip module as claimed in claim 3, further comprising a cooling structure which is formed on a second surface of the base board opposite to the first surface thereof and which cools the multi-chip module.
Claim 30
Dependent Claim
36 words
The multi-chip module as claimed in claim 4, further comprising a cooling structure which is formed on a second surface of the base board opposite to the first surface thereof and which cools the multi-chip module.
Claim 31
Dependent Claim
36 words
The multi-chip module as claimed in claim 7, further comprising a cooling structure which is formed on a second surface of the base board opposite to the first surface thereof and which cools the multi-chip module.
Claim 32
Dependent Claim
36 words
The multi-chip module as claimed in claim 15, further comprising a cooling structure which is formed on a second surface of the base board opposite to the first surface thereof and which cools the multi-chip module.
Claim 33
Dependent Claim
36 words
The multi-chip module as claimed in claim 20, further comprising a cooling structure which is formed on a second surface of the base board opposite to the first surface thereof and which cools the multi-chip module.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-12-17 | 2000-06-17 | 2000-12-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-12-17 | 2004-06-17 | 2004-12-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-12-17 | 2008-06-17 | 2008-12-17 | $7700.00 | Window Closed / Lapsed |