EP0509825A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Package structure for semiconductor device
Assignee: NEC Corp
•
Filing: 1992-04-16
•
Granted: —
•
Expires: 2012-04-16
Abstract
Abstract A packaged semiconductor device comprises a wiring substrate (2), a plurality of semiconductor device chips (1) each having a first surface electrically and mechanically connected to the wiring substrate by use of bumps (3a), and a heat sink (5a) bonded through a high heat conductive bonding layer (4a) to a second surface of each of the semiconductor device chips. The wiring substrate and the heat sink are formed of the same material. In addition, a package casing accommodates the semiconductor device chips and the wiring substrate therein and has internal conductors positioned in the inside of the package casing and external connection pins extending outwardly from the package casing and connected to corresponding internal conductors. The wiring substrate is connected to the internal conductors of the package casing through a flexible wiring circuit member.
Inventors
- 👤 Yasuhiro c/o NEC Corporation Kurokawa
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 19:57
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W40/00; H10W40/40; H10W40/47; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W90/00; H10W90/401; H10W90/701; H10W70/62; H10W70/63; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
73 words
A packaged semiconductor device comprising a wiring substrate, a plurality of semiconductor device chips each having a first surface electrically and mechanically connected to said wiring substrate by use of bumps, and a heat sink bonded through a high heat conductive bonding layer to a second surface of each of said semiconductor device chips opposite to said first surface thereof, said wiring substrate and said heat sink being formed of the same material.
Claim 2
Dependent Claim
22 words
A packaged semiconductor device claimed in Claim 1 wherein said heat sink is bonded with a radiator fin block for air cooling.
Claim 3
Dependent Claim
35 words
A packaged semiconductor device claimed in Claim 1 wherein said wiring substrate is composed of a substrate and a multilayer wiring structure formed on said silicon substrate and formed of insulator layers and conductor layers.
Claim 4
Dependent Claim
119 words
A packaged semiconductor device comprising a wiring substrate, a plurality of semiconductor device chips each having a first surface electrically and mechanically connected to said wiring substrate by use of bumps, a heat sink bonded through a high heat conductive bonding layer to a second surface of each of said semiconductor devices opposite to said first surface thereof, and a package casing accommoding said semiconductor device chips ans said wiring substrate therein and having internal conductors positioned in the inside of said package casing and external connection pins extending outwardly from said package casing and connected to corresponding internal conductors, said wiring substrate being connected to said internal conductors of said package casing through a flexible wiring circuit member.
Claim 5
Dependent Claim
22 words
A packaged semiconductor device claimed in Claim 4 wherein said heat sink is bonded with a radiator fin block for air cooling.
Claim 6
Dependent Claim
21 words
A packaged semiconductor device claimed in Claim 4 wherein said heat sink is bonded with a water jacket for liquid cooling
Claim 7
Dependent Claim
35 words
A packaged semiconductor device claimed in Claim 4 wherein said wiring substrate is composed of a substrate and a multilayer wiring structure formed on said silicon substrate and formed of insulator layers and conductor layers.
Claim 8
Dependent Claim
31 words
A packaged semiconductor device claimed in Claim 4 wherein said flexible wiring circuit member is formed of a flexible insulator film and patterned metal conductors formed on said flexible insulator film.
Claim 9
Dependent Claim
122 words
A packaged semiconductor device comprising a wiring substrate, a plurality of semiconductor device chips each having a first surface electrically and mechanically connected to said wiring substrate by use of bumps, a heat sink bonded through a high heat conductive bonding layer to a second surface of each of said semiconductor devices opposite to said first surface thereof, and a package casing accommodating said semiconductor device chips and said wiring substrate therein and having internal conductors positioned in the inside of said package casing and external connection pins extending outwardly from said package casing and connected to corresponding internal conductors, said wiring substrate being formed of a flexible wiring circuit member and connected directly to said internal conductors of said package casing.
Claim 10
Dependent Claim
31 words
A packaged semiconductor device claimed is Claim 9 wherein said flexible wiring circuit member is formed of a flexible insulator film and patterned metal conductors formed on said flexible insulator film.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.