US5256469A
Expired / Lapsed
US
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Multi-layered, co-fired, ceramic-on-metal circuit board for microelectronic packaging
Assignee: General Electric Co
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Filing: 1991-12-18
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Granted: 1993-10-26
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Expires: 2011-12-18
Abstract
Abstract The present invention relates broadly to any type of multi-layered, co-fired, ceramic-on-metal circuit board, as a new article of manufacture. The present invention is more specifically directed to various compositions of MgO-13 B2O3-SiO2 system glass-ceramics and compositions of such glass-ceramic and suitable fillers, which are suitable for use in the fabrication of multi-layered, co-fired, ceramic-on-metal circuit boards, in which the co-fired, multi-layered ceramic exhibits desirable electrical properties and a temperature coefficient of expansion which closely matches that of its co-fired metal base, although these compositions may have other uses.
Inventors
- 👤 Stayam C. Cherukuri
- 👤 Lubomyr S. Onyshkevych
- 👤 Ashok N. Prabhu
- 👤 Barry J. Thaler
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 12:43
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/692; C; C03; C03C; C03C10/00; C03C10/0054; H10W70/68; H10W70/6875; H10W70/682; H10W70/685; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/24926
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
79 words
A co-fired, multi-layered, ceramic-on-metal circuit board comprising a structure having a metal base, a bonding layer of glass on said base, and a ceramic formed from multiple layers of a ceramic tape on said bonding layer, each layer of said multiple layers of ceramic tape comprising a glass-ceramic/filler composition wherein the composition of the glass ceramic is within a range 10-20 wt % SiO 2 , 20-35 wt % B 2 O 3 , and 25-50 wt % MgO.
Claim 2
Dependent Claim
79 words
A co-fired, multi-layered, ceramic-on-metal circuit board comprising a structure having a metal base, a bonding layer of glass on said base, and a ceramic formed from multiple layers of a ceramic tape on said bonding layer, each layer of said multiple layers of ceramic tape comprising a glass-ceramic/filler composition wherein the composition of the glass ceramic is within a range 10-20 wt % SiO 2 , 20-35 wt % B 2 O 3 , and 25-50 wt % MgO.
Claim 3
Dependent Claim
42 words
The circuit board defined in claim 1, wherein: each of said metal and said glass-ceramic/filler composition exhibits a temperature coefficient of expansion that closely matches one another, within 5-10×10 -7 /°C., over a temperature range from room temperature to about 600° C.
Claim 4
Dependent Claim
48 words
The circuit board defined in claim 2, wherein said glass-ceramic/filler composition exhibits: a temperature coefficient of expansion between 90-130×10 -7 /°C.; a dielectric constant within the range of 4 to 6.9 at 1 MHz; and a dissipation factor within the range of 0.1% to 0.5% at 1 MHz.
Claim 5
Dependent Claim
43 words
The circuit board defined in claim 3, wherein: said glass-ceramic/filler composition, by weight, consists of at least 50% glass-ceramic composition and a filler composition of no greater than a 50%, and said filler composition comprises at least one of Quartz, Fluorspar or Cristobalite.
Claim 6
Dependent Claim
75 words
The circuit board defined in claim 4, wherein: said glass-ceramic/filler composition, by weight, consists of substantially 70% of a given glass-ceramic composition and substantially 30% of a given filler composition; said given glass-ceramic composition, by weight, consists of substantially 16.9% SiO 2 , 30.0% B 2 O 3 , 39.2% MgO, 9.1% ZnO, 3.7% CaO, and 1.2% ZrO 2 ; and said given filler composition, by weight, consists of substantially 50% Fluorspar and 50% Quartz.
Claim 7
Dependent Claim
72 words
The circuit board defined in claim 4, wherein: said glass-ceramic/filler composition, by weight, consists of substantially 75% of a given glass-ceramic composition and substantially 25% of a given filler composition; said given glass-ceramic composition, by weight, consists of substantially 15.9% SiO 2 , 28.3% B 2 O 3 , 41.2% MgO, 9.23% ZnO, 4.2% CaO, and 1.2% ZrO 2 ; and said given filler composition, by weight, consists of substantially 100% Fluorspar.
Claim 8
Dependent Claim
73 words
The circuit board defined in claim 4, wherein: said glass-ceramic/filler composition, by weight, consists of substantially 70% of a given glass-ceramic composition and substantially 30% of a given filler composition; said given glass-ceramic composition, by weight, consists of substantially 17.5% SiO 2 , 31.8% B 2 O 3 , 43.0% MgO, 6.53% CaO, and 1.2% ZrO 2 ; and said given filler composition, by weight, consists of substantially 50% Fluorspar and 50% Quartz.
Claim 9
Dependent Claim
77 words
The circuit board defined in claim 4, wherein: said glass-ceramic/filler composition, by weight, consists of substantially 70% of a given glass-ceramic composition and substantially 30% of a given filler composition; said given glass-ceramic composition, by weight, consists of substantially 16.8% SiO 2 , 29.8% B 2 O 3 , 38.8% MgO, 9.1% ZnO, 3.6% CaO, 0.9% ZrO 2 , and 1.0% Cr203; and said given filler composition, by weight, consists of substantially 50% Fluorspar and 50% Quartz.
Claim 10
Dependent Claim
78 words
The circuit board defined in claim 4, wherein: said glass-ceramic/filler composition, by weight, consists of substantially 70% of a given glass-ceramic composition and substantially 30% of a given filler composition; said glass-ceramic composition, by weight, consists of substantially 15.8% Si 2 , 28.0% B 2 O 3 , 34.4% MgO, 8.5% ZnO, 3.4% CaO, 8.0% BaO, 0.4% ZrO 2 , and 1.5% Cr203; and said given filler composition, by weight, consists of substantially 50% Fluorspar and 50% Quartz.
Claim 11
Dependent Claim
28 words
The circuit board defined in claim 1, wherein: said metal base consists of one of Cu, Al, stainless steel, Ni, low carbon steel, Cu/Invar/Cu, Cu/Mo/Cu, and Cu/stainless steel/Cu.
Claim 12
Dependent Claim
35 words
The circuit board defined in claim 1, wherein: at least one of the layers of said co-fired, multi-layered ceramic includes printed conductors thereon comprising at least one of Ag, Au, AuPt, Ag/Pd, Ni, and Cu.
Claim 13
Dependent Claim
24 words
The circuit board defined in claim 1, wherein: said multi-layered ceramic incorporates at least one slot extending therethrough to the metal underlying said slot.
Claim 14
Dependent Claim
23 words
The circuit board defined in claim 12, further comprising: a microelectronic component extending into said slot and attached directly to said underlying metal.
Claim 15
Dependent Claim
15 words
The circuit board defined in claim 13, wherein: said microelectronic component comprises an integrated-circuit chip.
Claim 16
Dependent Claim
26 words
The circuit board defined in claim 13, further comprising: an encapsulant covering said microelectronic component and said slot, said encapsulant being attached to said multilayered ceramic.
Claim 17
Dependent Claim
18 words
The circuit board defined in claim 15, wherein: said microelectronic component is hermetically sealed by said covering encapsulant.
References Cited (Backward Citations)
US4291107A
Cited
US4256796A
Cited
US4645552A
Cited
US5044074A
Cited
US4952531A
Cited
US5043222A
Cited
US5047371A
Cited
US5041695A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-10-25 | 1997-04-26 | 1997-10-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-10-25 | 2001-04-26 | 2001-10-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-10-25 | 2005-04-26 | 2005-10-26 | $7700.00 | Window Closed / Lapsed |