US5483101A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multilayer printed circuit board
Assignee: NEC Corp
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Filing: 1994-12-05
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Granted: 1996-01-09
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Expires: 2014-12-05
Abstract
Abstract A semiconductor package applicable to integrated circuits and other semiconductor devices of the kind needing high integration and high speed operation. The package has a printed circuit board implemented by a glass cloth impregnated with epoxy, bismaleimide-triazine (BT) or similar resin, a power source layer provided in the circuit board in a plate structure, a ground layer formed on the surface of the circuit board in a plate structure, and a thin film laminate wiring formed on the ground layer in a plate structure and consisting of copper and benzocyclobutene. The package desirably shields leakage currents and matches a characteristic impedance with accuracy, thereby noticeably reducing noise and enhancing high speed signal transmission.
Inventors
- 👤 Tadanori Shimoto
- 👤 Koji Matsui
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 18:21
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H05; H05K; H05K3/00; H05K3/46; H05K3/4602; H10W70/67; H10W70/69; H10W72/00; H10W90/00; H10W90/401; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0366; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0317; H05K2201/09; H05K2201/09209; H05K2201/0929; H05K2201/09309; H05K2203/00; H05K2203/06; H05K2203/061; H05K2203/15; H05K2203/1581; H05K3/38; H05K3/389; H05K3/4644; H05K3/467; H05K3/4673; H05K3/4676
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
82 words
A semiconductor package comprising: a printed circuit board comprising a glass cloth impregnated with resin resistive to heat; a ground layer formed on a surface of said printed circuit board and provided with a plate structure, said ground layer etched according to a pattern; a thin film laminate wiring comprising a copper thin film conductor formed on said ground layer, and benzocyclobutene resin; and a copper foil power source layer disposed in said printed circuit board and provided with a plate structure.
Claim 2
Dependent Claim
82 words
A semiconductor package comprising: a printed circuit board comprising a glass cloth impregnated with resin resistive to heat; a ground layer formed on a surface of said printed circuit board and provided with a plate structure, said ground layer etched according to a pattern; a thin film laminate wiring comprising a copper thin film conductor formed on said ground layer, and benzocyclobutene resin; and a copper foil power source layer disposed in said printed circuit board and provided with a plate structure.
Claim 3
Dependent Claim
13 words
A semiconductor package as claimed in claim 1, wherein said resin comprises epoxy.
Claim 4
Dependent Claim
15 words
A semiconductor package as claimed in claim 1, wherein said resin comprises bismaleimide-triazine (BT) resin.
Claim 5
Dependent Claim
23 words
A semiconductor package as claimed in claim 1, wherein said ground layer is formed by laminating copper foil on said printed circuit board.
Claim 6
Dependent Claim
45 words
A semiconductor packages as claimed in claim 1, wherein said copper thin film conductor and said benzocyclobutene resin of said thin film laminate wiring are formed on said ground surface after a silane-based coupling agent has been applied to a surface of said ground layer.
Claim 7
Dependent Claim
16 words
A semiconductor package as claimed in claim 5, wherein said silane-based coupling agent comprises 3-aminopropyl triethoxysilane.
Claim 8
Dependent Claim
20 words
A semiconductor package as claimed in claim 1, further comprising pads provided on a top of said printed circuit board.
Claim 9
Dependent Claim
28 words
A semiconductor package as claimed in claim 7, further comprising connection terminals provided on one of a bottom, a side and the top of said printed circuit board.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-01-08 | 1999-07-10 | 2000-01-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-01-08 | 2003-07-10 | 2004-01-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-01-08 | 2007-07-10 | 2008-01-09 | $7700.00 | Window Closed / Lapsed |