Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
107 words
An electronic subsystem, packaged on a flexible carrier, for providing function in a computer system, the subsystem comprising: a flexible dielectric carrier having circuitized lines with plural I/O interconnection points formed on at least one side thereof; at least one layer of dielectric material, adjacent said circuitized lines, having at least one via formed therein to electrically expose said I/O interconnection points of said flexible carrier; and at least one IC device, disposed on a top one of said at least one dielectric layer, such that I/O interconnection points of said IC are aligned and electrically interconnected with corresponding ones of said flexible carrier I/O interconnection points.
Claim 2
Dependent Claim
29 words
An electronic subsystem as claimed in claim 1 further comprising circuitized electrically conductive transmission lines on a surface of said at least one dielectric layer opposite said flexible carrier.
Claim 3
Dependent Claim
73 words
An electronic subsystem as claimed in any of claims 1 or 2 further comprising: a plurality of said dielectric layers in alignment with one another and adjacent said circuitized lines of said flexible carrier; vias in each of the aligned dielectric layers; and circuitized electrical transmission lines on a surface of each of said dielectric layers opposite said flexible carrier so as to be in electrical communication with one another through said vias.
Claim 4
Dependent Claim
40 words
An electronic subsystem as claimed in any of the preceding claims comprising IC interconnection points, in electrical communication with circuitized lines on a top one of said dielectric layers, for allowing the attachment of at least one IC device thereto.
Claim 5
Dependent Claim
18 words
An electronic subsystem wherein a lamination bonding material is disposed intermediate each of said layers of dielectric material.
Claim 6
Dependent Claim
53 words
An electronic subsystem as claimed in any of the preceding claims further comprising a stiffener, disposed adjacent said flexible carrier on a side opposite said at least one dielectric layer, for providing stability during manufacture of said subsystem, and reducing the effects of thermal expansion between said IC devices and said flexible carrier.
Claim 7
Dependent Claim
35 words
An electronic subsystem as claimed in any of the preceding claims wherein circuitized lines are disposed on both sides of said flexible carrier, thereby forming a first and a second wiring layer of said subsystem.
Claim 8
Independent Claim
162 words
A method of forming an electronic subsystem comprising: placing a layer of dielectric material adjacent circuitized lines, having plural I/O interconnection points thereon, formed on at least one side of a flexible dielectric carrier; forming vias in said dielectric layer to electrically expose said I/O interconnection points of said flexible carrier; placing at least one IC device, on said dielectric layer, such that I/O interconnection points of said IC are aligned and electrically interconnected with corresponding ones of said flexible carrier I/O interconnection points; circuitizing electrically conductive transmission lines on a surface of said dielectric layer opposite said flexible carrier; sequentially placing a plurality of said dielectric layers in alignment with one another and adjacent said circuitized lines of said flexible carrier; forming vias in each of the vertically aligned dielectric layers, prior to placement of a subsequent layer; and circuitizing electrical transmission lines on a surface of said dielectric layer opposite said flexible carrier, prior to placement of a subsequent layer.
Claim 9
Dependent Claim
39 words
A method as claimed in claim 8 wherein said step of placing at least one integrated circuit device comprises forming integrated circuit interconnection points in communication with circuitized lines on a last one of said sequentially placed dielectric layers.
Claim 10
Dependent Claim
33 words
A method as claimed in any of claim 8 or 9 wherein said step of placing a layer of dielectric material comprises laminating a first sheet of dielectric material adjacent said circuitized lines.