US6097611A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multi-chip land grid array carrier
Assignee: Intel Corp
•
Filing: 1999-09-17
•
Granted: 2000-08-01
•
Expires: 2019-09-17
Abstract
Abstract A land grid array (LGA) carrier includes an interposer having a first surface and a second surface opposite the first surface, with a plurality of locations on the first surface adapted to receive a plurality of semiconductor dice and passive components. The second surface has a plurality of conductive pads coupled thereto.
Inventors
- 👤 William A. Samaras
- 👤 Paul T. Phillips
- 👤 Michael P. Brownell
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:02
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0216; H05K1/023; H05K1/14; H05K1/141; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W90/00; H10W90/701; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09781; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2201/10719; H05K2201/10734; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K3/36; H05K3/368; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49128; Y10T29/4913; Y10T29/49144; Y10T29/49147; Y10T29/49149
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
94 words
A land grid array carrier, comprising: an interposer having a first surface and a second surface opposite the first surface; a first location on the first surface adapted to receive a semiconductor die and a second location on the first surface adapted to receive a passive component; a first conductive pad coupled to the second surface and electrically coupled with the first location; and a second conductive pad coupled to the second surface and electrically coupled with the second location; wherein the passive component is one of a resistor, a capacitor, and an inductor.
Claim 2
Dependent Claim
94 words
A land grid array carrier, comprising: an interposer having a first surface and a second surface opposite the first surface; a first location on the first surface adapted to receive a semiconductor die and a second location on the first surface adapted to receive a passive component; a first conductive pad coupled to the second surface and electrically coupled with the first location; and a second conductive pad coupled to the second surface and electrically coupled with the second location; wherein the passive component is one of a resistor, a capacitor, and an inductor.
Claim 3
Dependent Claim
28 words
The carrier of claim 1 further comprising a first solder ball attached to the first conductive pad and a second solder ball attached to the second conductive pad.
Claim 4
Dependent Claim
16 words
The carrier of claim 1 further comprising a third conductive pad electrically coupled to a pin.
Claim 5
Dependent Claim
13 words
The carrier of claim 1, wherein the interposer is comprised of organic material.
Claim 6
Dependent Claim
38 words
The carrier of claim 1 further comprising a first conductive trace in the interposer arranged to electrically couple the first location to at least one of the second location, the first conductive pad, and the second conductive pad.
Claim 7
Dependent Claim
51 words
The carrier of claim 5 further comprising: a plurality of conductive traces including said first and second conductive pads; and a plurality of conductive traces including said first conductive trace; wherein at least one of the plurality of conductive pads is not coupled to any of the plurality of conductive traces.
Claim 8
Dependent Claim
21 words
The carrier of claim 6, wherein the plurality of conductive pads are substantially configured in an array of rows and columns.
Claim 9
Dependent Claim
18 words
The carrier of claim 7, wherein the array comprises at least 40 rows and at least 45 columns.
Claim 10
Dependent Claim
17 words
The carrier of claim 8 wherein the plurality of conductive pads comprises at least 1,800 conductive pads.
Claim 11
Dependent Claim
17 words
The carrier of claim 8 wherein the array of conductive pads covers substantially the entire second surface.
Claim 12
Dependent Claim
28 words
The carrier of claim 1 wherein the first surface comprises first and second portions, wherein the first portion is adapted to receive the semiconductor die and passive component.
Claim 13
Dependent Claim
18 words
The carrier of claim 11 wherein the second portion is located about the periphery of the first surface.
Claim 14
Dependent Claim
26 words
The carrier of claim 12 wherein the second portion is not adapted to receive the semiconductor die and is not adapted to receive the passive component.
Claim 15
Dependent Claim
15 words
The carrier of claim 1 further comprising a semiconductor die coupled to the first surface.
Claim 16
Dependent Claim
13 words
The carrier of claim 14 wherein the semiconductor die comprises a memory chip.
Claim 17
Dependent Claim
20 words
The carrier of claim 14 wherein the semiconductor die is coupled to the first portion using controlled collapse chip connection.
Claim 18
Dependent Claim
15 words
The carrier of claim 14 further comprising a passive component coupled to the first surface.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-08-01 | 2004-01-31 | 2004-08-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-08-01 | 2008-01-31 | 2008-08-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-08-01 | 2012-01-31 | 2012-08-01 | $7700.00 | Window Closed / Lapsed |