US6503776B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for fabricating stacked chip package
Assignee: Advanced Semiconductor Engineering Inc
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Filing: 2001-01-05
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Granted: 2003-01-07
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Expires: 2021-01-05
Abstract
Abstract A method for fabricating a stacked chip package comprises the steps of: (a) attaching a lower chip to a substrate or a lead frame; (b) electrically coupling the lower chip to the substrate or the lead frame; (c) providing a dummy chip with a film adhesive on a upper surface thereof; (d) attaching the dummy chip to the lower chip through an adhesive layer wherein a lower surface of the dummy chip is in contact with the adhesive layer; (e) attaching an upper chip to the dummy chip through the film adhesive; (f) electrically coupling the upper chip to the substrate or the lead frame; and (g) encapsulating the lower chip and the upper chip against a portion of the substrate or the lead frame with a molding compound. Since the dummy chip is bonded to the upper chip via a film adhesive, it is not necessary to monitor the thickness of the film adhesive after the upper chip is bonded to the dummy chip.
Inventors
- 👤 Tsung-Ming Pai
- 👤 Chih Min Pao
- 👤 Kuang-Hui Chen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:14
CPC Classifications
H; H10; H10W; H10W90/00; H10W72/00; H10W72/071; H10W72/073; H10W72/075; H10W72/30; H10W72/381; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/20; H10W90/231; H10W90/701; H10W90/731; H10W90/732; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
162 words
A method of fabricating a stacked chip package, comprising the steps of: attaching a first chip means for supporting chips, the supporting means being provided with a structure for making external electrical connection; electrically coupling the first chip to the structure for making external electrical connection; providing a dummy chip with a film adhesive on an upper surface thereof; attaching the dummy chip to the first chip through an adhesive layer wherein a lower surface of the dummy chip is in contact with the adhesive layer; attaching a second chip to the dummy chip through the film adhesive, wherein the second chip is substantially larger in size than the dummy chip; electrically coupling the second chip to the structure for making external electrical connection; and encapsulating the first chip and the second chip against a portion of the supporting means with a molding compound; and wherein the maximum exothermic temperature of the adhesive layer is lower than that of the film adhesive.
Claim 2
Independent Claim
162 words
A method of fabricating a stacked chip package, comprising the steps of: attaching a first chip means for supporting chips, the supporting means being provided with a structure for making external electrical connection; electrically coupling the first chip to the structure for making external electrical connection; providing a dummy chip with a film adhesive on an upper surface thereof; attaching the dummy chip to the first chip through an adhesive layer wherein a lower surface of the dummy chip is in contact with the adhesive layer; attaching a second chip to the dummy chip through the film adhesive, wherein the second chip is substantially larger in size than the dummy chip; electrically coupling the second chip to the structure for making external electrical connection; and encapsulating the first chip and the second chip against a portion of the supporting means with a molding compound; and wherein the maximum exothermic temperature of the adhesive layer is lower than that of the film adhesive.
Claim 3
Dependent Claim
21 words
The method as claimed in claim 1 , wherein the adhesive layer has a curing temperature of less than 120° C.
Claim 4
Dependent Claim
26 words
The method as claimed in claim 2 , wherein the film adhesive begins to show adhering property at a heating temperature of more than 150° C.
Claim 5
Dependent Claim
20 words
The method as claimed in claim 1 , wherein the film adhesive shows substantially no adhesion strength under room temperature.
Claim 6
Independent Claim
149 words
A method of fabricating a stacked chip package, comprising the steps of: attaching a first chip means for supporting chips, the supporting means being provided with a structure for making external electrical connection; electrically coupling the first chip to the structure for making external electrical connection; attaching the dummy chip to the first chip through an adhesive layer wherein a lower surface of the dummy chip is in contact with the adhesive layer; attaching a second chip to the dummy chip through the film adhesive, wherein the second chip is substantially larger in size than the dummy chip; electrically coupling the second chip to the structure for making external electrical connection; and encapsulating the first chip and the second chip against a portion of the supporting means with a molding compound; and wherein the maximum exothermic temperature of the adhesive layer is lower than that of the film adhesive.
Claim 7
Independent Claim
149 words
A method of fabricating a stacked chip package, comprising the steps of: attaching a first chip means for supporting chips, the supporting means being provided with a structure for making external electrical connection; electrically coupling the first chip to the structure for making external electrical connection; attaching the dummy chip to the first chip through an adhesive layer wherein a lower surface of the dummy chip is in contact with the adhesive layer; attaching a second chip to the dummy chip through the film adhesive, wherein the second chip is substantially larger in size than the dummy chip; electrically coupling the second chip to the structure for making external electrical connection; and encapsulating the first chip and the second chip against a portion of the supporting means with a molding compound; and wherein the maximum exothermic temperature of the adhesive layer is lower than that of the film adhesive.
Claim 8
Dependent Claim
26 words
The method as claimed in claim 5 , wherein the film adhesive begins to show adhering property at a heating temperature of more than 150° C.
Claim 9
Dependent Claim
20 words
The method as claimed in claim 5 , wherein the film adhesive shows substantially no adhesion strength under room temperature.
Claim 10
Dependent Claim
46 words
The method of claim 1 , wherein the step of attaching the second chip to the dummy chip is performed so that the second chip is positioned with at least two opposite side edges thereof extending outwardly beyond corresponding opposite side edges of the dummy chip.
Claim 11
Dependent Claim
14 words
The method of claim 1 , wherein the film adhesive has a predetermined thickness.
Claim 12
Dependent Claim
46 words
The method of claim 5 , wherein the step of attaching the second chip to the dummy chip is performed so that the second chip is positioned with at least two opposite side edges thereof extending outwardly beyond corresponding opposite side edges of the dummy chip.
Claim 13
Dependent Claim
14 words
The method of claim 5 , wherein the film adhesive has a predetermined thickness.
Claim 14
Independent Claim
164 words
A method of fabricating a stacked chip package, comprising the steps of: attaching a first chip to a support, the support being provided with a structure for making external electrical connection; electrically coupling the first chip to the structure for making external electrical connection; providing a dummy chip; providing a film adhesive on an upper surface of the dummy chip; applying an adhesive layer on an upper surface of the first chip; attaching the dummy chip to the first chip through the applied adhesive layer wherein a lower surface of the dummy chip is in contact with the adhesive layer; attaching a second chip to the dummy chip through the film adhesive; electrically coupling the second chip to the structure for making the external electrical connection; and encapsulating the first chip and the second chip against a portion of the supporting means with a molding compound; and wherein the maximum exothermic temperature of the adhesive layer is lower than that of the film adhesive.
Claim 15
Independent Claim
164 words
A method of fabricating a stacked chip package, comprising the steps of: attaching a first chip to a support, the support being provided with a structure for making external electrical connection; electrically coupling the first chip to the structure for making external electrical connection; providing a dummy chip; providing a film adhesive on an upper surface of the dummy chip; applying an adhesive layer on an upper surface of the first chip; attaching the dummy chip to the first chip through the applied adhesive layer wherein a lower surface of the dummy chip is in contact with the adhesive layer; attaching a second chip to the dummy chip through the film adhesive; electrically coupling the second chip to the structure for making the external electrical connection; and encapsulating the first chip and the second chip against a portion of the supporting means with a molding compound; and wherein the maximum exothermic temperature of the adhesive layer is lower than that of the film adhesive.
Claim 16
Dependent Claim
23 words
The method of claim 12 , wherein a maximum exothermic temperature of the adhesive layer is lower than that of the film adhesive.
Claim 17
Dependent Claim
46 words
The method of claim 13 , wherein the step of attaching the second chip to the dummy chip is performed so that the second chip is positioned with at least two opposite side edges thereof extending outwardly beyond corresponding opposite side edges of the dummy chip.
Claim 18
Dependent Claim
14 words
The method of claim 13 , wherein the film adhesive has a predetermined thickness.
Claim 19
Dependent Claim
79 words
The method of claim 13 , wherein the step of attaching the dummy chip to the first chip comprises curing the adhesive layer after the film adhesive has been provided on the dummy chip and the dummy chip has been placed with the lower surface thereof in contact with the adhesive layer on the first chip; and a curing temperature of the adhesive layer is lower than a temperature at which the film adhesive begins to show adhering properties.
Claim 20
Dependent Claim
21 words
The method of claim 16 , wherein said curing temperature is about 120° C. and said temperature is about 150° C.
Claim 21
Dependent Claim
70 words
The method of claim 12 , wherein the step of attaching the dummy chip to the first chip comprises curing the adhesive layer after the dummy chip has been placed with the lower surface thereof in contact with the adhesive layer on the first chip; and the step of providing the film adhesive on the upper surface of the dummy chip is performed after the adhesive layer has been cured.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-01-06 | 2006-07-08 | 2007-01-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-01-06 | 2010-07-08 | 2011-01-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-01-06 | 2014-07-08 | 2015-01-07 | $7700.00 | Window Closed / Lapsed |