US6051886A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Angularly offset stacked die multichip device and method of manufacture
Assignee: Micron Technology Inc
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Filing: 1998-07-24
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Granted: 2000-04-18
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Expires: 2018-07-24
Abstract
Abstract An offset die stacking arrangement is disclosed having at least one upper level die having a width which is less than the distance separating the opposing bonding sites of the underlying die. The upper die is fixed above the lower die and rotated within a plane parallel to the lower die through an angle which insures that none of the bonding sites of the lower die are obstructed by the upper die. Once the dice are fixed in this manner, the entire assembly is subjected to the wire bonding process with all of the bonds being made in the same step.
Inventors
- 👤 Rich Fogal
- 👤 Michael B. Ball
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 06:45
CPC Classifications
H; H10; H10W; H10W90/00; H10W72/00; H10W72/50; H10W72/541; H10W72/5445; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W90/20; H10W90/24; H10W90/701; H10W90/731; H10W90/732; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
177 words
A stacked die multichip device comprising: a substrate; a lower die having two opposing side edges each including bonding sites therealong, a base surface and an upper surface, the lower die being attached to the substrate with the lower die's base surface facing the substrate; an upper die having a base surface and an upper surface, and having a width less than the distance separating any two opposing bonding sites along the opposing side edges of the lower die; the upper die being attached above the lower die with the upper die's base surface facing the upper surface of the lower die; and the upper die being rotated, in a plane substantially parallel to the upper surface of the lower die, through an angle sufficient to insure that no portion of the upper die interferes with a vertical line of sight of any bonding site on the lower die to permit wire bonding of the same, the upper die being fixed in this position and receiving no additional underlying support beyond that gained from the lower die.
Claim 2
Dependent Claim
177 words
A stacked die multichip device comprising: a substrate; a lower die having two opposing side edges each including bonding sites therealong, a base surface and an upper surface, the lower die being attached to the substrate with the lower die's base surface facing the substrate; an upper die having a base surface and an upper surface, and having a width less than the distance separating any two opposing bonding sites along the opposing side edges of the lower die; the upper die being attached above the lower die with the upper die's base surface facing the upper surface of the lower die; and the upper die being rotated, in a plane substantially parallel to the upper surface of the lower die, through an angle sufficient to insure that no portion of the upper die interferes with a vertical line of sight of any bonding site on the lower die to permit wire bonding of the same, the upper die being fixed in this position and receiving no additional underlying support beyond that gained from the lower die.
Claim 3
Dependent Claim
139 words
A multichip stack, comprising: a first chip comprising: a first central area supported by an underlying structure, a first side peripheral to said first central area and unsupported by an underlying structure, and a second side peripheral to said first central area and opposing said first side across said first central area, wherein said first side and said second side independently define a chip width; and a second chip underlying said first chip and rotatedly offset from said first chip with respect to a central axis common to said first chip and said second chip, said second chip comprising: a second central area, a third side peripheral to said second central area, a fourth side peripheral to said second central area and opposing said third side across said second central area, clearance area with respect to said first die.
Claim 4
Dependent Claim
139 words
A multichip stack, comprising: a first chip comprising: a first central area supported by an underlying structure, a first side peripheral to said first central area and unsupported by an underlying structure, and a second side peripheral to said first central area and opposing said first side across said first central area, wherein said first side and said second side independently define a chip width; and a second chip underlying said first chip and rotatedly offset from said first chip with respect to a central axis common to said first chip and said second chip, said second chip comprising: a second central area, a third side peripheral to said second central area, a fourth side peripheral to said second central area and opposing said third side across said second central area, clearance area with respect to said first die.
Claim 5
Dependent Claim
39 words
The multichip stack in claim 2, wherein said first chip further comprises: a first bond pad area along said first side of said first chip; and a second bond pad area along said second side of said first chip.
Claim 6
Dependent Claim
62 words
A multichip device, comprising: a first semiconductor die having a bonding site; and a plurality of semiconductor dies stacked over said first semiconductor die, wherein each die of said plurality is unobstructedly rotated with respect to access to a bonding site of every underlying die, and wherein each die of said plurality is unsupported in a region extending past an underlying die.
Claim 7
Dependent Claim
62 words
A multichip device, comprising: a first semiconductor die having a bonding site; and a plurality of semiconductor dies stacked over said first semiconductor die, wherein each die of said plurality is unobstructedly rotated with respect to access to a bonding site of every underlying die, and wherein each die of said plurality is unsupported in a region extending past an underlying die.
Claim 8
Dependent Claim
45 words
A multichip arrangement, comprising a plurality of semiconductor devices stacked one on top of the other in a helix formation, wherein a bond pad in each semiconductor device is exposed, and wherein an end of at least one semiconductor device of said plurality is unsupported.
Claim 9
Dependent Claim
45 words
A multichip arrangement, comprising a plurality of semiconductor devices stacked one on top of the other in a helix formation, wherein a bond pad in each semiconductor device is exposed, and wherein an end of at least one semiconductor device of said plurality is unsupported.
Claim 10
Dependent Claim
17 words
The multichip arrangement in claim 5, wherein every bond pad in said each semiconductor device is exposed.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-04-18 | 2003-10-18 | 2004-04-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-04-18 | 2007-10-18 | 2008-04-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-04-18 | 2011-10-18 | 2012-04-18 | $7700.00 | Window Closed / Lapsed |