US5313693A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Device for the mounting of very wide-band microwave integrated circuits
Assignee: Thales SA
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Filing: 1992-11-03
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Granted: 1994-05-24
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Expires: 2012-11-03
Abstract
Abstract The integrated circuit chips (5) are mounted on a ferrite support (20). The ferrite support is metallized uniformly (26) on its lower face and bears metallization zones (21, 24) on its other face. To certain of these zones (24) serving as a ground plane, there are attached the integrated circuit chips (5). The other zones (21) act as relays to connect the supply voltages that are applied by means of a linking wire (7') and a thin film decoupling capacitor (10, 11, 12) borne by the chip. The ground zones (24) are connected to the general ground plane (26) by metallized holes (25). The linking wire (7') is positioned so as to face a bared part of the ferrite to prevent any parasitic resonance.
Inventors
- 👤 Gerard Cachier
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 16:05
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/20; H10W44/601; H10W72/00; H10W72/90; H10W72/50; H10W72/531; H10W72/5363; H10W72/541; H10W72/5445; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W72/921; H10W72/923; H10W72/931; H10W72/932; H10W72/934; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
78 words
A device for the mounting of chips of very wide-band microwave monolithic integrated circuits comprising capacitors for the decoupling of the DC supplies of said circuits, said device comprising: a ferrite support on which said chips are fixed; and connection means to connect said capacitors to said supplies including metallized connection zones on said support and linking wires connecting said zones to said decoupling capacitors and being positioned so as to face bared parts of said ferrite support.
Claim 2
Independent Claim
78 words
A device for the mounting of chips of very wide-band microwave monolithic integrated circuits comprising capacitors for the decoupling of the DC supplies of said circuits, said device comprising: a ferrite support on which said chips are fixed; and connection means to connect said capacitors to said supplies including metallized connection zones on said support and linking wires connecting said zones to said decoupling capacitors and being positioned so as to face bared parts of said ferrite support.
Claim 3
Independent Claim
149 words
A device for the mounting of chips of very wide-band microwave monolithic integrated circuits comprising capacitors for the decoupling of the DC supplies of said circuits, said device comprising: a ferrite support on which said chips are fixed; and connection means to connect said capacitors to said supplies including metallized connection zones on said support and linking wires connecting said zones to said decoupling capacitors and being positioned so as to face bared parts of said ferrite support, wherein said ferrite support comprises, on a first face, a uniform metallization to form a general ground plane and, on the opposite face, a plurality of metallization zones, certain of which act as ground planes for the chips that are attached thereto and are connected to said general ground plane by at least a metallized hole going through the ferrite support and the others of which constitute said metallized connections zones.
Claim 4
Independent Claim
149 words
A device for the mounting of chips of very wide-band microwave monolithic integrated circuits comprising capacitors for the decoupling of the DC supplies of said circuits, said device comprising: a ferrite support on which said chips are fixed; and connection means to connect said capacitors to said supplies including metallized connection zones on said support and linking wires connecting said zones to said decoupling capacitors and being positioned so as to face bared parts of said ferrite support, wherein said ferrite support comprises, on a first face, a uniform metallization to form a general ground plane and, on the opposite face, a plurality of metallization zones, certain of which act as ground planes for the chips that are attached thereto and are connected to said general ground plane by at least a metallized hole going through the ferrite support and the others of which constitute said metallized connections zones.
Claim 5
Dependent Claim
17 words
A device according to claim 2, wherein said ferrite is a pure nickel ferrite with low permeability.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-05-23 | 1997-11-22 | 1998-05-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-05-23 | 2001-11-22 | 2002-05-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-05-23 | 2005-11-22 | 2006-05-24 | $7700.00 | Window Closed / Lapsed |