US6462273B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor card and method of fabrication
Assignee: Siemens Communications Inc
•
Filing: 2001-03-16
•
Granted: 2002-10-08
•
Expires: 2021-03-16
Abstract
Abstract A semiconductor card includes a printed circuit substrate and one or more semiconductor components, such as dice or packages, mounted to the substrate. The substrate is initially a segment of a strip containing several substrates. The substrate is defined by a peripheral opening in the strip, and is connected to the strip by connecting segments. The card also includes a plastic body molded to the substrate and having notches that initially align with the connecting segments. The notches provide access for severing the connecting segments, and also enclose any slivers of substrate material resulting from severing of the connecting segments. A method for fabricating the package includes the steps of providing the strip, and providing a molding apparatus configured to mold the plastic body to the substrate. The molding apparatus includes pins configured to contact the connecting segments to form the notches. A system for performing the method includes the strip, the molding apparatus and a punch apparatus for severing the connecting segments.
Inventors
- 👤 David J. Corisis
- 👤 Todd O. Bolken
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 21:41
CPC Classifications
H; H05; H05K; H05K5/00; H05K5/02; H05K5/0256; H05K5/026; G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; H05K5/06; H05K5/065; H10; H10W; H10W72/00; H10W72/50; H10W72/541; H10W72/5445; H10W72/5449; H10W72/90; H10W72/931; H10W72/932; H10W74/00
Claims Analysis
Total Claims: 60
Claim 1
Independent Claim
63 words
A semiconductor card comprising: a substrate comprising a segment of a strip; at least one semiconductor component on the substrate; and a plastic body on the substrate at least partially covering the semiconductor component, the plastic body having at least one notch therein configured to at least partially enclose a portion of a connecting segment which initially attaches the substrate to the strip.
Claim 2
Dependent Claim
63 words
A semiconductor card comprising: a substrate comprising a segment of a strip; at least one semiconductor component on the substrate; and a plastic body on the substrate at least partially covering the semiconductor component, the plastic body having at least one notch therein configured to at least partially enclose a portion of a connecting segment which initially attaches the substrate to the strip.
Claim 3
Dependent Claim
13 words
The semiconductor card of claim 1 wherein the substrate comprises a polymer resin.
Claim 4
Dependent Claim
17 words
The semiconductor card of claim 1 further comprising an encapsulant on the substrate encapsulating the semiconductor component.
Claim 5
Dependent Claim
17 words
The semiconductor card of claim 1 wherein the plastic body leaves a side of the substrate exposed.
Claim 6
Dependent Claim
14 words
The semiconductor card of claim 1 wherein the plastic body comprises an epoxy resin.
Claim 7
Dependent Claim
76 words
A semiconductor card comprising: a printed circuit substrate which is initially a segment of a strip and initially connected to the strip with a plurality of connecting segments; at least one semiconductor component on the substrate; and a plastic body molded to the substrate on the semiconductor component, the plastic body comprising an edge portion and a plurality of notches in the edge portion configured to enclose portions of the connecting segments remaining on the substrate.
Claim 8
Dependent Claim
76 words
A semiconductor card comprising: a printed circuit substrate which is initially a segment of a strip and initially connected to the strip with a plurality of connecting segments; at least one semiconductor component on the substrate; and a plastic body molded to the substrate on the semiconductor component, the plastic body comprising an edge portion and a plurality of notches in the edge portion configured to enclose portions of the connecting segments remaining on the substrate.
Claim 9
Dependent Claim
23 words
The semiconductor card of claim 6 wherein the substrate comprises a peripheral edge and the plastic body is molded to the peripheral edge.
Claim 10
Dependent Claim
17 words
The semiconductor card of claim 6 further comprising an encapsulant on the substrate encapsulating the semiconductor component.
Claim 11
Dependent Claim
22 words
The semiconductor card of claim 6 wherein the portions of the connecting segments comprise at least one sliver contained in a notch.
Claim 12
Dependent Claim
37 words
The semiconductor card of claim 6 wherein the substrate comprises a circuit side wherein the plastic body is molded and an exposed back side having a plurality of external contacts in electrical communication with the semiconductor component.
Claim 13
Dependent Claim
23 words
The semiconductor card of claim 6 wherein the semiconductor component comprises a semiconductor die wire bonded or flip chip mounted to the substrate.
Claim 14
Dependent Claim
18 words
The semiconductor card of claim 6 wherein the semiconductor component comprises a semiconductor package bonded to the substrate.
Claim 15
Dependent Claim
14 words
The semiconductor card of claim 6 wherein the plastic body comprises an epoxy resin.
Claim 16
Dependent Claim
131 words
A semiconductor card comprising: a printed circuit substrate comprising a circuit side having a plurality of conductors thereon, a back side having a plurality of external contacts thereon in electrical communication with the conductors, and a peripheral edge; at least one semiconductor component on the circuit side in electrical communication with the conductors; and a plastic body molded to the circuit side and the peripheral edge and covering the semiconductor component, the plastic body comprising an edge portion and at least one notch in the edge portion configured to enclose a selected portion of the peripheral edge such that an outline of the card is not affected by a sliver on the selected portion, the sliver comprising a portion of a connecting segment configured to attach the substrate to a panel.
Claim 17
Dependent Claim
131 words
A semiconductor card comprising: a printed circuit substrate comprising a circuit side having a plurality of conductors thereon, a back side having a plurality of external contacts thereon in electrical communication with the conductors, and a peripheral edge; at least one semiconductor component on the circuit side in electrical communication with the conductors; and a plastic body molded to the circuit side and the peripheral edge and covering the semiconductor component, the plastic body comprising an edge portion and at least one notch in the edge portion configured to enclose a selected portion of the peripheral edge such that an outline of the card is not affected by a sliver on the selected portion, the sliver comprising a portion of a connecting segment configured to attach the substrate to a panel.
Claim 18
Dependent Claim
18 words
The semiconductor card of claim 14 further comprising an encapsulant on the circuit side encapsulating the semiconductor component.
Claim 19
Dependent Claim
14 words
The semiconductor card of claim 14 wherein the notch has a generally hemispherical shape.
Claim 20
Dependent Claim
124 words
A semiconductor card comprising: a printed circuit substrate comprising a circuit side having a plurality of conductors thereon, a back side having a plurality of external contacts thereon in electrical communication with the conductors, and a peripheral edge; at least one semiconductor component on the circuit side in electrical communication with the conductors; an encapsulant on the circuit side encapsulating the semiconductor component; and a plastic body molded to the circuit side and the peripheral edge and covering the semiconductor component, the plastic body comprising an edge portion and at least one notch in the edge portion configured to enclose a selected portion of the peripheral edge such that an outline of the card is not affected by a sliver on the selected portion.
Claim 21
Dependent Claim
124 words
A semiconductor card comprising: a printed circuit substrate comprising a circuit side having a plurality of conductors thereon, a back side having a plurality of external contacts thereon in electrical communication with the conductors, and a peripheral edge; at least one semiconductor component on the circuit side in electrical communication with the conductors; an encapsulant on the circuit side encapsulating the semiconductor component; and a plastic body molded to the circuit side and the peripheral edge and covering the semiconductor component, the plastic body comprising an edge portion and at least one notch in the edge portion configured to enclose a selected portion of the peripheral edge such that an outline of the card is not affected by a sliver on the selected portion.
Claim 22
Dependent Claim
22 words
The semiconductor card of claim 17 wherein the semiconductor component comprises a die wire bonded or flip chip mounted to the substrate.
Claim 23
Dependent Claim
19 words
The semiconductor card of claim 17 wherein the semiconductor component comprises a package having contacts bonded to the substrate.
Claim 24
Dependent Claim
118 words
A semiconductor card comprising: a printed circuit substrate comprising a reinforced organic polymer resin, the substrate initially defined by a peripheral opening in a strip and attached to the strip with a plurality of connecting segments, the substrate having a circuit side, a back side with a plurality of external contacts thereon, and a peripheral edge; at least one semiconductor component on the circuit side in electrical communication with the external contacts; and a plastic body molded to the circuit side and to the peripheral edge and covering the semiconductor component while leaving the back side exposed, the plastic body comprising a plurality of notches configured to enclose portions of the peripheral edge proximate to the connecting segments.
Claim 25
Dependent Claim
118 words
A semiconductor card comprising: a printed circuit substrate comprising a reinforced organic polymer resin, the substrate initially defined by a peripheral opening in a strip and attached to the strip with a plurality of connecting segments, the substrate having a circuit side, a back side with a plurality of external contacts thereon, and a peripheral edge; at least one semiconductor component on the circuit side in electrical communication with the external contacts; and a plastic body molded to the circuit side and to the peripheral edge and covering the semiconductor component while leaving the back side exposed, the plastic body comprising a plurality of notches configured to enclose portions of the peripheral edge proximate to the connecting segments.
Claim 26
Dependent Claim
22 words
The semiconductor card of claim 20 wherein at least one portion of the peripheral edge comprises a sliver of a connecting segment.
Claim 27
Dependent Claim
14 words
The semiconductor card of claim 20 wherein the notches are generally hemispherical in shape.
Claim 28
Dependent Claim
15 words
The semiconductor card of claim 20 wherein the plastic body comprises a novolac epoxy resin.
Claim 29
Dependent Claim
13 words
The semiconductor card of claim 20 wherein the plastic body comprises four notches.
Claim 30
Independent Claim
73 words
A method for fabricating a semiconductor card comprising: providing a strip comprising a substrate and at least one connecting segment connecting the substrate to the strip; mounting at least one semiconductor component to the substrate; molding a plastic body on the substrate and over the semiconductor component; and forming a notch in the plastic body during the molding step configured to enclose an edge portion of the substrate proximate to the connecting segment.
Claim 31
Independent Claim
73 words
A method for fabricating a semiconductor card comprising: providing a strip comprising a substrate and at least one connecting segment connecting the substrate to the strip; mounting at least one semiconductor component to the substrate; molding a plastic body on the substrate and over the semiconductor component; and forming a notch in the plastic body during the molding step configured to enclose an edge portion of the substrate proximate to the connecting segment.
Claim 32
Dependent Claim
25 words
The method of claim 25 wherein the molding step is performed by placing a pin in contact with the connecting segment to form the notch.
Claim 33
Dependent Claim
31 words
The method of claim 25 wherein the substrate comprises a circuit side and a peripheral edge and the plastic body is molded to the circuit side and to the peripheral edge.
Claim 34
Dependent Claim
13 words
The method of claim 25 wherein the plastic body comprises an epoxy resin.
Claim 35
Dependent Claim
14 words
The method of claim 25 wherein the substrate comprises a reinforced organic polymer resin.
Claim 36
Dependent Claim
22 words
The method of claim 25 wherein the mounting step comprises wire bonding or flip chip mounting the semiconductor component to the substrate.
Claim 37
Independent Claim
111 words
A method for fabricating a semiconductor card comprising: providing a strip comprising a plurality of substrates, the strip comprising a plurality of peripheral openings defining the substrates and a plurality of connecting segments attaching the substrates to the strip; mounting a plurality of semiconductor components to the substrates; molding a plurality of plastic bodies to the substrates; placing a plurality of pins on the connecting segments during the molding step configured to form a plurality of notches in the plastic bodies proximate to the connecting segments; and severing the connecting segments using the notches to provide access and to enclose portions of the connecting segments which remain following the severing step.
Claim 38
Independent Claim
111 words
A method for fabricating a semiconductor card comprising: providing a strip comprising a plurality of substrates, the strip comprising a plurality of peripheral openings defining the substrates and a plurality of connecting segments attaching the substrates to the strip; mounting a plurality of semiconductor components to the substrates; molding a plurality of plastic bodies to the substrates; placing a plurality of pins on the connecting segments during the molding step configured to form a plurality of notches in the plastic bodies proximate to the connecting segments; and severing the connecting segments using the notches to provide access and to enclose portions of the connecting segments which remain following the severing step.
Claim 39
Dependent Claim
17 words
The method of claim 31 wherein the severing step is performed by placing cutters through the notches.
Claim 40
Dependent Claim
21 words
The method of claim 31 wherein the substrates comprise peripheral edges and the plastic bodies are molded to the peripheral edges.
Claim 41
Dependent Claim
22 words
The method of claim 31 further comprising encapsulating the semiconductor components with an encapsulant and covering the encapsulant with the plastic bodies.
Claim 42
Dependent Claim
28 words
The method of claim 31 wherein the substrates comprise circuit sides wherein the semiconductor components are mounted and back side which are not covered by the plastic bodies.
Claim 43
Independent Claim
127 words
A method for fabricating a semiconductor card comprising: providing a strip comprising a plurality of reinforced organic polymer substrates, the strip comprising a plurality of peripheral openings defining the substrates and a plurality of connecting segments attaching the substrates to the strip; mounting a plurality of semiconductor components to the substrates; providing a molding apparatus comprising a plurality of mold cavities containing a plurality of pins configured to contact the connecting segments and to mold plastic bodies on the substrate having notches aligned with the connecting segments; molding the plastic bodies to the substrates using the molding apparatus; providing a punch apparatus comprising a plurality of cutters configured to move through the notches to sever the connecting segments; and severing the connecting segments using the punch apparatus.
Claim 44
Independent Claim
127 words
A method for fabricating a semiconductor card comprising: providing a strip comprising a plurality of reinforced organic polymer substrates, the strip comprising a plurality of peripheral openings defining the substrates and a plurality of connecting segments attaching the substrates to the strip; mounting a plurality of semiconductor components to the substrates; providing a molding apparatus comprising a plurality of mold cavities containing a plurality of pins configured to contact the connecting segments and to mold plastic bodies on the substrate having notches aligned with the connecting segments; molding the plastic bodies to the substrates using the molding apparatus; providing a punch apparatus comprising a plurality of cutters configured to move through the notches to sever the connecting segments; and severing the connecting segments using the punch apparatus.
Claim 45
Dependent Claim
37 words
The method of claim 36 wherein the substrate comprise peripheral edges and the notches are located proximate to the peripheral edges and are configured to enclose portions of the connecting segments which remain following the severing step.
Claim 46
Dependent Claim
18 words
The method of claim 36 wherein the mounting step comprises wire bonding the semiconductor components to the substrate.
Claim 47
Dependent Claim
19 words
The method of claim 36 wherein the mounting step comprises flip chip mounting the semiconductor components to the substrate.
Claim 48
Dependent Claim
17 words
The method of claim 36 wherein the mounting step comprises bonding the semiconductor components to the substrate.
Claim 49
Independent Claim
107 words
A method for fabricating a semiconductor card comprising: providing a strip comprising a substrate and a plurality of connecting segments connecting the substrate to the strip, the substrate comprising a circuit side, a back side having a plurality of external contacts and a peripheral edge; mounting at least one semiconductor component to the circuit side in electrical communication with the external contacts; molding a plastic body on the circuit side comprising an edge portion on the peripheral edge; forming a plurality of notches in the edge portion during the molding step proximate to the peripheral edge; and severing the connecting segments by moving cutters through the notches.
Claim 50
Independent Claim
107 words
A method for fabricating a semiconductor card comprising: providing a strip comprising a substrate and a plurality of connecting segments connecting the substrate to the strip, the substrate comprising a circuit side, a back side having a plurality of external contacts and a peripheral edge; mounting at least one semiconductor component to the circuit side in electrical communication with the external contacts; molding a plastic body on the circuit side comprising an edge portion on the peripheral edge; forming a plurality of notches in the edge portion during the molding step proximate to the peripheral edge; and severing the connecting segments by moving cutters through the notches.
Claim 51
Dependent Claim
16 words
The method of claim 41 further comprising encapsulating the semiconductor component prior to the molding step.
Claim 52
Dependent Claim
25 words
The method of claim 41 wherein the molding step is performed using a mold cavity having a plurality of pins for contacting the connecting segments.
Claim 53
Dependent Claim
13 words
The method of claim 41 wherein the plastic body comprises an epoxy resin.
Claim 54
Dependent Claim
20 words
The method of claim 41 wherein the mounting step comprises wire bonding, bonding or flip chip mounting the semiconductor components.
Claim 55
Independent Claim
77 words
A system for fabricating a semiconductor card comprising: a strip comprising a plurality of reinforced organic polymer substrates, the strip comprising a plurality of peripheral openings defining the substrates and a plurality of connecting segments attaching the substrates to the strip; and a molding apparatus comprising a plurality of mold cavities containing a plurality of pins configured to contact the connecting segments and to mold plastic bodies on the substrate having notches aligned with the connecting segments.
Claim 56
Independent Claim
77 words
A system for fabricating a semiconductor card comprising: a strip comprising a plurality of reinforced organic polymer substrates, the strip comprising a plurality of peripheral openings defining the substrates and a plurality of connecting segments attaching the substrates to the strip; and a molding apparatus comprising a plurality of mold cavities containing a plurality of pins configured to contact the connecting segments and to mold plastic bodies on the substrate having notches aligned with the connecting segments.
Claim 57
Dependent Claim
26 words
The system of claim 46 further comprising a punch apparatus comprising a plurality of cutters configured to move through the notches to sever the connecting segments.
Claim 58
Dependent Claim
35 words
The system of claim 46 the substrates comprise circuit sides, back sides and peripheral edges and the molding apparatus is configured to mold the plastic bodies to the circuit sides and to the peripheral edges.
Claim 59
Dependent Claim
17 words
The system of claim 46 wherein the notches are configured to enclose slivers of the connecting segments.
Claim 60
Dependent Claim
21 words
The system of claim 46 wherein the molding apparatus is configured to mold an epoxy resin to form the plastic bodies.
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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