Ultra-thin composite package for integrated circuits

Claim 2

A semiconductor device package, comprising: (a) a metal base having a top surface and a cavity formed in the top surface; (b) a lead frame having a plurality of leads, the lead frame being supported by the top surface of the base; (c) an insulating layer positioned between the lead frame and the top surface of the base, the insulating layer being arranged to electrically insulate the lead frame from the base; (d) an integrated circuit die received within the base cavity and electrically coupled to the lead frame; (e) a plastic cap molded over the top surface of the metal base, the die and an inner portion of lead frame, the cap cooperating with the base to encapsulate the die wherein the plastic cap is in direct contact with the integrated circuit die; and (f) wherein the lead frame includes a lead tip portion having a first thickness that is under the cap and a pin portion having a second thickness that is outside the cap, the lead tip portion being thinner than the pin portion.

Claim 3

A semiconductor device as recited in claim 1 wherein the lead tip portion is approximately 3 mils thick and the pin portion is approximately 6 mils thick.

Claim 4

A semiconductor device package as recited in claim 1 where the lead frame is formed from copper or a copper alloy.

Claim 5

A semiconductor device package as recited in claim 1 wherein the metal base is formed from anodized aluminum.

Claim 6

A semiconductor device package as recited in claim 1 wherein the metal base thickness is less than or equal to approximately 12 mils.

Claim 7

A semiconductor device package as recited in claim 1 wherein the depth of the cavity is at least half the thickness of the metal base.

Claim 8

A semiconductor device package as recited in claim 1 wherein the bonding wire loop height extends 4 to 5 mils above the top of the die surface.

Claim 9

A semiconductor device package as recited in claim 5 wherein the die thickness is in the range of approximately 6 to 10 mils.

Claim 10

A semiconductor device package, comprising: (a) a metal base having a top surface and a cavity formed in the top surface, wherein the metal base thickness is less than or equal to approximately 12 mils; (b) a lead frame having a plurality of leads, the lead frame being supported by the top surface of the base; (c) an insulating layer positioned between the lead frame and the top surface of the base, the insulating layer being arranged to electrically insulate the lead frame from the base; (d) an integrated circuit die received within the base cavity and electrically coupled to the lead frame, wherein the die thickness is in the range of approximately 6 to 10 mils; (e) a plastic cap molded over the top surface of the metal base, the die and an inner portion of lead frame, the cap cooperating with the base to encapsulate the die wherein the plastic cap is in direct contact with the integrated circuit die and wherein the molded plastic cap is in the range of approximately 6-12 mils thick.

Claim 11

A semiconductor device package, comprising: (a) a metal base having a top surface and a cavity formed in the top surface, wherein the metal base thickness is less than or equal to approximately 12 mils; (b) a lead frame having a plurality of leads, the lead frame being supported by the top surface of the base; (c) an insulating layer positioned between the lead frame and the top surface of the base, the insulating layer being arranged to electrically insulate the lead frame from the base; (d) an integrated circuit die received within the base cavity and electrically coupled to the lead frame, wherein the die thickness is in the range of approximately 6 to 10 mils; (e) a plastic cap molded over the top surface of the metal base, the die and an inner portion of lead frame, the cap cooperating with the base to encapsulate the die wherein the plastic cap is in direct contact with the integrated circuit die and wherein the molded plastic cap is in the range of approximately 6-12 mils thick.

Claim 12

A semiconductor device package as recited in claim 1 wherein bonding wires electrically couple the die to the lead frame.

Claim 13

A semiconductor device package as recited in claim 1 wherein the second thickness is completely outside the cap.

Claim 14

A semiconductor device package as recited in claim 11 wherein the first thickness is completely under the cap.

Claim 15

A semiconductor device package, comprising: (a) a metal base having a top surface and a cavity formed in the top surface; (b) the lead frame having a plurality of leads, the lead frame being supported by the top surface of the base and including a lead tip portion having a first thickness and a pin portion having a second thickness, the lead tip portion being thinner than the pin portion; (c) an insulating layer positioned between the lead frame and the top surface of the base, the insulating layer being arranged to electrically insulate the lead frame from the base; (d) an integrated circuit die received within the base cavity and electrically coupled to the lead frame; (e) a cap molded directly over the top surface of the metal base, the die and an inner portion of lead frame having the first thickness, the cap being arranged such that the cap does not overlap any portion of the lead frame having the second thickness, the cap cooperating with the base to encapsulate the die.

Claim 16

A semiconductor device package, comprising: (a) a metal base having a top surface and a cavity formed in the top surface; (b) the lead frame having a plurality of leads, the lead frame being supported by the top surface of the base and including a lead tip portion having a first thickness and a pin portion having a second thickness, the lead tip portion being thinner than the pin portion; (c) an insulating layer positioned between the lead frame and the top surface of the base, the insulating layer being arranged to electrically insulate the lead frame from the base; (d) an integrated circuit die received within the base cavity and electrically coupled to the lead frame; (e) a cap molded directly over the top surface of the metal base, the die and an inner portion of lead frame having the first thickness, the cap being arranged such that the cap does not overlap any portion of the lead frame having the second thickness, the cap cooperating with the base to encapsulate the die.

Claim 17

A semiconductor device package as recited in claim 13 where lead tip portion is approximately 3 mils thick and the outer portion is approximately 6 mils thick.