US5155299A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Aluminum alloy semiconductor packages
Assignee: Advanced Technology Interconnect Inc
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Filing: 1991-06-10
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Granted: 1992-10-13
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Expires: 2011-06-10
Abstract
Abstract The present invention relates to a packagae adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum based alloy. At least a portion of the surfaces of the package components are anodized to enhance corrosion resistance and increase bond strength. The aluminum based packages are characterized by lighter weight than cooper based packages and better thermal conductivity than plastic based packages.
Inventors
- 👤 Deepak Mahulikar
- 👤 James M. Popplewell
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 03:05
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/6875; H10W76/17; H10W76/60; H10W70/682; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
86 words
A package for encasing an electronic device, comprising: an aluminum or aluminum alloy base component; a cover component; said aluminum or aluminum alloy base component and said cover component defining a cavity; a leadframe disposed between and bonded to both said aluminum or aluminum alloy base component and said cover component by separate layers of adhesive; and an anodization layer covering at least that portion of said aluminum or aluminum alloy base component exposed to the atmosphere, wherein said cover component is essentially anodization layer free.
Claim 2
Dependent Claim
86 words
A package for encasing an electronic device, comprising: an aluminum or aluminum alloy base component; a cover component; said aluminum or aluminum alloy base component and said cover component defining a cavity; a leadframe disposed between and bonded to both said aluminum or aluminum alloy base component and said cover component by separate layers of adhesive; and an anodization layer covering at least that portion of said aluminum or aluminum alloy base component exposed to the atmosphere, wherein said cover component is essentially anodization layer free.
Claim 3
Dependent Claim
24 words
The package of claim 1 wherein the thickness of the anodization layer is in the range of from about 10 to about 2000 microinches.
Claim 4
Dependent Claim
23 words
The package of claim 2 wherein a seal area of said aluminum or aluminum alloy base component is covered by an anodization layer.
Claim 5
Dependent Claim
19 words
The package of claim 3 wherein the surface of the anodization layer has been roughened to improve bond strength.
Claim 6
Dependent Claim
28 words
The package of claim 3 wherein said lead frame is bondable to said aluminum or aluminum alloy base component and to said cover component by a resin adhesive.
Claim 7
Dependent Claim
24 words
The package of claim 5 wherein substantially the entire surface of the aluminum or aluminum alloy base component is covered with an anodization layer.
Claim 8
Dependent Claim
35 words
The package of claim 5 wherein substantially the entire surface of the aluminum or aluminum alloy base component except for that surface to be bonded to said electronic device is covered with an anodization layer.
Claim 9
Dependent Claim
29 words
The package of claim 5 wherein said aluminum or aluminum alloy base component is comprised of an aluminum based alloy containing up to about 1.5 percent by weight manganese.
Claim 10
Dependent Claim
33 words
The package of claim 2 further including a window frame component having first and second surfaces and disposed between said leadframe and said cover component and adapted to be adhesively bonded to both.
Claim 11
Dependent Claim
102 words
A process for assembling a package for encasing an electronic device, comprising the steps of: providing a base component and a cover component, said base component comprised of aluminum or an aluminum based alloy; anodizing at least that portion of the surfaces of said base component exposed to the atmosphere, while maintaining said cover component essentially anodization layer free; disposing a leadframe between said base component and said cover component; and bonding said leadframe to both said base component and said cover component with separate layers of adhesive subsequent to connecting said electronic device to said base component and to said leadframe.
Claim 12
Dependent Claim
102 words
A process for assembling a package for encasing an electronic device, comprising the steps of: providing a base component and a cover component, said base component comprised of aluminum or an aluminum based alloy; anodizing at least that portion of the surfaces of said base component exposed to the atmosphere, while maintaining said cover component essentially anodization layer free; disposing a leadframe between said base component and said cover component; and bonding said leadframe to both said base component and said cover component with separate layers of adhesive subsequent to connecting said electronic device to said base component and to said leadframe.
Claim 13
Dependent Claim
16 words
The process of claim 10 including masking a portion of said base component prior to anodization.
Claim 14
Dependent Claim
14 words
The process of claim 10 including anodizing a seal area of said base component.
Claim 15
Dependent Claim
17 words
The process of claim 12 including the step of increasing the surface roughness of the anodization layer.
Claim 16
Dependent Claim
31 words
The process of claim 11 including disposing a window frame component between said leadframe and said cover component and bonding said window frame to said leadframe and to said cover component.
Claim 17
Dependent Claim
24 words
The process of claim 14 including bonding said cover component to said window frame component subsequent to bonding said window frame to said leadframe.
Claim 18
Dependent Claim
85 words
A package for encasing an electronic device, comprising: a base component formed from an aluminum based alloy containing up to about 1.5% by weight manganese; a cover component formed from a material other than aluminum or an aluminum alloy; said base component and said cover component defining a cavity; a leadframe disposed between and bonded to said base component and to said cover component with a resin adhesive; and an anodization layer covering at least that portion of said base component exposed to the atmosphere.
Claim 19
Dependent Claim
85 words
A package for encasing an electronic device, comprising: a base component formed from an aluminum based alloy containing up to about 1.5% by weight manganese; a cover component formed from a material other than aluminum or an aluminum alloy; said base component and said cover component defining a cavity; a leadframe disposed between and bonded to said base component and to said cover component with a resin adhesive; and an anodization layer covering at least that portion of said base component exposed to the atmosphere.
Claim 20
Dependent Claim
20 words
The package of claim 16 wherein substantially the entire surface of said base component is covered with an anodization layer.
Claim 21
Dependent Claim
31 words
The package of claim 16 wherein substantially the entire surface of said base component except for that surface to be bonded to said electronic device is covered with an anodization layer.
Claim 22
Dependent Claim
24 words
The package of claim 16 wherein the thickness of said anodization layer is in the range of from about 10 to about 2000 microinches.
Claim 23
Dependent Claim
87 words
A package for encasing an electronic device, comprising: a base component formed from aluminum or an aluminum alloy; a cover component formed from a material other than aluminum or an aluminum alloy; a window frame component having first and second surfaces disposed between said base component and said cover component; a leadframe disposed between and adhesively bonded to said base component and a first side of said window frame component; and an anodization layer covering at least that portion of said base component exposed to the atmosphere.
Claim 24
Dependent Claim
87 words
A package for encasing an electronic device, comprising: a base component formed from aluminum or an aluminum alloy; a cover component formed from a material other than aluminum or an aluminum alloy; a window frame component having first and second surfaces disposed between said base component and said cover component; a leadframe disposed between and adhesively bonded to said base component and a first side of said window frame component; and an anodization layer covering at least that portion of said base component exposed to the atmosphere.
Claim 25
Dependent Claim
20 words
The package of claim 20 wherein substantially the entire surface of said base component is covered with an anodization layer.
Claim 26
Dependent Claim
31 words
The package of claim 20 wherein substantially the entire surface of said base component except for that surface to be bonded to said electronic device is covered with an anodization layer.
Claim 27
Dependent Claim
24 words
The package of claim 20 wherein the thickness of said anodization layer is in the range of from about 10 to about 2000 microinches.
References Cited (Backward Citations)
GB817636A
Cited
US3689732A
Cited
US3871018A
Cited
US3767839A
Cited
US4105861A
Cited
US4202700A
Cited
US4410927A
Cited
US4461924A
Cited
US4594770A
Cited
US4480262A
Cited
US4784974A
Cited
US4656499A
Cited
US4521469A
Cited
US4525422A
Cited
US4582556A
Cited
US4524238A
Cited
US4498121A
Cited
US4572924A
Cited
US4707724A
Cited
US4775647A
Cited
US4542259A
Cited
JPS61281541A
Cited
US4704626A
Cited
US4711826A
Cited
US4769345A
Cited
JPS63233551A
Cited
US4961106A
Cited
US4796083A
Cited
JPS6435940A
Cited
US4888449A
Cited
US4897508A
Cited
US5013871A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-10-13 | 1996-04-13 | 1996-10-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-10-13 | 2000-04-13 | 2000-10-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-10-13 | 2004-04-13 | 2004-10-13 | $7700.00 | Window Closed / Lapsed |