US6163474A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Memory card which is thermally controlled
Assignee: Micron Technology Inc
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Filing: 1999-01-05
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Granted: 2000-12-19
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Expires: 2019-01-05
Abstract
Abstract A cartridge comprising a substrate, at least a first set of dies, at least a first thermally conductive cover and at least a first compliant thermally conductive pad. The substrate has first and second opposed sides and electrical contacts along an edge thereof. The dies of the first set have first and second opposed faces. The dies of the first set are mounted to the first side of the substrate with the first face of each die facing towards the first side of the substrate. The first thermally conductive cover has first and second opposed surfaces and is mounted over the dies with the first surface of the first thermally conductive cover facing towards the dies. The thermally conductive pad is located between the first set of dies and the thermally conductive cover thermally couples the second faces of at least two of the dies of the first set and the first surface of the first cover with one another.
Inventors
- 👤 Rangarajan K. Prasanna
- 👤 Murlidhar Tirumala
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 21:04
CPC Classifications
G; G11; G11C; G11C5/00; G11C5/06; G11C5/02; G11C5/04; G11C5/14; G11C5/143
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
149 words
A cartridge comprising: a substrate having first and second opposed sides and electrical contacts along an edge thereof; at least a first set of dies, each having first and second opposed faces, mounted to the first side of the substrate with the first face of each die of the first set facing towards the first side of the substrate; at least a first thermally conductive cover mounted over the first set of dies, the first thermally conductive cover having first and second opposed surfaces, wherein the first surface of the first thermally conductive cover faces towards the first set of dies; and at least a first compliant thermally conductive pad, located between the first set of dies and the first thermally conductive cover, which thermally couples the second faces of at least two dies of the first set and the first surface of the first cover with one another.
Claim 2
Dependent Claim
149 words
A cartridge comprising: a substrate having first and second opposed sides and electrical contacts along an edge thereof; at least a first set of dies, each having first and second opposed faces, mounted to the first side of the substrate with the first face of each die of the first set facing towards the first side of the substrate; at least a first thermally conductive cover mounted over the first set of dies, the first thermally conductive cover having first and second opposed surfaces, wherein the first surface of the first thermally conductive cover faces towards the first set of dies; and at least a first compliant thermally conductive pad, located between the first set of dies and the first thermally conductive cover, which thermally couples the second faces of at least two dies of the first set and the first surface of the first cover with one another.
Claim 3
Dependent Claim
49 words
The cartridge of claim 1, wherein the first set of dies are located on an area of the first side of the substrate which is less than 1.2 times the combined areas of the first side of the substrate covered by the individual respective dies of the first set.
Claim 4
Dependent Claim
20 words
The cartridge of claim 2 further comprising a respective micro ball grid array mounting each respective die to the substrate.
Claim 5
Dependent Claim
18 words
The cartridge of claim 1, wherein the second surface of the first thermally conductive cover is substantially flat.
Claim 6
Dependent Claim
12 words
The cartridge of claim 2, wherein the dies are DRAM memory dies.
Claim 7
Dependent Claim
20 words
The cartridge of claim 2, wherein the dies are operable at a speed of at least 400 megabits per second.
Claim 8
Dependent Claim
25 words
The cartridge of claim 1, wherein the first thermally conductive cover is made of a material selected from the group consisting of aluminum and copper.
Claim 9
Dependent Claim
134 words
The cartridge of claim 1 further comprising: a second set of dies, each having first and second opposed faces, mounted to the second side of the substrate with the first face of each die of the second set facing towards the second side of the substrate; at least a second thermally conductive cover mounted over the second set of dies, the second thermally conductive cover having first and second opposed surfaces, wherein the first surface of the second thermally conductive cover faces towards the second set of dies; and a second compliant thermally conductive pad, located between the second set of dies and the second thermally conductive cover, which thermally couples the second faces of at least two dies of the second set and the first surface of the second cover with one another.
Claim 10
Dependent Claim
49 words
The cartridge of claim 8 wherein the second set of dies are located on an area of the second side of the substrate which is less than 1.2 times the combined areas of the second side of the substrate covered by the individual respective dies of the second set.
Claim 11
Dependent Claim
197 words
A memory cartridge comprising: a substrate having first and second opposed sides; a first set of memory dies, each having first and second opposed faces, mounted to the first side of the substrate with the respective first faces of the first set of memory dies facing the first side of the substrate; a second set of memory dies, each having first and second opposed faces, mounted to the second side of the substrate with the respective first faces of the second set of memory dies facing the second side of the substrate; a first thermally conductive cover mounted over the first set of memory dies, the first thermally conductive cover having first and second opposed surfaces, wherein the first surface of the first thermally conductive cover faces towards and is thermally coupled to the respective second faces of the first set of memory dies; and a second thermally conductive cover mounted over the second set of memory dies, the second thermally conductive cover having first and second opposed surfaces, wherein the first surface of the second thermally conductive cover faces towards and is thermally coupled to the respective second faces of the second set of memory dies.
Claim 12
Dependent Claim
197 words
A memory cartridge comprising: a substrate having first and second opposed sides; a first set of memory dies, each having first and second opposed faces, mounted to the first side of the substrate with the respective first faces of the first set of memory dies facing the first side of the substrate; a second set of memory dies, each having first and second opposed faces, mounted to the second side of the substrate with the respective first faces of the second set of memory dies facing the second side of the substrate; a first thermally conductive cover mounted over the first set of memory dies, the first thermally conductive cover having first and second opposed surfaces, wherein the first surface of the first thermally conductive cover faces towards and is thermally coupled to the respective second faces of the first set of memory dies; and a second thermally conductive cover mounted over the second set of memory dies, the second thermally conductive cover having first and second opposed surfaces, wherein the first surface of the second thermally conductive cover faces towards and is thermally coupled to the respective second faces of the second set of memory dies.
Claim 13
Dependent Claim
52 words
The memory cartridge of claim 10, wherein the first set of memory dies are located on an area of the first side of the substrate which is less than 1.2 times the combined areas of the first side of the substrate covered by the individual respective memory dies of the first set.
Claim 14
Dependent Claim
52 words
The memory cartridge of claim 11, wherein the second set of memory dies are located on an area of the second side of the substrate which is less than 1.2 times the combined areas of the second side of the substrate covered by the individual respective memory dies of the second set.
Claim 15
Dependent Claim
28 words
The memory cartridge of claim 10 further comprising a first compliant thermally conductive pad located between the first set of memory dies and the first thermally conductive cover.
Claim 16
Dependent Claim
28 words
The memory cartridge of claim 13 further comprising a second compliant thermally conductive pad located between the second set of memory dies and the second thermally conductive cover.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-12-19 | 2004-06-19 | 2004-12-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-12-19 | 2008-06-19 | 2008-12-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-12-19 | 2012-06-19 | 2012-12-19 | $7700.00 | Window Closed / Lapsed |