Patent US6455930B1 successfully refreshed from Google Patents.
US6455930B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology
Assignee: Lighting Science Group Corp
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Filing: 2000-09-18
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Granted: 2002-09-24
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Expires: 2020-09-18
Abstract
Abstract Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.
Inventors
- 👤 Ponnuswamy Palanisamy
- 👤 Attiganal Narayanaswamy Sreeram
- 👤 Ellen Schwartz Tormey
- 👤 Barry Jay Thaler
- 👤 John Connolly
- 👤 Ramon Ubaldo Martinelli
- 👤 Ashok Narayan Prabhu
- 👤 Mark Stuart Hammond
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 22:02
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/02; H01S5/022; H01S5/023; H01S5/02325; H01S5/0225; H01S5/02251; H01S5/024; H01S5/02407; H01S5/02415; H01S5/02476; H01S5/02484; H10; H10W; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
98 words
A low temperature cofired ceramic-metal (LTCC-M) system integrated package comprising: at least one ceramic circuit board, the circuit board having one or more conductive traces, at least one electronic component mounted on the ceramic circuit board, the electronic component electrically connected to one or more of the conductive traces; a first metal substrate supporting the ceramic circuit board, the circuit board bonded to the metal substrate with a bonding material; and a second metal substrate thermally connected to the first metal substrate via thermoelectric plates, wherein the thermoelectric plates regulate and control the temperature of the electronic component.
Claim 2
Dependent Claim
98 words
A low temperature cofired ceramic-metal (LTCC-M) system integrated package comprising: at least one ceramic circuit board, the circuit board having one or more conductive traces, at least one electronic component mounted on the ceramic circuit board, the electronic component electrically connected to one or more of the conductive traces; a first metal substrate supporting the ceramic circuit board, the circuit board bonded to the metal substrate with a bonding material; and a second metal substrate thermally connected to the first metal substrate via thermoelectric plates, wherein the thermoelectric plates regulate and control the temperature of the electronic component.
Claim 3
Dependent Claim
19 words
An integrated package according to claim 1 further comprising a flip chip electrically connected to the ceramic circuit board.
Claim 4
Dependent Claim
23 words
An integrated package according to claim 2 wherein a flexible circuit is bonded to the flip chip and to the ceramic circuit board.
Claim 5
Dependent Claim
28 words
An integrated package according to claim 2 wherein the ceramic circuit board and the flip chip each has a metallization pattern to receive an array of solder balls.
Claim 6
Dependent Claim
17 words
An integrated package according to claim 1 wherein a lid is hermetically sealed over the electronic component.
Claim 7
Dependent Claim
28 words
An integrated package according to claim 1 wherein the metal substrate is selected from the group consisting of Kovar®, molybdenum, copper/tungsten composite, AlSiC, Al-graphite composite and Cu-graphite composite.
Claim 8
Dependent Claim
15 words
An integrated package according to claim 1 wherein the electronic component is a semiconductor laser.
Claim 9
Dependent Claim
27 words
An integrated package according to claim 7 further comprising an optical wave guide, optically coupled to the semiconductor laster, the optical waveguide supported within the integrated package.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-09-23 | 2006-03-25 | 2006-09-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-09-23 | 2010-03-25 | 2010-09-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-09-23 | 2014-03-25 | 2014-09-24 | $7700.00 | Window Closed / Lapsed |