Patent US2467832A successfully refreshed from Google Patents.
US5565262A
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Electrical feedthroughs for ceramic circuit board support substrates
Assignee: Lighting Science Group Corp
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Filing: 1995-01-27
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Granted: 1996-10-15
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Expires: 2015-01-27
Abstract
Abstract Electrical feedthroughs in printed circuit board support substrates for use in making double sided ceramic multilayer printed circuit boards are made by insulating the feedthrough openings with a first layer of nickel oxide and one or more layers of glass, and then filling the remainder of the feedthroughs with a conductive metal via fill ink. After firing, the resultant structure provides insulated electrical feedthroughs through the support substrate.
Inventors
- 👤 Thomas P. Azzaro
- 👤 Barry J. Thaler
- 👤 Edward J. Conlon
- 👤 Ananda H. Kumar
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 22:01
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/44; H05K3/445; B; B32; B32B; B32B3/00; B32B18/00; C; C03; C03C; C03C3/00; C03C3/04; C03C3/076; C03C3/083; C03C3/085; C03C3/097; C03C8/00; C03C8/02; C03C8/04; C03C8/08; H05K1/00; H05K1/02; H05K1/03; H05K1/05; H05K1/053; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4061; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/095; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H10W76/00; H10W76/60; H05K1/0306; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09581; H05K2201/09654; H05K2201/09809; H05K2203/00; H05K2203/03; H05K2203/0315; H05K2203/11; H05K2203/1147; H05K2203/14; H05K2203/1438; H05K3/42; H05K3/425; H05K3/426; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1056; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/24926
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
63 words
A fired printed circuit board support substrate having a via hole containing the following sequential layers therein: a nickel oxide first dielectric layer adjacent to the walls of said via hole; one or more glass dielectric layers inside and adjacent to said nickel oxide layer; and a conductive material comprising a mixture of conductive metal and of a glass that fills the via.
Claim 2
Dependent Claim
63 words
A fired printed circuit board support substrate having a via hole containing the following sequential layers therein: a nickel oxide first dielectric layer adjacent to the walls of said via hole; one or more glass dielectric layers inside and adjacent to said nickel oxide layer; and a conductive material comprising a mixture of conductive metal and of a glass that fills the via.
Claim 3
Dependent Claim
31 words
A substrate according to claim 1 wherein said support substrate comprises a nickel plated composite of a metal selected from the group consisting of molybdenum, a ferronickel and a ferrous/nickel/cobalt/manganese alloy.
Claim 4
Dependent Claim
23 words
A substrate according to claim 2 wherein said substrate comprises a member of the group consisting of a ferronickel and a ferrous/nickel/cobalt/manganese alloy.
Claim 5
Dependent Claim
12 words
A substrate according to claim 1 wherein said conductive metal is silver.
Claim 6
Dependent Claim
20 words
A substrate according to claim 1 wherein said conductive metal is selected from the group consisting of copper and gold.
Claim 7
Dependent Claim
40 words
A substrate according to claim 1 wherein said glass dielectric layer has a thermal coefficient of expansion matched to of the support substrate material, will wet nickel oxide and can be fired at a temperature up to about 1000° C.
Claim 8
Dependent Claim
36 words
A substrate according to claim 6 wherein said glass comprises zinc oxide, 28.68% by weight, magnesium oxide, 5.92% by weight, barium oxide, 6.21% by weight, aluminum oxide, 15.36% by weight and silicon oxide, 43.82% by weight.
Claim 9
Dependent Claim
38 words
A substrate according to claim 6 wherein said glass comprises magnesium oxide, 29% by weight, aluminum oxide, 22% by weight, silicon oxide, 45% by weight and up to 5% by weight of oxides of phosphorus, boron and zirconium.
Claim 10
Dependent Claim
28 words
A substrate according to claim 1 wherein said substrate is a nickel plated Cu/Mo/Cu composite and said glass has a thermal coefficient of expansion matched to the substrate.
Claim 11
Dependent Claim
25 words
A substrate according to claim 1 wherein said glass is a magnesium aluminosilicate glass having a thermal coefficient of expansion of about 40-55×10 -7 /°C.
Claim 12
Dependent Claim
21 words
A fired printed circuit board thermally conductive support substrate having a conductive via that is dielectrically isolated from the support substrate.
Claim 13
Dependent Claim
21 words
A fired printed circuit board thermally conductive support substrate having a conductive via that is dielectrically isolated from the support substrate.
Claim 14
Dependent Claim
20 words
A support substrate according to claim 11 wherein the dielectric isolation is provided by a glass layer in the via.
Claim 15
Dependent Claim
35 words
A support substrate according to claim 12 wherein the support substrate is a conductive metal selected from the group consisting of a ferronickel, a ferrous/nickel/cobalt/manganese alloy and molybdenum and composites of copper clad conductive metals.
Claim 16
Dependent Claim
31 words
A support substrate according to claim 13 wherein the glass layer is selected from the group consisting of a glass having a coefficient of expansion matched to the conductive metal substrate.
Claim 17
Dependent Claim
40 words
A support substrate according to claim 14 wherein said glass has the composition zinc oxide, 28.68% by weight, magnesium oxide, 5.92% by weight, barium oxide, 6.21% by weight, aluminum oxide, 15.36 & by weight, and silicon oxide, 43.82% by weight.
Claim 18
Dependent Claim
42 words
A support substrate according to claim 14 wherein said glass has the composition magnesium oxide, 29% by weight; aluminum oxide, 22% by weight, silicon oxide 45% by weight and up to 4% by weight of phosphorus oxide, boron oxide and zirconium oxide.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-10-15 | 2000-04-15 | 2000-10-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-10-15 | 2004-04-15 | 2004-10-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-10-15 | 2008-04-15 | 2008-10-15 | $7700.00 | Window Closed / Lapsed |