Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
119 words
An ultra high frequency circuit comprising an insulating plate having first and second surfaces on opposite sides and having a hole formed through the plate and defined by a side wall extending between said surfaces, said circuit including a conductive connection track on the first surface, a conductive layer on the second surface, of a material which would form a metallurgically-unstable interface with the conductive connection track material, and a deposition on said side wall including a connecting layer in contact with the conductive connection track and the conductive layer, said connecting layer consisting essentially of an electrically-conductive alloy which forms metallurgically-stable interfaces with both the material of the conductive connection track and the material of the conductive layer.
Claim 2
Dependent Claim
119 words
An ultra high frequency circuit comprising an insulating plate having first and second surfaces on opposite sides and having a hole formed through the plate and defined by a side wall extending between said surfaces, said circuit including a conductive connection track on the first surface, a conductive layer on the second surface, of a material which would form a metallurgically-unstable interface with the conductive connection track material, and a deposition on said side wall including a connecting layer in contact with the conductive connection track and the conductive layer, said connecting layer consisting essentially of an electrically-conductive alloy which forms metallurgically-stable interfaces with both the material of the conductive connection track and the material of the conductive layer.
Claim 3
Dependent Claim
32 words
A circuit as in claim 1 where the conductive connection track consists essentially of gold, the conductive layer consists essentially of a silver alloy, and the connecting layer consists essentially of gold-platinum.
Claim 4
Dependent Claim
54 words
A circuit as in claim 1 or 2 where part of said deposition is formed by a second layer in contact with the connecting layer and the conductive connection track, said second layer consisting essentially of a metal which forms metallurgically-stable interfaces with the materials of said connecting layer and said conductive connection track.
Claim 5
Dependent Claim
32 words
A circuit as in claim 2 where part of said deposition is formed by a second layer, consisting essentially of gold, in contact with the connecting layer and the conductive connection track.
Claim 6
Dependent Claim
24 words
A circuit as in claim 1 where the conductive connection track extends into the hole and overlies at least part of the connecting layer.
Claim 7
Dependent Claim
114 words
An ultra high frequency circuit comprising an insulating plate having first and second surfaces on opposite sides and having a hole formed through the plate and defined by a side wall extending between said surfaces, said circuit including a conductive connection track of a first material on the first surface, a conductive layer of a second material, which would form a metallurgically-unstable interface with the first material, on the second surface, and an electrically-conductive deposition on said side wall including first and second portions in contact with the first and second materials, respectively, said portions each consisting of a material which forms a metallurgically-stable interface with said material with which it is in contact.
Claim 8
Dependent Claim
114 words
An ultra high frequency circuit comprising an insulating plate having first and second surfaces on opposite sides and having a hole formed through the plate and defined by a side wall extending between said surfaces, said circuit including a conductive connection track of a first material on the first surface, a conductive layer of a second material, which would form a metallurgically-unstable interface with the first material, on the second surface, and an electrically-conductive deposition on said side wall including first and second portions in contact with the first and second materials, respectively, said portions each consisting of a material which forms a metallurgically-stable interface with said material with which it is in contact.