Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
152 words
A distributed constant circuit board, comprising: a ceramic substrate consisting essentially of a ceramic composition including at least 5% by weight of TiO 2 powder, wherein particles of said TiO 2 powder are dispersed in said ceramic substrate; and a microwave integrated circuit buried in said ceramic substrate, said microwave integrated circuit forming at least one of a resonance circuit, an inductor, a capacitor and a strip transmission line and having a major component selected from the group consisting of Ag, Au and Cu, said microwave integrated circuit having a sheet resistivity not higher than 10 mΩ per square; wherein said ceramic composition of said ceramic substrate yields a temperature coefficient between -30 ppm/° C. and +100 ppm/° C. of such a resonance circuit, said microwave integrated circuit is co-fired with a green sheet of said ceramic substrate, and a sintering temperature of the ceramic substrate is not higher than 1100° C.
Claim 2
Dependent Claim
152 words
A distributed constant circuit board, comprising: a ceramic substrate consisting essentially of a ceramic composition including at least 5% by weight of TiO 2 powder, wherein particles of said TiO 2 powder are dispersed in said ceramic substrate; and a microwave integrated circuit buried in said ceramic substrate, said microwave integrated circuit forming at least one of a resonance circuit, an inductor, a capacitor and a strip transmission line and having a major component selected from the group consisting of Ag, Au and Cu, said microwave integrated circuit having a sheet resistivity not higher than 10 mΩ per square; wherein said ceramic composition of said ceramic substrate yields a temperature coefficient between -30 ppm/° C. and +100 ppm/° C. of such a resonance circuit, said microwave integrated circuit is co-fired with a green sheet of said ceramic substrate, and a sintering temperature of the ceramic substrate is not higher than 1100° C.
Claim 3
Dependent Claim
31 words
A distributed constant circuit board of claim 1, wherein said TiO 2 powder is calcined so as to give a BET specific surface area not larger than 2 m 2 /g.
Claim 4
Dependent Claim
41 words
A distributed constant circuit board of claim 1, wherein said ceramic composition comprises a mixture of an amorphous or crystallized glass powder and said TiO 2 powder, said amorphous or crystallized glass powder having a dielectric constant not higher than 20.
Claim 5
Dependent Claim
64 words
A distributed constant circuit board according to claim 3, wherein said ceramic composition further comprises a filler in the form of a powder selected from the group consisting of: alumina; mullite; cordierite, forsterite; quartz; quartz glass; zircon; zirconia; and RE 2 Ti 2 O 7 wherein RE is one or more rare earth elements, said filler having a dielectric constant not higher than 50.
Claim 6
Dependent Claim
41 words
A distributed constant circuit board of claim 1, wherein said ceramic composition comprises a mixture of a TiO 2 powder, and said ceramic material selected from the group consisting of: boric acid; an oxide of alkaline earth metal; and silicic acid.
Claim 7
Dependent Claim
42 words
A distributed constant circuit board of claim 1, wherein said major component of said microwave integrated circuit is selected from the group consisting of: Ag; Ag-Pt alloy; Ag-Pd alloy; Ag-Pt-Pd alloy; Cu; Cu-based alloy; Au; Au-Pt alloy; Au-Pd alloy; and Au-Pt-Pd alloy.