Ceramic coated metal substrates for electronic applications

Claim 2

A glass/ceramic coated substrate having a metal core and having on at least a portion of the surface of (on an oxide basis) (a) from about 8 to about 26% by weight of magnesium oxide (MgO); based on the total weight of the coating; (b) from about 10 to about 49% by weight of aluminum oxide (Al 2 O 3 ); based on the total weight of the coating; (c) from about 42 to about 68% by weight of silicon oxide (SiO 2 ) based on the total weight of the coating and (d) from about 3 to about 15% by weight, based on the total weight of MgO, Al 2 O 3 and SiO 2 in the coating of one or more alkali metal or alkaline earth metal oxides, and a boron oxide.

Claim 3

A glass/ceramic substrate according to claim 1 wherein said coating comprises (on an oxide basis): (a) from about 9 to about 22% by weight of MgO; (b) from about 16 to 45% by weight of Al 2 O 3 ; and (c) from about 43 to about 63% by weight of SiO 2 .

Claim 4

A glass/ceramic substrate according to claim 2 wherein said coating comprises (on an oxide basis): (a) from about 10 to about 18% by weight of MgO; (b) from about 23 to about 40% by weight of Al 2 O 3 ; and (c) from about 44 to about 58% by weight of SiO 2 .

Claim 5

A glass/ceramic substrate according to claim 3 wherein said coating comprises (on an oxide basis): (a) from about 12 to about 14% by weight of MgO; (b) from about 30 to about 35% by weight of Al 2 O 3 ; and (c) from about 45 to about 52% by weight of SiO 2 .

Claim 6

A glass/ceramic substrate according to claim 1 wherein said coating comprises cordierete (2MgO-2Al 2 O 3 -5SiO 2 ).

Claim 7

A glass/ceramic coated substrate according to claim 1 herein said coating comprises cordierete (2MgO-2Al 2 O 3 -5SiO 2 ) and sapphirine (4MgO-5Al 2 O 3 -2SiO 2 ).

Claim 8

A glass/ceramic coated substrate according to claim 1 which further comprises an alkali metal oxide and a boron oxide.

Claim 9

A glass/ceramic coated substrate according to claim 1 which further comprises lithium oxide and boron oxide.

Claim 10

A glass/ceramic coated substrate according to claim 8 wherein said coating comprises cordierete (2MgO-2Al 2 O 3 -5SiO 2 ) and spodumene (Li 2 O-Al 2 O 3 -4SiO 2 ).

Claim 11

A glass/ceramic coated substrate according to claim 8 wherein said coating comprises cordierete (2MgO-2Al 2 O 3 -5SiO 2 ), spodumene (li 2 O-Al 2 O 3 -4SiO 2 ), and sapphirine (4MgO-5Al 2 O 3 -2SiO 2 ).

Claim 12

A glass/ceramic according to claim 1 which further comprises (on an oxide basis): (d) from about 5 to about 12% b weight based on the total weight of Al 2 O 3 , MgO and SiO 2 in the coating, of one or more alkali metal and alkaline earth metal oxides and boron oxide.

Claim 13

A glass/ceramic coated substrate according to claim 11 which further comprises (on an oxide basis): (d) from about 7 to about 9% by weight of one or more alkali metal and/or alkaline earth metal oxides, and boron oxides.

Claim 14

A glass/ceramic coated substrate according to claim 1 which further comprises (on an oxide basis) (e) up to about 11% by weight based on the total weight of Al 2 O 3 , SiO 3 , SiO 2 and MgO of a transition or transition earth metal oxide which functions as a nucleating agent.

Claim 15

A glass/ceramic coated substrate according to claim 13 wherein the amount of said transition or transition earth metal oxide is from about 2 to about 8% by weight.

Claim 16

A glass/ceramic coated substrate according to claim 14 wherein the amount of said transition or transition earth metal oxide is from about 4 to about 6 weight percent.

Claim 17

A glass/ceramic coated substrate according to claim 13 wherein said transition or transition earth metal oxide is selected from the group consisting of TiO 2 , ZrO 2 , Y 2 O 3 and La 2 O 3 .

Claim 18

A glass/ceramic coated substrate according to claim 16 wherein said transition or transition earth metal oxide is selected from the group consisting of TiO 2 and ZrO 2 .

Claim 19

A glass/ceramic coated substrate according to claim 17 wherein said transition or transition earth metal oxide is TiO 2 .

Claim 20

A glass/ceramic coatd substrate according to claim 1 said coating consisting essentially of (on an oxide basis and based on the total weight of the coating): (a) from about 9 to about 23 weight percent of magnesium oxide; (b) from about 19 to about 48 weight percent of aluminum oxide; (c) from about 36 to about 47 weight percent of silicon dioxide; (d) from about 1 to about 3 weight percent of lithium oxide; (e) from about 4 to about 13 weight percent of a boron oxide; and (f) from about 0 to about 11 weight percent of titanium dioxide or zirconium oxide.

Claim 21

A glass/ceramic coated substrate according to claim 19 wherein said glass/ceramic has a thermal coefficient of expansion of from about 50° to about 250° C. less than about 4 ppm/°C. and said metal core has a thermal coefficient of expansion from about 50° to about 250° C. greater than about 12 ppm/°C.

Claim 22

A glass/ceramic coated substrate accorrding to claim 19 wherein said glass/ceramic has a dielectric constant of less than about 8.

Claim 23

A glass/ceramic coated substrate according to claim 19 in which the glass/ceramic consists essentially of cordierite, 2MgO-2Al 2 O 3 -5SiO 2 , and spodumene (Li 2 O-Al 2 O 3 -4SiO 2 )

Claim 24

A glass/ceramic coated substrate according to claim 18 which includes sapphirine (4MgO-5Al 2 O 3 -2SiO 2 ).

Claim 25

A glass/ceramic coated substrate according to claim 23 which includes from about 2 to about 8% by weight of TiO 2 .

Claim 26

A glass/ceramic coated substrate according to claim 24 wherein said glass/ceramic has a thermal coeffficient of expansion from about 50° C. to about 250° C. of from about 1.9 to about 2.5 ppm 1° C.

Claim 27

A glass/ceramic coated substrate according to claim 1 wherein said metal core is composed of a metal which can be exposed to temperatures in excess of 1100° C. in an oxidizing atmosphere without excessive spalling.

Claim 28

A glass/ceramic coated substrate according to claim 26 wherein said metal core is composed of an alloy of at least on metal selected from the group consisting of cobalt, nickel and iron, and one or more other metals selected from the group consisting of aluminum and chromium.

Claim 29

A glass/ceramic coated substrate according to claim 27 in which the core metal is comprised of a nickel based alloy containing chromium, aluminum, iron and yttrium.

Claim 30

A glass/ceramic coated substrate according to claim 28 in which the core metal is Haynes alloy number 214 of nominal composition 77 weight % nickel, 16 weight % chromium, 4.5 weight % aluminum, 2.5 weight % iron, and a trace of yttrium.

Claim 31

A glass/ceramic coated substrate according to claim 27 in which the core metal is comprised of an iron based llloy containing chromium and aluminum.

Claim 32

A glass/ceramic coated circuit board which comprises a metal substrate having coated on at least a portion of the surface thereof a glass/ceramic coating and having defined on at least a portion of the surface of the coating an electrical circuit, said coating comprising (on an oxide basis; (a) from about 8 to about 26% by weight of MgO based on the total weight of the coating; (b) from about 10 to about 49% by weight of Al 2 O 3 based on the total weight of the coating; (c) from about 42 to about 68% by weight of SiO 2 and based on the total weight of the coating; (d) from aobut 3 to about 15% by weight, based on the total weight of MgO, Al 2 O 3 and SiO 2 in the coating of one or more alkali metal or alkaline earth metal oxides, and a baron oxide.

Claim 33

A glass/ceramic coated circuit board which comprises a metal substrate having coated on at least a portion of the surface thereof a glass/ceramic coating and having defined on at least a portion of the surface of the coating an electrical circuit, said coating comprising (on an oxide basis; (a) from about 8 to about 26% by weight of MgO based on the total weight of the coating; (b) from about 10 to about 49% by weight of Al 2 O 3 based on the total weight of the coating; (c) from about 42 to about 68% by weight of SiO 2 and based on the total weight of the coating; (d) from aobut 3 to about 15% by weight, based on the total weight of MgO, Al 2 O 3 and SiO 2 in the coating of one or more alkali metal or alkaline earth metal oxides, and a baron oxide.

Claim 34

A glass/ceramic coated circuit board according to claim 26 said glass/ceramic having an oxide composition consisting essentially of: (a) from about 9 to about 23 weight percent of magnesium oxide; (b) from about 19 to about 48 weight percent of aluminum oxide; (c) from about 36 to about 47 weight percent of silicon dioxide; (d) from about 1 to about 3 weight percent of lithium oxide; (e) from about 4 to about 13 weight percent of boron oxide; (f) from about 0 to about 11 weight percent of titanium dioxide or zirconium oxide; said coating having defined thereon an electrical circuit.

Claim 35

The circuit board according to claim 32 wherein said glass/ceramic has a thermal coefficient of expansion from about 50° to about 250° C. less than about 4 ppm/°C. and said metal core has a thermal coefficient of expansion from about 50° to about 250° C. greater than about 12 ppm/°C.

Claim 36

The circuit board according to claim 32 wherein said glass/ceramic has a dielectric constant less than 8.

Claim 37

The circuit board according to claim 32 wherein said glass/ceramic consists essentially of cordierite, (2MgO-2Al 2 O 3 -5SiO 2 ), and spodumene (Li 2 O-Al 2 O 3 -4SiO 2 ).

Claim 38

The circuit board according to claim 32 in which the core metal is comprised of a nickel based alloy containing chromium, aluminum, iron, and yttrium.

Claim 39

The circuit board according to claim 36 in which the core metal is Haynes alloy number 214 of nominal composition 77 weight % nickel, 16 weight % chromium, 4.5 weight % aluminum, 2.5 weight % iron, and a trace of yttrium.

Claim 40

The circuit board according to claim 32 in which the core metal is comprised of an iron based alloy containing chromium and aluminum.

Claim 41

The circuit board according to claim 32 in which the glass/ceramic coating is deposited in two or more layers, said layers consisting of different compositions.

Claim 42

The circuit board according to claim 39 having a first layer with an oxide composition containing about 12.0% magnesium oxide, about 30.5% aluminum oxide, about 45.0% silicon dioxide, about 2.4% lithium oxide, about 5.6% boron oxide, and about 4.5% titanium dioxide, and a second layer with an oxide composition containing about 12.5% magnesium oxide, about 32.0% aluminum oxide, about 47.0% silicon dioxide, about 2.6% lithium oxide, and about 5.9% boron oxide.

Claim 43

A process for manufacturing a glass ceramic coated substrate having a metal core and having on at least a portion of the surface of the metal core a coating of a glass ceramic, said process comprising: (a) heating a metal substrate in the presence of oxygen at a first temperature for a time sufficient to form an oxide layer on the surfaces of said substrate; (b) applying to all or a portion of the surfaces of said substrate in a pre-determined pattern a suspension comprising one or more organic solvents, one or more heat degradable polymeric binders and a mixture of calcined finely divided comprising on an oxide basis: (i) from about 8 to about 26% by weight of MgO; (ii) from about 10 to about 49% by weight of Al 2 O 3 ; and (iii) from about 42 to about 68% by weight of SiO 2 ; (c) heating the suspension/metal substrate combination of step (b) at a second temperature for a time sufficient to remove substantially all said solvents from the applied suspension to form a coated metal substrate; (d) heating said coated/metal substrate combinations of step (c) at a third temperature for a time sufficient to degrade substantially all of said binders in said applied suspension; (e) heating the coated metal substrate combintaion of step (d) for a time and a a fourth temperature sufficient to sinter said glass/ceramic to form a pre-determined pattern of sintered glass ceramic bonded to said surfaces of said metal substrate; and (f) heating treating said sintered glass ceramic at a fifth temperature for a time sufficient to recrystallize any residual glass in said sintered glass/cermmic.

Claim 44

A process for manufacturing a glass ceramic coated substrate having a metal core and having on at least a portion of the surface of the metal core a coating of a glass ceramic, said process comprising: (a) heating a metal substrate in the presence of oxygen at a first temperature for a time sufficient to form an oxide layer on the surfaces of said substrate; (b) applying to all or a portion of the surfaces of said substrate in a pre-determined pattern a suspension comprising one or more organic solvents, one or more heat degradable polymeric binders and a mixture of calcined finely divided comprising on an oxide basis: (i) from about 8 to about 26% by weight of MgO; (ii) from about 10 to about 49% by weight of Al 2 O 3 ; and (iii) from about 42 to about 68% by weight of SiO 2 ; (c) heating the suspension/metal substrate combination of step (b) at a second temperature for a time sufficient to remove substantially all said solvents from the applied suspension to form a coated metal substrate; (d) heating said coated/metal substrate combinations of step (c) at a third temperature for a time sufficient to degrade substantially all of said binders in said applied suspension; (e) heating the coated metal substrate combintaion of step (d) for a time and a a fourth temperature sufficient to sinter said glass/ceramic to form a pre-determined pattern of sintered glass ceramic bonded to said surfaces of said metal substrate; and (f) heating treating said sintered glass ceramic at a fifth temperature for a time sufficient to recrystallize any residual glass in said sintered glass/cermmic.

Claim 45

An electronic substrate comprising: (a) a metal substrate; (b) a glass ceramic coating comprising (on an oxide basis); (i) from about 8 to about 26% by weight of MgO based on the total weight of the coating; (ii) from about 10 to about 49% by weight of Al 2 O 3 based on the total weight of the coating; (iii) from about 42 to about 68% by weight of SiO 2 based on the total weight of the coating; (iv) from about 3 to about 15% by weight, based on the total weight of MgO, Al 2 O 3 and SiO 2 in the coating of one or more alkali metal or alkaline earth metal oxides, and a boron oxide; and (c) a layer of a conductive material heat bonded and sintered to all or a portion of the surfaces of said glass/ceramic coating in a pre-determined pattern.

Claim 46

An electronic substrate comprising: (a) a metal substrate; (b) a glass ceramic coating comprising (on an oxide basis); (i) from about 8 to about 26% by weight of MgO based on the total weight of the coating; (ii) from about 10 to about 49% by weight of Al 2 O 3 based on the total weight of the coating; (iii) from about 42 to about 68% by weight of SiO 2 based on the total weight of the coating; (iv) from about 3 to about 15% by weight, based on the total weight of MgO, Al 2 O 3 and SiO 2 in the coating of one or more alkali metal or alkaline earth metal oxides, and a boron oxide; and (c) a layer of a conductive material heat bonded and sintered to all or a portion of the surfaces of said glass/ceramic coating in a pre-determined pattern.

Claim 47

An electronic substrate according to claim 42 which further comprises a layer of resistive materials heated bond to said surfaces of said coating in a predetemined pattern forming a resistor between two or more circuit patterns.

Claim 48

An electronic substrate according to claim 42 which further comprises one or more capacitive elements said elements formed by overlapping circuit sandwhiching a layer of dielective material.

Claim 49

An electronic substrate according to claim 42 wherein said substrate forms a circuit board wherein said layer of a conductive material is heat bonded and sintered to all or a portion of the surfaces of said glass/ceramic coating in a predetermined pattern defining an electrical circuit.

Claim 50

An electronic substrate according to claim 45 wherein said conductive material is a metal.

Claim 51

An electronic substrate according to claim 46 wherein said metal is selected from the group consisting of copper, silver, gold, platinum, palladium or alloys or other combinations thereof.

Claim 52

An electronic substrate according to claim 42 wherein said substrate forms a capacitive device.