Patent US6423582B1 successfully refreshed from Google Patents.
US6423582B1
Expired / Lapsed
US
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Use of DAR coating to modulate the efficiency of laser fuse blows
Assignee: Micron Technology Inc
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Filing: 1999-02-25
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Granted: 2002-07-23
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Expires: 2019-02-25
Abstract
Abstract The present invention relates to a laser fuse. The laser fuse comprises an element comprising a heat conductive material. The fuse also includes an absorption element comprising a material with an adjustable capacity for heat or light absorption that overlays the heat conductive element. The fuse also includes an outer insulating element that overlays and encloses the heat conductive element and the absorption element.
Inventors
- 👤 Mark Fischer
- 👤 Zhiping Yin
- 👤 Thomas R. Glass
- 👤 Kunal R. Parekh
- 👤 Gurtej Singh Sandhu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 05:56
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/49; H10W20/493; H10W20/494
Claims Analysis
Total Claims: 42
Claim 1
Independent Claim
133 words
A method for protecting circuits that are exposed to different energy levels in a dynamic memory chip, comprising: providing a plurality of first elements, each element comprising a heat conductive material to make a heat conductive element and fabricating the plurality of first elements into a dynamic memory chip; providing a plurality of absorption elements, each element comprising a material with an adjustable capacity for heat or light absorption that overlays each of the heat conductive elements, wherein the plurality has at least two different capacities for heat or light absorption, and an outer insulating element that overlays and encloses each of the heat conductive elements and the absorption elements to make a plurality of fuses; and fabricating one or more circuits of the dynamic memory chip to include the plurality of fuses.
Claim 2
Independent Claim
133 words
A method for protecting circuits that are exposed to different energy levels in a dynamic memory chip, comprising: providing a plurality of first elements, each element comprising a heat conductive material to make a heat conductive element and fabricating the plurality of first elements into a dynamic memory chip; providing a plurality of absorption elements, each element comprising a material with an adjustable capacity for heat or light absorption that overlays each of the heat conductive elements, wherein the plurality has at least two different capacities for heat or light absorption, and an outer insulating element that overlays and encloses each of the heat conductive elements and the absorption elements to make a plurality of fuses; and fabricating one or more circuits of the dynamic memory chip to include the plurality of fuses.
Claim 3
Dependent Claim
17 words
The method of claim 1 and further comprising fabricating a transistor that comprises the plurality of fuses.
Claim 4
Dependent Claim
20 words
The method of claim 1 and further comprising fabricating a fusible link for each fuse in the plurality of fuses.
Claim 5
Dependent Claim
31 words
The method of claim 1 wherein each absorption element of the plurality of absorption elements is overlayed at a thickness that permits preselection of laser energy required to blow the fuse.
Claim 6
Dependent Claim
28 words
The method of claim 1 wherein each absorption element is formulated with respect to silicon-to-nitride ratio to preselect laser energy required to blow each fuse of the plurality.
Claim 7
Independent Claim
129 words
A method for protecting circuits that are exposed to different energy levels in a static energy chip, comprising: providing a plurality of first elements to make a plurality of fuses, each element comprising a heat conductive material to make a heat conductive element; providing a plurality of absorption elements to make the plurality of fuses, each element comprising a material with an adjustable capacity for heat or light absorption that overlays each of the heat conductive elements, wherein the plurality has at least two different capacities for heat or light absorption; and providing an outer insulating element for each fuse of the plurality that overlays and encloses each of the heat conductive elements and the absorption elements; and fabricating one or more circuits to include the plurality of fuses.
Claim 8
Independent Claim
129 words
A method for protecting circuits that are exposed to different energy levels in a static energy chip, comprising: providing a plurality of first elements to make a plurality of fuses, each element comprising a heat conductive material to make a heat conductive element; providing a plurality of absorption elements to make the plurality of fuses, each element comprising a material with an adjustable capacity for heat or light absorption that overlays each of the heat conductive elements, wherein the plurality has at least two different capacities for heat or light absorption; and providing an outer insulating element for each fuse of the plurality that overlays and encloses each of the heat conductive elements and the absorption elements; and fabricating one or more circuits to include the plurality of fuses.
Claim 9
Dependent Claim
17 words
The method of claim 6 and further comprising fabricating a transister that comprises the plurality of fuses.
Claim 10
Dependent Claim
27 words
The method of claim 6 and further comprising fabricating a fusible link for each fuse of the plurality and attaching the fusible link to the laser fuse.
Claim 11
Dependent Claim
32 words
The method of claim 6 and further comprising overlaying the absorption element of each fuse at a thickness that permits preselection of laser energy required to blow each fuse of the plurality.
Claim 12
Dependent Claim
34 words
The method of claim 6 wherein the absorption element of each fuse in the plurality is formulated with respect to silicon-to-nitride ratio to preselect laser energy required to blow each fuse of the plurality.
Claim 13
Independent Claim
130 words
A method for protecting circuits that are exposed to different energy levels in a memory chip, comprising: providing a plurality of first elements, each element comprising a heat conductive material to make a heat conductive element and fabricating the plurality of first elements into a memory chip; providing a plurality of absorption elements, each element comprising a material with an adjustable capacity for heat or light absorption that overlays each of the heat conductive elements, wherein the plurality has at least two different capacities for heat or light absorption, and an outer insulating element that overlays and encloses each of the heat conductive elements and the absorption elements to make a plurality of fuses; and fabricating one or more circuits of the memory chip to include the plurality of fuses.
Claim 14
Independent Claim
130 words
A method for protecting circuits that are exposed to different energy levels in a memory chip, comprising: providing a plurality of first elements, each element comprising a heat conductive material to make a heat conductive element and fabricating the plurality of first elements into a memory chip; providing a plurality of absorption elements, each element comprising a material with an adjustable capacity for heat or light absorption that overlays each of the heat conductive elements, wherein the plurality has at least two different capacities for heat or light absorption, and an outer insulating element that overlays and encloses each of the heat conductive elements and the absorption elements to make a plurality of fuses; and fabricating one or more circuits of the memory chip to include the plurality of fuses.
Claim 15
Dependent Claim
17 words
The method of claim 11 and further comprising fabricating a transistor that comprises the plurality of fuses.
Claim 16
Dependent Claim
20 words
The method of claim 11 and further comprising fabricating a fusible link for each fuse in the plurality of fuses.
Claim 17
Dependent Claim
31 words
The method of claim 11 wherein each absorption element of the plurality of absorption elements is overlayed at a thickness that permits preselection of laser energy required to blow the fuse.
Claim 18
Dependent Claim
28 words
The method of claim 11 wherein each absorption element is formulated with respect to silicon-to-nitride ratio to preselect laser energy required to blow each fuse of the plurality.
Claim 19
Independent Claim
130 words
A method for protecting circuits that are exposed to different energy levels in a logic chip, comprising: providing a plurality of first elements, each element comprising a heat conductive material to make a heat conductive element and fabricating the plurality of first elements into a logic chip; providing a plurality of absorption elements, each element comprising a material with an adjustable capacity for heat or light absorption that overlays each of the heat conductive elements, wherein the plurality has at least two different capacities for heat or light absorption, and an outer insulating element that overlays and encloses each of the heat conductive elements and the absorption elements to make a plurality of fuses; and fabricating one or more circuits of the lgic chip to include the plurality of fuses.
Claim 20
Independent Claim
130 words
A method for protecting circuits that are exposed to different energy levels in a logic chip, comprising: providing a plurality of first elements, each element comprising a heat conductive material to make a heat conductive element and fabricating the plurality of first elements into a logic chip; providing a plurality of absorption elements, each element comprising a material with an adjustable capacity for heat or light absorption that overlays each of the heat conductive elements, wherein the plurality has at least two different capacities for heat or light absorption, and an outer insulating element that overlays and encloses each of the heat conductive elements and the absorption elements to make a plurality of fuses; and fabricating one or more circuits of the lgic chip to include the plurality of fuses.
Claim 21
Dependent Claim
17 words
The method of claim 16 and further comprising fabricating a transistor that comprises the plurality of fuses.
Claim 22
Dependent Claim
20 words
The method of claim 16 and further comprising fabricating a fusible link for each fuse in the plurality of fuses.
Claim 23
Dependent Claim
31 words
The method of claim 16 wherein each absorption element of the plurality of absorption elements is overlayed at a thickness that permits preselection of laser energy required to blow the fuse.
Claim 24
Dependent Claim
28 words
The method of claim 16 wherein each absorption element is formulated with respect to silicon-to-nitride ratio to preselect laser energy required to blow each fuse of the plurality.
Claim 25
Independent Claim
131 words
A method for protecting memory cells in a memory chip that are exposed to different energy levels, comprising: providing a plurality of first elements, each element comprising a heat conductive material to make a heat conductive element and fabricating the plurality of first elements into a memory chip; providing a plurality of absorption elements, each element comprising a material with an adjustable capacity for heat or light absorption that overlays each of the heat conductive elements, wherein the plurality has at least two different capacities for heat or light absorption, and an outer insulating element that overlays and encloses each of the heat conductive elements and the absorption elements to make a plurality of fuses; and fabricating one or more circuits of the memory chip to include the plurality of fuses.
Claim 26
Independent Claim
131 words
A method for protecting memory cells in a memory chip that are exposed to different energy levels, comprising: providing a plurality of first elements, each element comprising a heat conductive material to make a heat conductive element and fabricating the plurality of first elements into a memory chip; providing a plurality of absorption elements, each element comprising a material with an adjustable capacity for heat or light absorption that overlays each of the heat conductive elements, wherein the plurality has at least two different capacities for heat or light absorption, and an outer insulating element that overlays and encloses each of the heat conductive elements and the absorption elements to make a plurality of fuses; and fabricating one or more circuits of the memory chip to include the plurality of fuses.
Claim 27
Dependent Claim
17 words
The method of claim 21 and further comprising fabricating a transistor that comprises the plurality of fuses.
Claim 28
Dependent Claim
20 words
The method of claim 21 and further comprising fabricating a fusible link for each fuse in the plurality of fuses.
Claim 29
Dependent Claim
31 words
The method of claim 21 wherein each absorption element of the plurality of absorption elements is overlayed at a thickness that permits preselection of laser energy required to blow the fuse.
Claim 30
Dependent Claim
28 words
The method of claim 21 wherein each absorption element is formulated with respect to silicon-to-nitride ratio to preselect laser energy required to blow each fuse of the plurality.
Claim 31
Independent Claim
131 words
A method for protecting memory cells that are exposed to different energy levels in a logic chip, comprising: providing a plurality of first elements, each element comprising a heat conductive material to make a heat conductive element and fabricating the plurality of first elements into a logic chip; providing a plurality of absorption elements, each element comprising a material with an adjustable capacity for heat or light absorption that overlays each of the heat conductive elements, wherein the plurality has at least two different capacities for heat or light absorption, and an outer insulating element that overlays and encloses each of the heat conductive elements and the absorption elements to make a plurality of fuses; and fabricating one or more circuits of the logic chip to include the plurality of fuses.
Claim 32
Independent Claim
131 words
A method for protecting memory cells that are exposed to different energy levels in a logic chip, comprising: providing a plurality of first elements, each element comprising a heat conductive material to make a heat conductive element and fabricating the plurality of first elements into a logic chip; providing a plurality of absorption elements, each element comprising a material with an adjustable capacity for heat or light absorption that overlays each of the heat conductive elements, wherein the plurality has at least two different capacities for heat or light absorption, and an outer insulating element that overlays and encloses each of the heat conductive elements and the absorption elements to make a plurality of fuses; and fabricating one or more circuits of the logic chip to include the plurality of fuses.
Claim 33
Dependent Claim
17 words
The method of claim 26 and further comprising fabricating a transistor that comprises the plurality of fuses.
Claim 34
Dependent Claim
20 words
The method of claim 26 and further comprising fabricating a fusible link for each fuse in the plurality of fuses.
Claim 35
Dependent Claim
31 words
The method of claim 26 wherein each absorption element of the plurality of absorption elements is overlayed at a thickness that permits preselection of laser energy required to blow the fuse.
Claim 36
Dependent Claim
28 words
The method of claim 26 wherein each absorption element is formulated with respect to silicon-to-nitride ratio to preselect laser energy required to blow each fuse of the plurality.
Claim 37
Independent Claim
167 words
A method for protecting memory cells that are exposed to different energy levels in a memory chip and to activate a spare column or row of memory cells, comprising: providing a plurality of first elements, each element comprising a heat conductive material to make a heat conductive element and fabricating the plurality of first elements into a memory chip comprising one or more spare columns or rows of memory cells; providing a plurality of absorption elements, each element comprising a material with an adjustable capacity for heat or light absorption that overlays each of the heat conductive elements, wherein the plurality has at least two different capacities for heat or light absorption, and an outer insulating element that overlays and encloses each of the heat conductive elements and the absorption elements to make a plurality of fuses; and fabricating one or more circuits of the memory chip to include the plurality of fuses so that when the fuses are blown, the spare column or row is activated.
Claim 38
Independent Claim
167 words
A method for protecting memory cells that are exposed to different energy levels in a memory chip and to activate a spare column or row of memory cells, comprising: providing a plurality of first elements, each element comprising a heat conductive material to make a heat conductive element and fabricating the plurality of first elements into a memory chip comprising one or more spare columns or rows of memory cells; providing a plurality of absorption elements, each element comprising a material with an adjustable capacity for heat or light absorption that overlays each of the heat conductive elements, wherein the plurality has at least two different capacities for heat or light absorption, and an outer insulating element that overlays and encloses each of the heat conductive elements and the absorption elements to make a plurality of fuses; and fabricating one or more circuits of the memory chip to include the plurality of fuses so that when the fuses are blown, the spare column or row is activated.
Claim 39
Dependent Claim
17 words
The method of claim 31 and further comprising fabricating a transistor that comprises the plurality of fuses.
Claim 40
Dependent Claim
20 words
The method of claim 31 and further comprising fabricating a fusible link for each fuse in the plurality of fuses.
Claim 41
Dependent Claim
31 words
The method of claim 31 wherein each absorption element of the plurality of absorption elements is overlayed at a thickness that permits preselection of laser energy required to blow the fuse.
Claim 42
Dependent Claim
28 words
The method of claim 31 wherein each absorption element is formulated with respect to silicon-to-nitride ratio to preselect laser energy required to blow each fuse of the plurality.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 2005-07-22 | 2006-01-21 | 2006-07-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-07-22 | 2010-01-21 | 2010-07-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-07-22 | 2014-01-21 | 2014-07-23 | $7700.00 | Window Closed / Lapsed |