Method of manufacturing a semiconductor device

Claim 1

A method of manufacturing a semiconductor device, comprising the steps of: forming a gate electrode consisted of a gate oxide film, a conductive layer and a first insulating film, thermal processing it under oxidization atmosphere, and forming a thermal oxide film on the upper portion of the gate oxide film and at the sidewalls of the conductive layer; forming a second insulating film on the entire structure and performing a blanket etching process to form a first insulating film spacer at the sidewalls of the gate electrode and forming a third insulating film on the entire structure in which the first insulating film spacer is formed and performing a blanket etching process to form a second insulating film spacer at the sidewalls of the first insulating film spacer; performing a high concentration ion injection process using the gate electrode. the first insulating film spacer and the second insulating film spacer as a mask, thus forming a junction region; performing a cleaning process to remove the second insulating film spacer; performing a selective epitaxial growth method to form a selective epitaxial growth layer on the exposed semiconductor device; and performing a low concentration ion injection process to form a LDD region.

Claim 2

A method of manufacturing a semiconductor device, comprising the steps of: forming a gate electrode consisted of a gate oxide film, a conductive layer and a first insulating film, thermal processing it under oxidization atmosphere, and forming a thermal oxide film on the upper portion of the gate oxide film and at the sidewalls of the conductive layer; forming a second insulating film on the entire structure and performing a blanket etching process to form a first insulating film spacer at the sidewalls of the gate electrode and forming a third insulating film on the entire structure in which the first insulating film spacer is formed and performing a blanket etching process to form a second insulating film spacer at the sidewalls of the first insulating film spacer; performing a high concentration ion injection process using the gate electrode. the first insulating film spacer and the second insulating film spacer as a mask, thus forming a junction region; performing a cleaning process to remove the second insulating film spacer; performing a selective epitaxial growth method to form a selective epitaxial growth layer on the exposed semiconductor device; and performing a low concentration ion injection process to form a LDD region.