Patent US6262895B1 successfully refreshed from Google Patents.
US6262895B1
Expired / Lapsed
US
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Stackable chip package with flex carrier
Assignee: Tamiras Per Pte Ltd LLC
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Filing: 2000-01-13
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Granted: 2001-07-17
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Expires: 2020-01-13
Abstract
Abstract A stackable integrated circuit chip package comprising a flex circuit. The flex circuit itself comprises a flexible substrate having opposed, generally planar top and bottom surfaces. Disposed on the top surface is a first conductive pad array, while disposed on the bottom surface is a second conductive pad array and third and fourth conductive pad arrays which are positioned on opposite sides of the second conductive pad array and electrically connected thereto. The chip package further comprises an integrated circuit chip which is electrically connected to the first and second conductive pad arrays, and hence to the third and fourth conductive pad arrays. The substrate is wrapped about at least a portion of the integrated circuit chip such that the third and fourth conductive pad arrays collectively define a fifth conductive pad array which is electrically connectable to another stackable integrated circuit chip package.
Inventors
- 👤 John A. Forthun
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:46
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/688; H10W90/00; H10W72/00; H10W72/801; H10W90/20; H10W90/288
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
122 words
A stackable integrated circuit chip package, comprising: a flex circuit comprising: a flexible substrate having opposed, generally planar top and bottom surfaces; a first conductive pad array disposed on the top surface; a second conductive pad array disposed on the bottom surface; and third and fourth conductive pad arrays disposed on the bottom surface on opposite sides of the second conductive pad array and electrically connected thereto; an integrated circuit chip electrically connected to the first and second conductive pad arrays; the substrate being wrapped about at least a portion of the integrated circuit chip such that the third and fourth conductive pad arrays collectively define a fifth conductive pad array which is electrically connectable to another stackable integrated circuit chip package.
Claim 2
Dependent Claim
122 words
A stackable integrated circuit chip package, comprising: a flex circuit comprising: a flexible substrate having opposed, generally planar top and bottom surfaces; a first conductive pad array disposed on the top surface; a second conductive pad array disposed on the bottom surface; and third and fourth conductive pad arrays disposed on the bottom surface on opposite sides of the second conductive pad array and electrically connected thereto; an integrated circuit chip electrically connected to the first and second conductive pad arrays; the substrate being wrapped about at least a portion of the integrated circuit chip such that the third and fourth conductive pad arrays collectively define a fifth conductive pad array which is electrically connectable to another stackable integrated circuit chip package.
Claim 3
Dependent Claim
63 words
The chip package of claim 1 wherein: the first conductive pad array comprises a first set of pads; and the second conductive pad array comprises a second set of pads which are arranged in an identical pattern to the first set of pads such that the pads of the first set are aligned with respective ones of the pads of the second set.
Claim 4
Dependent Claim
68 words
The chip package of claim 2 wherein: the third conductive pad array comprises a third set of pads; the fourth conductive pad array comprises a fourth set of pads; and the fifth conductive pad array comprises the third and fourth sets of pads which, when the substrate is wrapped about the integrated circuit chip, are arranged in an identical pattern to the first and second sets of pads.
Claim 5
Dependent Claim
25 words
The chip package of claim 3 wherein the third and fourth sets of pads are arranged in patterns which are mirror images to each other.
Claim 6
Dependent Claim
28 words
The chip package of claim 3 further comprising a plurality of cross-slits extending through the substrate between respective pairs of the pads of the first and second sets.
Claim 7
Dependent Claim
89 words
The chip package of claim 5 wherein the integrated circuit chip comprises: a body having opposed, generally planar top and bottom surfaces; and a plurality of conductive contacts protruding from the bottom surface of the body; the electrical connection of the integrated circuit chip to the first and second conductive pad arrays being facilitated by the insertion of the conductive contacts into the cross-slits of respective ones of the pads of the first set and advancement therethrough to protrude from respective ones of the pads of the second set.
Claim 8
Dependent Claim
31 words
The chip package of claim 6 wherein the conductive contacts are arranged on the bottom surface of the body in an identical pattern to the first and second sets of pads.
Claim 9
Dependent Claim
17 words
The chip package of claim 6 wherein each of the conductive contacts has a generally semi-spherical configuration.
Claim 10
Dependent Claim
77 words
The chip package of claim 6 wherein: the substrate has a generally rectangular configuration defining a pair of longitudinal peripheral edge segments and a pair of lateral peripheral edge segments; the first and second conductive pad arrays extend between the longitudinal peripheral edge segments in spaced relation to the lateral peripheral edge segments; and the third and fourth conductive pad arrays extend between the longitudinal peripheral edge segments along respective ones of the lateral peripheral edge segments.
Claim 11
Dependent Claim
82 words
The chip package of claim 9 wherein: the body of the integrated circuit chip has a generally rectangular configuration defining a pair of longitudinal sides and a pair of lateral sides; and the substrate is wrapped about the longitudinal sides of the body such that the fifth conductive pad array extends over the top surface of the body and the third and fourth sets of conductive pads are in substantial alignment with respective pairs of the first and second sets of pads.
Claim 12
Dependent Claim
71 words
The chip package of claim 10 wherein the substrate is sized relative to the integrated circuit chip such that the lateral peripheral edge segments of the substrate extend along the top surface of the body in generally parallel relation to each other and are separated by a narrow gap, and the lateral sides of the body are substantially flush with respective ones of the longitudinal peripheral edge segments of the substrate.
Claim 13
Dependent Claim
24 words
The chip package of claim 10 further comprising a pair of heat sinks attached to respective ones of the lateral sides of the body.
Claim 14
Dependent Claim
31 words
The chip package of claim 10 wherein the integrated circuit chip is selected from the group consisting of: a flip chip device; and a fine pitch ball grid array (BGA) device.
Claim 15
Dependent Claim
24 words
The chip package of claim 10 wherein the substrate is attached to the top surface of the body through the use of an adhesive.
Claim 16
Dependent Claim
18 words
The chip package of claim 1 wherein the substrate of the flex circuit is fabricated from a polyamide.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-07-16 | 2005-01-15 | 2005-07-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-07-16 | 2009-01-15 | 2009-07-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-07-16 | 2013-01-15 | 2013-07-17 | $7700.00 | Window Closed / Lapsed |