US6198630B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for electrical and mechanical attachment, and electromagnetic interference and thermal management of high speed, high density VLSI modules
Assignee: Hewlett Packard Enterprise Development LP
•
Filing: 1999-01-20
•
Granted: 2001-03-06
•
Expires: 2019-01-20
Abstract
Abstract A method and apparatus for assembling a high speed, high density VLSI module in a computer system that enables attachment, support, electromagnetic interference containment, and thermal management of the VLSI module. The present invention packages a high speed, high density VLSI module within a limited space and in a single assembly that attaches, aligns, and manages electromagnetic interference and heat dissipation of the VLSI module. The present invention aligns a land grid array of a circuit board and an interposer socket assembly, and the interposer socket assembly and a land grid array of the VLSI module; in the single VLSI module assembly. An even, controlled load is placed on the interposer socket interface thereby reducing the risk of damage to the interposer socket from overloaded connections between the land grid array of the VLSI module, the interposer socket assembly, and the land grid array of the circuit board. The present invention is easy-to-use in upgrading and handling of the VLSI module.
Inventors
- 👤 S. Daniel Cromwell
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 15:06
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/60; H10W40/611; H05; H05K; H05K7/00; H05K7/14; H05K7/1422; H05K7/1427; H05K7/1429; H05K7/1431
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
147 words
A VLSI module assembly comprising: a circuit board including a land grid array; a VLSI module for electrical connection to said circuit board, said VLSI module being a land grid array; an alignment frame attached to said circuit board, said alignment frame circumscribing and enclosing the sides of said VLSI module; a load spreader connected to said VLSI module and aligned to said alignment frame thereby loading said VLSI module for electrical connection to said circuit board; an overhead clamp, functioning as a spring, attached to said load spreader with pressure that applies load to said load spreader and to said VLSI module thereby electrically connecting said land grid array of said VLSI module to said land grid array of said circuit board; and a heat sink screw attached to said overhead clamp, and connected to said load spreader thereby evenly applying load to said VLSI module.
Claim 2
Dependent Claim
147 words
A VLSI module assembly comprising: a circuit board including a land grid array; a VLSI module for electrical connection to said circuit board, said VLSI module being a land grid array; an alignment frame attached to said circuit board, said alignment frame circumscribing and enclosing the sides of said VLSI module; a load spreader connected to said VLSI module and aligned to said alignment frame thereby loading said VLSI module for electrical connection to said circuit board; an overhead clamp, functioning as a spring, attached to said load spreader with pressure that applies load to said load spreader and to said VLSI module thereby electrically connecting said land grid array of said VLSI module to said land grid array of said circuit board; and a heat sink screw attached to said overhead clamp, and connected to said load spreader thereby evenly applying load to said VLSI module.
Claim 3
Dependent Claim
37 words
The VLSI module assembly as set forth in claim 1 , wherein said load spreader includes a heat sink so that said VLSI module thermally couples to said heat sink with a sufficiently low resistance thermal path.
Claim 4
Dependent Claim
49 words
The VLSI module assembly as set forth in claim 2 , wherein said heat sink further includes a heat sink base, and at least one heat fin attached to said heat sink base thereby transferring heat from said VLSI module to said heat sink base and said heat fin.
Claim 5
Dependent Claim
133 words
The VLSI module assembly as set forth in claim 1 , further comprising: a pair of electromagnetic interference gaskets that attenuates electromagnetic interference from said VLSI module, said pair of electromagnetic interference gaskets being disposed between said alignment frame and said circuit board and between said alignment frame and said load spreader, a first one of said electromagnetic interference gaskets disposed between said alignment frame and said heat sink being molded into a groove in said alignment frame; wherein said alignment frame includes electrically conductive material and said circuit board includes a ground plane; said circuit board being attached to said alignment frame thereby attenuating electromagnetic interference from said VLSI module; and said load spreader being connected to said VLSI module and said alignment frame thereby attenuating electromagnetic interference from said VLSI module.
Claim 6
Dependent Claim
151 words
A VLSI module assembly comprising: a circuit board; a VLSI module being soldered to said circuit board; an alignment frame shaped to circumscribe and enclose the sides of said VLSI module; a heat sink aligned to said alignment frame; and an overhead clamp attached to said heat sink and to said alignment frame, then said alignment frame being attached to said circuit board, thereby connecting said heat sink to said soldered VLSI module and absorbing heat from said soldered VLSI module by said heat sink; and a pair of electromagnetic interference gaskets that attenuates electromagnetic interference from said VLSI module, said pair of electromagnetic interference gaskets being disposed between said alignment frame and said circuit board and between said alignment frame and said heat sink, a first one of said electromagnetic interference gaskets disposed between said alignment frame and said heat sink being molded into a groove in said alignment frame.
Claim 7
Dependent Claim
151 words
A VLSI module assembly comprising: a circuit board; a VLSI module being soldered to said circuit board; an alignment frame shaped to circumscribe and enclose the sides of said VLSI module; a heat sink aligned to said alignment frame; and an overhead clamp attached to said heat sink and to said alignment frame, then said alignment frame being attached to said circuit board, thereby connecting said heat sink to said soldered VLSI module and absorbing heat from said soldered VLSI module by said heat sink; and a pair of electromagnetic interference gaskets that attenuates electromagnetic interference from said VLSI module, said pair of electromagnetic interference gaskets being disposed between said alignment frame and said circuit board and between said alignment frame and said heat sink, a first one of said electromagnetic interference gaskets disposed between said alignment frame and said heat sink being molded into a groove in said alignment frame.
Claim 8
Dependent Claim
42 words
The VLSI module assembly as set forth in claim 1 , further comprising an interposer socket assembly attached to said circuit board, and aligned and connected to said VLSI module thereby facilitating electrical connection of said VLSI module to said circuit board.
Claim 9
Dependent Claim
45 words
The VLSI module assembly as set forth in claim 6 , wherein said heat sink screw evenly applies load to said VLSI module and to said interposer socket assembly thereby electrically connecting, without overload, said VLSI module and said interposer socket to said circuit board.
Claim 10
Dependent Claim
260 words
A VLSI module assembly comprising: a circuit board including a ground plane and a land grid array; a VLSI module for electrical connection to said circuit board, said VLSI module being a land grid array; an alignment flame attached to said circuit board, said alignment frame circumscribing and enclosing the sides of said VLSI module, and including electrically conductive material thereby attenuating electromagnetic interference from said VLSI module; a heat sink connected to said VLSI module and aligned and connected to said alignment frame; thereby loading said VLSI module for electrical connection to said circuit board, thermally coupling said VLSI module to said heat sink with a sufficiently low resistance thermal path, and attenuating electromagnetic interference from said VLSI module; a pair of electromagnetic interference gaskets that attenuates electromagnetic interference from said VLSI module, said pair of electromagnetic interference gaskets being disposed between said alignment frame and said circuit board and between said alignment frame and said heat sink; an interposer socket assembly attached to said circuit board, and aligned and connected to said VLSI module thereby facilitating electrical coupling of said VLSI module to said circuit board; an overhead clamp, functioning as a spring, attached to said heat sink with pressure that applies load to said heat sink and to said VLSI module; and a heat sink screw attached to said overhead clamp, and connected to said heat sink and evenly applying load to said VLSI module and to said interposer socket assembly thereby electrically connecting, without overload, said VLSI module and said interposer socket to said circuit board.
Claim 11
Dependent Claim
260 words
A VLSI module assembly comprising: a circuit board including a ground plane and a land grid array; a VLSI module for electrical connection to said circuit board, said VLSI module being a land grid array; an alignment flame attached to said circuit board, said alignment frame circumscribing and enclosing the sides of said VLSI module, and including electrically conductive material thereby attenuating electromagnetic interference from said VLSI module; a heat sink connected to said VLSI module and aligned and connected to said alignment frame; thereby loading said VLSI module for electrical connection to said circuit board, thermally coupling said VLSI module to said heat sink with a sufficiently low resistance thermal path, and attenuating electromagnetic interference from said VLSI module; a pair of electromagnetic interference gaskets that attenuates electromagnetic interference from said VLSI module, said pair of electromagnetic interference gaskets being disposed between said alignment frame and said circuit board and between said alignment frame and said heat sink; an interposer socket assembly attached to said circuit board, and aligned and connected to said VLSI module thereby facilitating electrical coupling of said VLSI module to said circuit board; an overhead clamp, functioning as a spring, attached to said heat sink with pressure that applies load to said heat sink and to said VLSI module; and a heat sink screw attached to said overhead clamp, and connected to said heat sink and evenly applying load to said VLSI module and to said interposer socket assembly thereby electrically connecting, without overload, said VLSI module and said interposer socket to said circuit board.
Claim 12
Independent Claim
145 words
A method for creating a VLSI module assembly for a computer system, said computer system having a circuit board including a land grid array and a land grid array VLSI module, said method comprising: attaching an alignment frame to said circuit board and circumscribing and enclosing the sides of said VLSI module; connecting a load spreader to said VLSI module and aligning said load spreader to said alignment frame thereby loading said VLSI module for electrical connection to said circuit board; attaching an overhead clamp, functioning as a spring, to said load spreader with pressure that applies load to said load spreader and to said VLSI module thereby electrically connecting said VLSI module to said circuit board; and attaching a heat sink screw to said overhead clamp, and connecting said heat sink screw to said load spreader thereby evenly applying load to said VLSI module.
Claim 13
Independent Claim
145 words
A method for creating a VLSI module assembly for a computer system, said computer system having a circuit board including a land grid array and a land grid array VLSI module, said method comprising: attaching an alignment frame to said circuit board and circumscribing and enclosing the sides of said VLSI module; connecting a load spreader to said VLSI module and aligning said load spreader to said alignment frame thereby loading said VLSI module for electrical connection to said circuit board; attaching an overhead clamp, functioning as a spring, to said load spreader with pressure that applies load to said load spreader and to said VLSI module thereby electrically connecting said VLSI module to said circuit board; and attaching a heat sink screw to said overhead clamp, and connecting said heat sink screw to said load spreader thereby evenly applying load to said VLSI module.
Claim 14
Dependent Claim
42 words
The method as set forth in claim 9 , wherein connecting said load spreader step further includes substituting said load spreader with a heat sink and thermally coupling said heat sink to said VLSI module with a sufficiently low resistance thermal path.
Claim 15
Dependent Claim
122 words
The method as set forth in claim 9 , further comprising: sandwiching a pair of electromagnetic interference gaskets between said alignment frame and said circuit board and between said alignment frame and said load spreader thereby attenuating electromagnetic interference from said VLSI module, a first one of said electromagnetic interference gaskets disposed between said alignment frame and said heat sink being molded into a groove in said alignment frame; attaching said alignment frame to said circuit board, wherein said alignment frame includes electrically conductive material and said circuit board includes a ground plane, thereby attenuating electromagnetic interference from said VLSI module; and connecting said load spreader to said VLSI module and said alignment frame thereby attenuating electromagnetic interference from said VLSI module.
Claim 16
Independent Claim
159 words
A method for creating a VLSI module assembly for a computer system, said computer system having a circuit board and a VLSI module, said method comprising: mounting said VLSI module to said circuit board; installing an alignment frame to circumscribe and enclose the sides of said VLSI module; aligning a heat sink to said alignment frame; attaching an overhead clamp to said heat sink and to said alignment frame, then attaching said alignment frame to said circuit board, thereby connecting said heat sink to said mounted VLSI module and absorbing heat from said mounted VLSI module by said heat sink; and sandwiching a pair of electromagnetic interference gaskets between said alignment frame and said circuit board and between said alignment frame and said heat sink thereby attenuating electromagnetic interference from said VLSI module, a first one of said electromagnetic interference gaskets disposed between said alignment frame and said heat sink being molded into a groove in said alignment frame.
Claim 17
Independent Claim
159 words
A method for creating a VLSI module assembly for a computer system, said computer system having a circuit board and a VLSI module, said method comprising: mounting said VLSI module to said circuit board; installing an alignment frame to circumscribe and enclose the sides of said VLSI module; aligning a heat sink to said alignment frame; attaching an overhead clamp to said heat sink and to said alignment frame, then attaching said alignment frame to said circuit board, thereby connecting said heat sink to said mounted VLSI module and absorbing heat from said mounted VLSI module by said heat sink; and sandwiching a pair of electromagnetic interference gaskets between said alignment frame and said circuit board and between said alignment frame and said heat sink thereby attenuating electromagnetic interference from said VLSI module, a first one of said electromagnetic interference gaskets disposed between said alignment frame and said heat sink being molded into a groove in said alignment frame.
Claim 18
Dependent Claim
44 words
The method as set forth in claim 9 , further comprising attaching an interposer socket assembly to said circuit board, and aligning and connecting said interposer socket assembly to said VLSI module thereby facilitating electrical connection of said VLSI module to said circuit board.
Claim 19
Dependent Claim
58 words
The method set forth in claim 13 , wherein said attaching a heat sink screw to said overhead clamp, and connecting said heat sink screw to said load spreader evenly applies load to said VLSI module and to said interposer socket assembly thereby electrically connecting, without overload, said VLSI module and said interposer socket to said circuit board.
References Cited (Backward Citations)
US4120019A
Cited
US4067237A
Cited
US4167031A
Cited
US4342069A
Cited
US4376560A
Cited
US4506938A
Cited
US4540226A
Cited
US4638854A
Cited
US4675783A
Cited
US4589716A
Cited
US4563383A
Cited
US4707726A
Cited
US4652973A
Cited
US4874318A
Cited
US4829432A
Cited
US4961633A
Cited
US4951740A
Cited
US4858093A
Cited
US5078622A
Cited
US5010292A
Cited
US4978638A
Cited
US4975825A
Cited
US5229915A
Cited
US5060112A
Cited
US5118925A
Cited
US5131859A
Cited
US5508908A
Cited
US5162974A
Cited
US5136119A
Cited
US5241453A
Cited
US5208731A
Cited
US5504650A
Cited
US5398822A
Cited
US5252782A
Cited
US5359768A
Cited
US5311397A
Cited
US5442234A
Cited
US5387554A
Cited
US5307239A
Cited
US5311395A
Cited
US5276585A
Cited
US5522602A
Cited
US5587883A
Cited
US5339214A
Cited
US5313099A
Cited
US5592391A
Cited
US5475606A
Cited
US5587920A
Cited
US5329426A
Cited
US5394607A
Cited
US5367193A
Cited
US5359493A
Cited
US5436800A
Cited
US5648890A
Cited
US5487673A
Cited
US5386338A
Cited
US5428897A
Cited
US5461766A
Cited
US5461541A
Cited
US5424918A
Cited
US5592366A
Cited
US5506758A
Cited
US5502622A
Cited
US5628636A
Cited
US5460571A
Cited
US5513070A
Cited
US5558522A
Cited
US5621635A
Cited
US5598320A
Cited
US5586005A
Cited
US5641995A
Cited
US5640304A
Cited
US5730620A
Cited
US5579827A
Cited
US5738531A
Cited
US5766031A
Cited
US5722839A
Cited
US5784257A
Cited
US5808236A
Cited
US5919050A
Cited
US5880930A
Cited
US5917703A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-03-05 | 2004-09-04 | 2005-03-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-03-05 | 2008-09-04 | 2009-03-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-03-05 | 2012-09-04 | 2013-03-06 | $7700.00 | Window Closed / Lapsed |