VLSI optimized modulator

Claim 2

A multi-gate electro-optic modulator constructed in an integrated circuit package comprising: an integrated circuit package comprising a flat upper surface and a hollow area located within said flat surface and accompanying electric signal lead connections emanating from within said hollow area of said integrated circuit package body, at least one first integrated circuit means mounted in the hollow area, said integrated circuit means including a plurality of electrically conductive electrodes in spaced apart relationship in a predetermined pattern and a plurality of electric lead connections connected to said lead connections of said package, said integrated circuit means being aligned in a predetermined aspect within said integrated circuit package, electro-optic element means mounted on said flat surface, and partially overlapping said hollow area of said package, containing electrically conductive electrodes which are adapted to contact the electrodes on said integrated circuit means so as to produce electric fields into said electro-optic element means, said electro-optic element means comprising a layer of optically transparent electro-optically responsive crystal, a layer of resilient compressed material between the bottom of the hollow area of said package and the bottom of said integrated circuit means for applying equal pressure to press the electrodes of the integrated circuit means and electro-optic element means into contact, a layer of glass or similar protection means mounted on the top surface of said electro-optic element means for protection of said electro-optic element means, and glue for cementing the edges of said crystal to the flat upper surface of said package.

Claim 3

The multi-gate electro-optic modulator as set forth in claim 1, further including encapsulant means being placed on and around said leads and the edges of said integrated circuit means.

Claim 4

The multi-gate electro-optic modulator as set forth in claim 2, wherein said crystal layer is intimately bonded to the surface of said integrated circuit means containing said electrically conductive electrodes, and said glass or similar protection means is intimately bonded to said crystal layer.

Claim 5

The multi-gate electro-optic modulator as set forth in claim 3, wherein said integrated circuit means is more or less aligned in the center of and longitudinally with said integrated circuit package.

Claim 6

The multi-gate electro-optic modulator as set forth in claim 4, wherein all of the electrical lead connections are at one end of said integrated circuit means.

Claim 7

A multi-gate electro-optic modulator constructed in an integrated circuit package comprising: an integrated circuit package comprising a flat upper surface and a hollow area comprising a flat bottom located within said flat surface and accompanying electric signal lead connections emanating from within said hollow area of said integrated circuit package body, at least one first integrated circuit means mounted in the hollow area, said integrated circuit means comprising an upper surface, a plurality of electrically conductive electrodes in spaced apart relationship in a predetermined pattern and a plurality of electric lead connections connected to said lead connections of said package, said integrated circuit means being aligned in a predetermined aspect within said integrated circuit package, electro-optic element means having a flat top mounted on said flat surface, and partially overlapping said hollow area of said package, containing electrically conductive electrodes which are adapted to contact the electrodes on said integrated circuit means so as to produce electric fields into said electro-optic element means, said electro-optic element means comprising a layer of optically transparent electro-optically responsive crystal, a layer of resilient compressed material between the bottom of the hollow area of said package and the bottom of said integrated circuit means for biasing the electrodes of the integrated circuit means and electro-optic element means into contact, a layer of glass or similar protection means mounted on the top surface of said electro-optic element means for protection of said electro-optic element means, and glue for cementing said crystal to the flat upper surface of said package, further including encapsulant means being placed on and around said leads and between said leads and said electro-optic element means, wherein said crystal layer is intimately bonded to said upper surface of said integrated circuit means containing said electrically conductive electrodes, and said glass or similar protection means is intimately bonded to said crystal layer, further including a second integrated circuit means mounted in the hollow body of said integrated circuit package, said first and second integrated circuit means being mounted essentially longitudinally in said integrated circuit package, such that said first integrated circuit means and said second integrated circuit means are almost end to end from one another, but offset slightly from the center of said integrated circuit package.

Claim 8

A multi-gate electro-optic modulator constructed in an integrated circuit package comprising: an integrated circuit package comprising a flat upper surface and a hollow area comprising a flat bottom located within said flat surface and accompanying electric signal lead connections emanating from within said hollow area of said integrated circuit package body, at least one first integrated circuit means mounted in the hollow area, said integrated circuit means comprising an upper surface, a plurality of electrically conductive electrodes in spaced apart relationship in a predetermined pattern and a plurality of electric lead connections connected to said lead connections of said package, said integrated circuit means being aligned in a predetermined aspect within said integrated circuit package, electro-optic element means having a flat top mounted on said flat surface, and partially overlapping said hollow area of said package, containing electrically conductive electrodes which are adapted to contact the electrodes on said integrated circuit means so as to produce electric fields into said electro-optic element means, said electro-optic element means comprising a layer of optically transparent electro-optically responsive crystal, a layer of resilient compressed material between the bottom of the hollow area of said package and the bottom of said integrated circuit means for biasing the electrodes of the integrated circuit means and electro-optic element means into contact, a layer of glass or similar protection means mounted on the top surface of said electro-optic element means for protection of said electro-optic element means, and glue for cementing said crystal to the flat upper surface of said package, further including encapsulant means being placed on and around said leads and between said leads and said electro-optic element means, wherein said crystal layer is intimately bonded to said upper surface of said integrated circuit means containing said electrically conductive electrodes, and said glass or similar protection means is intimately bonded to said crystal layer, further including a second integrated circuit means mounted in the hollow body of said integrated circuit package, said first and second integrated circuit means being mounted essentially longitudinally in said integrated circuit package, such that said first integrated circuit means and said second integrated circuit means are almost end to end from one another, but offset slightly from the center of said integrated circuit package.

Claim 9

The multi-gate electro-optic modulator as set forth in claim 6, wherein the ends of said first and second integrated circuit means overlap somewhat in their offset positions in said integrated circuit package.

Claim 10

The multi-gate electro-optic modulator as set forth in claim 7, wherein the electrical pads of said electrically conductive electrodes on said first and second integrated circuit means are at opposite ends of said integrated circuit package.