US5641995A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Attachment of ceramic chip carriers to printed circuit boards
Assignee: Keysight Technologies Inc
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Filing: 1995-03-22
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Granted: 1997-06-24
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Expires: 2015-03-22
Abstract
Abstract A leadless chip carrier is attached to a printed circuit board by soldering its input-output connections to the printed circuit board and also by providing an adhesive between a central portion of the leadless chip carrier and the printed circuit board. This adhesive provides increased mechanical strength to the connection, improving its tolerance to temperature cycling. The adhesive used may be the same solder used to make the input-output connections.
Inventors
- 👤 Katrina Sloma
- 👤 Martin L. Guth
- 👤 Albert A. Yeh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 01:08
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K3/305; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3442; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/657; H05K1/00; H05K1/02; H05K1/0201; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10727; H05K2201/10954; H05K2201/10969; H05K3/321; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
116 words
An electronic circuit device comprising: a substrate having a first surface and a second surface; an electronic circuit located on said first surface; a plurality of connection sites located at the periphery of said second surface, said connection sites being electrically connected with at least portions of said electronic circuit; a printed circuit board having a plurality of receptor sites located thereon; said connection sites being electrically connected to said receptor sites; said substrate being substantially immovably attached to said printed circuit board by an adhesive which is bonded to both said printed circuit board and said second surface of said substrate; and wherein said adhesive is spaced from at least one of said receptor sites.
Claim 2
Dependent Claim
116 words
An electronic circuit device comprising: a substrate having a first surface and a second surface; an electronic circuit located on said first surface; a plurality of connection sites located at the periphery of said second surface, said connection sites being electrically connected with at least portions of said electronic circuit; a printed circuit board having a plurality of receptor sites located thereon; said connection sites being electrically connected to said receptor sites; said substrate being substantially immovably attached to said printed circuit board by an adhesive which is bonded to both said printed circuit board and said second surface of said substrate; and wherein said adhesive is spaced from at least one of said receptor sites.
Claim 3
Dependent Claim
21 words
The electronic circuit device of claim 1 wherein said adhesive is electrically insulated from at least one of said connection sites.
Claim 4
Dependent Claim
25 words
The electronic circuit device of claim 1 wherein said adhesive covers at least 25% of the surface area of the second surface of said substrate.
Claim 5
Dependent Claim
25 words
The electronic circuit device of claim 1 wherein said adhesive covers at least 50% of the surface area of the second surface of said substrate.
Claim 6
Dependent Claim
20 words
The electronic circuit device of claim 1 wherein said adhesive covers substantially all of the second surface of said substrate.
Claim 7
Dependent Claim
13 words
The electronic circuit device of claim 1 wherein said adhesive comprises a solder.
Claim 8
Dependent Claim
15 words
The electronic circuit device of claim 1 wherein said adhesive is an electrically conductive adhesive.
Claim 9
Dependent Claim
152 words
An electronic circuit device having at least one chip carrier device mounted on a printed circuit board comprising: a plurality of receptor sites located on said printed circuit board; said chip carrier device having a first surface and a second surface; an electronic circuit located on said first surface; a plurality of connection sites located at the periphery of said second surface, said connection sites being electrically connected with at least portions of said electronic circuit and with at least one of said receptor sites of said printed circuit board; a central area of said second surface located substantially interiorly of said connection sites; said chip carrier device being substantially immovably attached to said printed circuit board by an adhesive which is bonded to both said central area of said chip carrier device and said printed circuit board; and wherein said adhesive is spaced from at least one of said receptor sites.
Claim 10
Dependent Claim
152 words
An electronic circuit device having at least one chip carrier device mounted on a printed circuit board comprising: a plurality of receptor sites located on said printed circuit board; said chip carrier device having a first surface and a second surface; an electronic circuit located on said first surface; a plurality of connection sites located at the periphery of said second surface, said connection sites being electrically connected with at least portions of said electronic circuit and with at least one of said receptor sites of said printed circuit board; a central area of said second surface located substantially interiorly of said connection sites; said chip carrier device being substantially immovably attached to said printed circuit board by an adhesive which is bonded to both said central area of said chip carrier device and said printed circuit board; and wherein said adhesive is spaced from at least one of said receptor sites.
Claim 11
Dependent Claim
16 words
The electronic circuit device of claim 8 wherein said central area comprises a conductive back plane.
Claim 12
Dependent Claim
18 words
The electronic circuit device of claim 8 wherein said adhesive covers at least 25% of said central area.
Claim 13
Dependent Claim
18 words
The electronic circuit device of claim 8 wherein said adhesive covers at least 50% of said central area.
Claim 14
Dependent Claim
17 words
The electronic circuit device of claim 8 wherein said adhesive covers substantially all of said central area.
Claim 15
Dependent Claim
14 words
The electronic circuit device of claim 8 wherein said adhesive comprises a solder material.
Claim 16
Dependent Claim
15 words
The electronic circuit device of claim 8 wherein said adhesive is an electrically conductive adhesive.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-06-23 | 2000-12-23 | 2001-06-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-06-23 | 2004-12-23 | 2005-06-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-06-23 | 2008-12-23 | 2009-06-24 | $7700.00 | Window Closed / Lapsed |