Semiconductor device

Abstract

Abstract PURPOSE:To increase reliability of the title device by preventing any bubble from being left behind and hence adhesive force from being lowered during bonding by providing radially a plurality of grooves, that are opened on end surface sides, in a metal member to which a semiconductor chip is fixed through a bonding material. CONSTITUTION:Patterns of metal members 1, 2 such as Cu, Cu+Ag plating are prepared on an insulating film 7 on a printed board 8. Thereupon, radial groove 3, that are opened on end surface sides, are opened in the metal member 1, into which a bonding material 6 is dropped down to fix a semiconductor chip 4. With the provision of the grooves 3, any bubble is prevented from being left behind in the bonding material 6, and hence thermal resistance is lowered as well as adhesive force is prevented from being lowered owing to a difference between thermal chock. Thus, reliability of the device is improved.

Inventors

• 👤 Masanobu Kawai
• 👤 川合　正信

Bibliographic Details