Patent US6188129B1 successfully refreshed from Google Patents.
US6188129B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Stacked semiconductor chip package having external terminal pads and stackable chips having a protection layer
Assignee: SK Hynix Inc
•
Filing: 1998-03-23
•
Granted: 2001-02-13
•
Expires: 2018-03-23
Abstract
Abstract The stackable semiconductor chip includes a semiconductor chip having pads on an upper surface thereof, and an adhesive formed on lateral surfaces of the semiconductor chip. A first insulation layer is formed over the upper surface of the semiconductor chip and the adhesive, and defines a plurality of through holes which expose the pads. Metal lines, formed on the first insulation layer, are connected to a respective one of the pads via a respective one of the through holes. A protective layer is formed on the metal lines and the first insulation layer. A plurality of stackable semiconductor chips are stacked by disposing double-sided adhesive between the stackable semiconductor chips. Then a plurality of external terminal pads are formed on one of the lateral surfaces of the stack of stackable semiconductor chips. Each external terminal pad is electrically connected to at least one of the metal lines in one of the stackable semiconductor chips. Next, a solder ball is formed on each of the plurality of external terminal pads to produce a stacked semiconductor chip package.
Inventors
- 👤 Kyung Wook Paik
- 👤 Jin Su Kim
- 👤 Hyoung Soo Ko
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 22:18
CPC Classifications
H; H10; H10W; H10W74/00; H10W90/00; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/07254; H10W72/20; H10W72/241; H10W72/242; H10W72/834; H10W90/20; H10W90/297
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
184 words
A module of stackable semiconductor chips, comprising: a plurality of stackable semiconductor chips stacked one on top of another with double-sided adhesive disposed between said stackable semiconductor chips, each one of said stackable semiconductor chips including, a semiconductor chip having pads on an upper surface thereof, an adhesive formed on at least lateral surfaces of said semiconductor chip, a first insulation layer formed over said upper surface of said semiconductor chip and said adhesive, and defining a plurality of through holes which expose said pads, metal lines formed on said first insulation layer, each metal line connected to a respective one of said pads via a respective one of said through holes, and a protection layer formed on said metal lines and said first insulation layer; a plurality of external terminal pads formed on at least one lateral surface of said stack of stackable semiconductor chips, each one of said external terminal pads electrically connected to at least one of said metal lines in one of said stackable semiconductor chips; and a solder ball formed on each of said plurality of external terminal pads.
Claim 2
Dependent Claim
184 words
A module of stackable semiconductor chips, comprising: a plurality of stackable semiconductor chips stacked one on top of another with double-sided adhesive disposed between said stackable semiconductor chips, each one of said stackable semiconductor chips including, a semiconductor chip having pads on an upper surface thereof, an adhesive formed on at least lateral surfaces of said semiconductor chip, a first insulation layer formed over said upper surface of said semiconductor chip and said adhesive, and defining a plurality of through holes which expose said pads, metal lines formed on said first insulation layer, each metal line connected to a respective one of said pads via a respective one of said through holes, and a protection layer formed on said metal lines and said first insulation layer; a plurality of external terminal pads formed on at least one lateral surface of said stack of stackable semiconductor chips, each one of said external terminal pads electrically connected to at least one of said metal lines in one of said stackable semiconductor chips; and a solder ball formed on each of said plurality of external terminal pads.
Claim 3
Dependent Claim
27 words
The module of claim 1 , wherein said adhesive is formed on lateral surfaces of said semiconductor chip and on said upper surface of said semiconductor chip.
Claim 4
Dependent Claim
34 words
The module of claim 2 , wherein said protection layer includes an adhesive layer formed on said metal lines and said first insulation layer, and a second insulation layer formed on said adhesive layer.
Claim 5
Dependent Claim
19 words
The module of claim 3 , wherein said adhesive and said adhesive layer are formed from the same material.
Claim 6
Dependent Claim
20 words
The module of claim 4 , wherein said adhesive and said adhesive layer are formed from a thermoplastic polymer adhesive.
Claim 7
Dependent Claim
37 words
The module of claim 4 , wherein said adhesive and adhesive layer are formed from a thermoplastic polymer adhesive having a glass transition temperature which is less than a glass transition temperature of said first insulation layer.
Claim 8
Dependent Claim
14 words
The module of claim 6 , wherein said thermoplastic polymer adhesive is a polyetherimide.
Claim 9
Dependent Claim
19 words
The module of claim 3 , wherein said first and second insulation layers are formed of the same material.
Claim 10
Dependent Claim
18 words
The module of claim 8 , wherein said first and second insulation layers are formed of a polyimide.
Claim 11
Dependent Claim
15 words
The module of claim 1 , wherein said metal lines include titanium and copper layers.
Claim 12
Dependent Claim
34 words
The module of claim 1 , wherein said protection layer includes an adhesive layer formed on said metal lines and said first insulation layer, and a second insulation layer formed on said adhesive layer.
Claim 13
Dependent Claim
21 words
The module of claim 1 , wherein said metal lines extend past one of said lateral surfaces of said semiconductor chip.
Claim 14
Dependent Claim
28 words
The module of claim 1 , wherein ends of said metal lines form a portion of one of said lateral surfaces of said stack of semiconductor chip packages.
Claim 15
Dependent Claim
20 words
The module of claim 1 , wherein said doublesided adhesive includes a polyimide film with and epoxy resin coated thereon.
Claim 16
Dependent Claim
25 words
The module of claim 1 , wherein said external terminal pads includes a titanium layer, a copper layer, a nickel layer and a gold layer.
Claim 17
Dependent Claim
48 words
The module of claim 1 , wherein said external terminal pads are formed directly on said at least one lateral surface of said stack of semiconductor chips, each pad contacting at least a protection layer and a first insulation layer of at least one of said semiconductor chips.
References Cited (Backward Citations)
US5104820A
Cited
US5161093A
Cited
US5073814A
Cited
US5397916A
Cited
US5455459A
Cited
US5279991A
Cited
US5324687A
Cited
US5497033A
Cited
US5561622A
Cited
US5434751A
Cited
US5675180A
Cited
US5861666A
Cited
US5726492A
Cited
US5825080A
Cited
US5907178A
Cited
US5910682A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-02-13 | 2004-08-14 | 2005-02-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-02-13 | 2008-08-14 | 2009-02-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-02-13 | 2012-08-14 | 2013-02-13 | $7700.00 | Window Closed / Lapsed |