Semiconductor device including stacked die

Claim 1

A three dimensional semiconductor device comprising: a plurality of integrated circuit die each having a first edge, a second edge, and a plurality of contacts along at least said first edge; a plurality of separators; said die and said separators arranged in a stack of alternating layers of die and separators, wherein said first edges of all of the die face in a first direction and said second edges of all of the die face in a direction opposite said first direction; a plurality of electrically conductive leads arranged in groups, one group for each die, the leads in each group having inner and outer ends, wherein the inner ends are connected one each to the contacts on a die and the outer ends are curved over an edge of said die; a first side having a plurality of electrically conductive contact areas connected in a predetermined pattern, wherein said first side is located adjacent the first edges of said die and the curved portions of the leads extending over said first edges resiliently contact said contact areas; a second side located adjacent the second edges of said die; and a flexible cover engaging said first side and said second side and holding said sides in place.