US4890154A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor package profile
Assignee: LSI Corp
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Filing: 1988-03-02
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Granted: 1989-12-26
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Expires: 2008-03-02
Abstract
Abstract An improved package with J-leads for an integrated circuit is obtained by modifying the package profile so as to relieve the bottom edge to provide space for insertion of a rod to be used as a tool to shape or reshape the curved part of the leads. This permits both easier original manufacturing and faster and better reshaping of bent leads.
Inventors
- 👤 Vahak K. Sahakian
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 10:54
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W70/429; H10W70/60; H10W70/67; H10W70/68
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
100 words
An integrated circuit package for use with electrical leads extending from a surface of said package, said package having opposed top and bottom surfaces and a peripheral surface and wherein said leads each have a first portion extending from the peripheral surface of the package and a second, arc-shaped, portion extending to a position adjacent to said bottom surface of said package; wherein the peripheral and bottom surfaces are connected by an arc-shaped surface arched inwardly of the body of said package; and wherein the arc-shaped portions of the leads and the arc-shaped surface share a common radius center point.
Claim 2
Dependent Claim
100 words
An integrated circuit package for use with electrical leads extending from a surface of said package, said package having opposed top and bottom surfaces and a peripheral surface and wherein said leads each have a first portion extending from the peripheral surface of the package and a second, arc-shaped, portion extending to a position adjacent to said bottom surface of said package; wherein the peripheral and bottom surfaces are connected by an arc-shaped surface arched inwardly of the body of said package; and wherein the arc-shaped portions of the leads and the arc-shaped surface share a common radius center point.
Claim 3
Dependent Claim
13 words
The device of claim 1, wherein said package is a leaded chip carrier.
Claim 4
Dependent Claim
13 words
The device of claim 1, wherein said package is a leaded dual-in-line package.
Claim 5
Dependent Claim
13 words
The device of claim 1, for use with electrical leads that are J-shaped.
Claim 6
Dependent Claim
98 words
An integrated circuit package having electrical leads extending from a surface of said package, said package comprising opposed top and bottom surfaces and a peripheral surface and wherein said leads each have a first portion extending from the peripheral surface of the package and a second, arc-shaped, portion extending to a position adjacent to said bottom surface of said package; wherein the peripheral and bottom surfaces are connected by an arc-shaped surface arched inwardly of the body of said package; and wherein the arc-shaped portions of the leads and the arc-shaped surface share a common radius center point.
Claim 7
Dependent Claim
98 words
An integrated circuit package having electrical leads extending from a surface of said package, said package comprising opposed top and bottom surfaces and a peripheral surface and wherein said leads each have a first portion extending from the peripheral surface of the package and a second, arc-shaped, portion extending to a position adjacent to said bottom surface of said package; wherein the peripheral and bottom surfaces are connected by an arc-shaped surface arched inwardly of the body of said package; and wherein the arc-shaped portions of the leads and the arc-shaped surface share a common radius center point.
Claim 8
Dependent Claim
98 words
An integrated circuit package having electrical leads extending from a surface of the package, said package comprising opposed top and bottom surfaces and a peripheral surface, and wherein said leads each have a first portion extending from the peripheral surface of the package and a second curved portion extending to a position adjacent to said bottom surface of said package; wherein the peripheral and bottom surfaces are connected by a curved surface arched inwardly of the body of said package, and wherein the curved portions of the leads and the curved surface define a void elliptical in shape.
Claim 9
Dependent Claim
98 words
An integrated circuit package having electrical leads extending from a surface of the package, said package comprising opposed top and bottom surfaces and a peripheral surface, and wherein said leads each have a first portion extending from the peripheral surface of the package and a second curved portion extending to a position adjacent to said bottom surface of said package; wherein the peripheral and bottom surfaces are connected by a curved surface arched inwardly of the body of said package, and wherein the curved portions of the leads and the curved surface define a void elliptical in shape.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-12-25 | 1993-06-26 | 1993-12-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-12-25 | 1997-06-26 | 1997-12-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-12-25 | 2001-06-26 | 2001-12-26 | $7700.00 | Window Closed / Lapsed |