Patent US6107119A successfully refreshed from Google Patents.
US6107119A
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Method for fabricating semiconductor components
Assignee: Micron Technology Inc
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Filing: 1998-07-06
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Granted: 2000-08-22
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Expires: 2018-07-06
Abstract
Abstract A method for fabricating semiconductor components such as printed circuit boards, multi chip modules, chip scale packages, and test carriers is provided. The method includes providing a substrate having a blanket deposited conductive layer thereon. Using a laser machining process, grooves are formed in the conductive layer to define patterns of conductors on the substrate. The conductors can be formed with a desired size and spacing, and can include features such as bond pads, conductive vias, and external ball contacts. In addition, selected conductors can be configured as co-planar ground or voltage traces, for adjusting impedance values in other conductors configured as signal traces.
Inventors
- 👤 Warren M. Farnworth
- 👤 Alan G. Wood
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 16:57
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; G; G01; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2855; G01R31/286; G01R31/2865; G01R31/2867; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0216; H05K1/0218; H05K3/00; H05K3/02; H05K3/027; H10W70/00; H10W70/01; H10W70/05; H10W70/60; H10W70/62; H10W70/65; H10W78/00; H10W90/00; H10W90/701; G01R1/00; G01R1/02; G01R1/04; G01R1/0408; G01R1/0433; G01R1/0483; G01R3/00; H05K1/11; H05K1/111; H05K1/112; H05K1/113; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/0929; H05K2201/09363; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W72/541; H10W72/5445; H10W72/90; H10W72/931; H10W72/932; H10W72/951; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
90 words
A method for fabricating a semiconductor component comprising: providing a substrate comprising a surface and a conductive layer on the surface; laser machining a plurality of grooves through the conductive layer to the surface to define a plurality of conductors on the surface and a plurality of pads on the surface in electrical communication with the conductors, each conductor and each pad comprising a portion of the conductive layer with a groove on either side thereof; and mounting a semiconductor die to the substrate in electrical communication with the pads.
Claim 2
Independent Claim
90 words
A method for fabricating a semiconductor component comprising: providing a substrate comprising a surface and a conductive layer on the surface; laser machining a plurality of grooves through the conductive layer to the surface to define a plurality of conductors on the surface and a plurality of pads on the surface in electrical communication with the conductors, each conductor and each pad comprising a portion of the conductive layer with a groove on either side thereof; and mounting a semiconductor die to the substrate in electrical communication with the pads.
Claim 3
Dependent Claim
25 words
The method of claim 1 further comprising forming a plurality of conductive vias in the substrate in electrical communication with the conductors and the pads.
Claim 4
Dependent Claim
29 words
The method of claim 1 further comprising forming a plurality of contacts on an opposing second surface of the substrate in electrical communication with the conductors and the pads.
Claim 5
Independent Claim
122 words
A method for fabricating a semiconductor component comprising: providing a substrate comprising a first surface, an opposing second surface, and a conductive layer on the first surface; laser machining a plurality of grooves through the conductive layer to the surface to define a plurality of conductors on the surface, each conductor comprising a portion of the conductive layer with a groove on either side thereof; laser machining a plurality of vias in the substrate in electrical communication with the conductors, each via extending from the first surface to the second surface; depositing a conductive material in the vias to form a plurality of conductive vias; and forming a plurality of contacts on the second surface in electrical communication with the conductive vias.
Claim 6
Independent Claim
122 words
A method for fabricating a semiconductor component comprising: providing a substrate comprising a first surface, an opposing second surface, and a conductive layer on the first surface; laser machining a plurality of grooves through the conductive layer to the surface to define a plurality of conductors on the surface, each conductor comprising a portion of the conductive layer with a groove on either side thereof; laser machining a plurality of vias in the substrate in electrical communication with the conductors, each via extending from the first surface to the second surface; depositing a conductive material in the vias to form a plurality of conductive vias; and forming a plurality of contacts on the second surface in electrical communication with the conductive vias.
Claim 7
Dependent Claim
20 words
The method of claim 4 further comprising mounting a semiconductor die to the substrate in electrical communication with the conductors.
Claim 8
Dependent Claim
24 words
The method of claim 4 wherein the substrate comprises a material selected from the group consisting of silicon, plastic, glass filled resin, and ceramic.
Claim 9
Dependent Claim
16 words
The method of claim 4 wherein the conductive material comprises a metal or a conductive polymer.
Claim 10
Independent Claim
88 words
A method for fabricating a semiconductor component comprising: providing a substrate comprising a surface and a conductive layer on the surface; laser machining a plurality of grooves through the conductive layer to the surface to define a plurality of conductors on the surface, each conductor comprising a portion of the conductive layer with a groove on either side thereof; laser machining a plurality of pads on the surface in electrical communication with the conductors; and mounting a semiconductor die to the substrate in electrical communication with the pads.
Claim 11
Independent Claim
88 words
A method for fabricating a semiconductor component comprising: providing a substrate comprising a surface and a conductive layer on the surface; laser machining a plurality of grooves through the conductive layer to the surface to define a plurality of conductors on the surface, each conductor comprising a portion of the conductive layer with a groove on either side thereof; laser machining a plurality of pads on the surface in electrical communication with the conductors; and mounting a semiconductor die to the substrate in electrical communication with the pads.
Claim 12
Dependent Claim
20 words
The method of claim 8 wherein the mounting step comprises wire bonding bond pads on the die to the pads.
Claim 13
Dependent Claim
18 words
The method of claim 8 wherein the mounting step comprises flip chip mounting the die to the pads.
Claim 14
Independent Claim
97 words
A method for fabricating a semiconductor component comprising: providing a substrate comprising a surface and a conductive layer on the surface having a thickness; and laser machining a plurality of grooves through the conductive layer to the surface to define a first conductor and a second conductor on the surface, the first conductor comprising a signal path for the component, the second conductor in electrical communication with a ground path or a voltage path, with the thickness of the conductive layer and a width of the grooves selected to provide an impedance value for the first conductor.
Claim 15
Independent Claim
97 words
A method for fabricating a semiconductor component comprising: providing a substrate comprising a surface and a conductive layer on the surface having a thickness; and laser machining a plurality of grooves through the conductive layer to the surface to define a first conductor and a second conductor on the surface, the first conductor comprising a signal path for the component, the second conductor in electrical communication with a ground path or a voltage path, with the thickness of the conductive layer and a width of the grooves selected to provide an impedance value for the first conductor.
Claim 16
Dependent Claim
12 words
The method of claim 11 wherein the component comprises a chip module.
Claim 17
Dependent Claim
11 words
The method of claim 11 wherein the component comprises a package.
Claim 18
Dependent Claim
16 words
The method of claim 11 wherein the component comprises a test carrier for testing semiconductor components.
Claim 19
Independent Claim
96 words
A method for fabricating a semiconductor component comprising: providing a substrate comprising a surface and a conductive layer on the surface having a thickness; laser machining a plurality of conductors in the conductive layer, each conductor defined by a pair of grooves through the conductive layer, the conductors comprising a plurality of first pads; mounting a semiconductor die comprising a plurality second pads to the substrate by bonding the second pads to the first pads; and selecting the thickness of the conductive layer, and a width of the grooves, to provide an impedance for the conductors.
Claim 20
Independent Claim
96 words
A method for fabricating a semiconductor component comprising: providing a substrate comprising a surface and a conductive layer on the surface having a thickness; laser machining a plurality of conductors in the conductive layer, each conductor defined by a pair of grooves through the conductive layer, the conductors comprising a plurality of first pads; mounting a semiconductor die comprising a plurality second pads to the substrate by bonding the second pads to the first pads; and selecting the thickness of the conductive layer, and a width of the grooves, to provide an impedance for the conductors.
Claim 21
Dependent Claim
21 words
The method of claim 15 further comprising forming a plurality of contacts on the substrate in electrical communication with the conductors.
Claim 22
Dependent Claim
15 words
The method of claim 16 wherein the contacts comprise balls in a ball grid array.
Claim 23
Dependent Claim
28 words
The method of claim of claim 16 further comprising forming a plurality of conductive vias through the substrate in electrical communication with the conductors and with the contacts.
Claim 24
Dependent Claim
28 words
The method of claim 18 wherein forming the conductive vias comprises laser machining openings in the substrate and at least partially filling the openings with a conductive material.
Claim 25
Dependent Claim
24 words
The method of claim 15 wherein the substrate comprises a material selected from the group consisting of silicon, plastic, glass filled resin, and ceramic.
Claim 26
Independent Claim
125 words
A method for fabricating a semiconductor component comprising: providing a substrate comprising a first surface, an opposing second surface, and a conductive layer on the first surface; laser machining a plurality of grooves through the conductive layer to the first surface to define a plurality of conductors on the first surface, each conductor comprising a portion of the conductive layer with a groove on either side thereof; forming a plurality of conductive vias in the substrate in electrical communication with the conductors, each conductive via extending from the first surface to the second surface; forming a plurality of contacts on the second surface in electrical communication with the conductive vias; and mounting a semiconductor die to the first surface in electrical communication with the conductors.
Claim 27
Independent Claim
125 words
A method for fabricating a semiconductor component comprising: providing a substrate comprising a first surface, an opposing second surface, and a conductive layer on the first surface; laser machining a plurality of grooves through the conductive layer to the first surface to define a plurality of conductors on the first surface, each conductor comprising a portion of the conductive layer with a groove on either side thereof; forming a plurality of conductive vias in the substrate in electrical communication with the conductors, each conductive via extending from the first surface to the second surface; forming a plurality of contacts on the second surface in electrical communication with the conductive vias; and mounting a semiconductor die to the first surface in electrical communication with the conductors.
Claim 28
Dependent Claim
21 words
The method of claim 21 further comprising at least partially encapsulating the die by depositing an encapsulant on the first surface.
Claim 29
Dependent Claim
15 words
The method of claim 21 wherein the contacts comprise balls in a ball grid array.
Claim 30
Dependent Claim
11 words
The method of claim 21 wherein the component comprises a package.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-08-22 | 2004-02-21 | 2004-08-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-08-22 | 2008-02-21 | 2008-08-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-08-22 | 2012-02-21 | 2012-08-22 | $7700.00 | Window Closed / Lapsed |