Semiconductor device assembly with minimized bond finger connections

Claim 1

A method of making a semiconductor device assembly, comprising: (a) providing a printed wiring board substrate; (b) centrally locating a planar conductive layer on a surface of the substrate, the planar conductive layer including one or more conductive segments electrically insulated from one another, each conductive segment adapted for connection thereto, and each conductive segment having portions surrounding a perimeter of an area adapted to receive a semiconductor die; (c) disposing a plurality of bond fingers around the periphery of the planar conductive layer, each of the plurality of bond fingers adapted for connection thereto; (d) disposing a semiconductor die above the planar conductive layer and within the perimeter of the area adapted to receive the semiconductor die, the semiconductor die having a first and second plurality of bond pads thereon; and (e) connecting the portions of the one or more conductive segments to the first plurality of bond pads, and connecting the plurality of bond fingers to the second plurality of bond pads.

Claim 2

A method of making a semiconductor device assembly, comprising: (a) providing a printed wiring board substrate; (b) centrally locating a planar conductive layer on a surface of the substrate, the planar conductive layer including one or more conductive segments electrically insulated from one another, each conductive segment adapted for connection thereto, and each conductive segment having portions surrounding a perimeter of an area adapted to receive a semiconductor die; (c) disposing a plurality of bond fingers around the periphery of the planar conductive layer, each of the plurality of bond fingers adapted for connection thereto; (d) disposing a semiconductor die above the planar conductive layer and within the perimeter of the area adapted to receive the semiconductor die, the semiconductor die having a first and second plurality of bond pads thereon; and (e) connecting the portions of the one or more conductive segments to the first plurality of bond pads, and connecting the plurality of bond fingers to the second plurality of bond pads.

Claim 9

A method of making a semiconductor device assembly, comprising: (a) providing a printed wiring board substrate; (b) providing external elements on the bottom surface of the substrate for establishing electrical connections to external circuitry; (c) centrally locating a planar conductive layer on the top surface of the substrate, the planar conductive layer including one or more conductive segments electrically insulated from one another, each conductive segment adapted for connection thereto, and each conductive segment having portions surrounding a perimeter of an area adapted to receive a semiconductor die; (d) plating a plurality of vies centrally through the substrate to connect the one or more conductive segments of the centrally disposed planar conductive layer to one or more external elements centrally disposed on the bottom surface of the substrate; (e) disposing a plurality of bond fingers around the periphery of the planar conductive layer, each bond finger connected to one or more external elements; (f) disposing a semiconductor die above the planar conductive layer and within the perimeter of the area adapted to receive the semiconductor die, the semiconductor die having a first and second plurality of bond pads thereon; and (g) connecting the portions of the one or more conductive segments to the first plurality of bond pads, and connecting the plurality of bond fingers to the second plurality of bond pads.

Claim 10

A method of making a semiconductor device assembly, comprising: (a) providing a printed wiring board substrate; (b) providing external elements on the bottom surface of the substrate for establishing electrical connections to external circuitry; (c) centrally locating a planar conductive layer on the top surface of the substrate, the planar conductive layer including one or more conductive segments electrically insulated from one another, each conductive segment adapted for connection thereto, and each conductive segment having portions surrounding a perimeter of an area adapted to receive a semiconductor die; (d) plating a plurality of vies centrally through the substrate to connect the one or more conductive segments of the centrally disposed planar conductive layer to one or more external elements centrally disposed on the bottom surface of the substrate; (e) disposing a plurality of bond fingers around the periphery of the planar conductive layer, each bond finger connected to one or more external elements; (f) disposing a semiconductor die above the planar conductive layer and within the perimeter of the area adapted to receive the semiconductor die, the semiconductor die having a first and second plurality of bond pads thereon; and (g) connecting the portions of the one or more conductive segments to the first plurality of bond pads, and connecting the plurality of bond fingers to the second plurality of bond pads.

Claim 15

A method of making a semiconductor device assembly, comprising: (a) providing a printed wiring board substrate having a top and bottom surface; (b) providing a plurality of external elements on the bottom surface of the printed wiring board substrate; (c) centrally locating at least one planar inner conductive segment on the top surface of the printed wiring board substrate, the at least one planar inner conductive segment having first portions surrounding a perimeter of an area adapted to receive a semiconductor die, and connecting the at least one inner conductive segment to one or more external elements centrally located on the bottom surface of the printed wiring board substrate; (d) disposing one or more coplanar outer conductive segments around the periphery of the one or more inner conductive segments, the one or more coplanar outer conductive segments having second portions surrounding the perimeter of the area adapted to receive a semiconductor die, and connecting the one or more outer conductive segments to one or more external elements centrally located on the bottom surface of the printed wiring board substrate; (e) disposing a plurality of bond fingers around the periphery of the one or more outer conductive segments, the plurality of bond fingers adapted for connection to one or more external elements; (f) disposing a semiconductor die above the one or more inner conductive segments and within the perimeter of the area adapted to receive the semiconductor die, the semiconductor die having bond pads thereon; and (g) connecting each inner and outer conductive segment to a respective bond pad, and connecting the other remaining bond pads to the plurality of bond fingers.

Claim 16

A method of making a semiconductor device assembly, comprising: (a) providing a printed wiring board substrate having a top and bottom surface; (b) providing a plurality of external elements on the bottom surface of the printed wiring board substrate; (c) centrally locating at least one planar inner conductive segment on the top surface of the printed wiring board substrate, the at least one planar inner conductive segment having first portions surrounding a perimeter of an area adapted to receive a semiconductor die, and connecting the at least one inner conductive segment to one or more external elements centrally located on the bottom surface of the printed wiring board substrate; (d) disposing one or more coplanar outer conductive segments around the periphery of the one or more inner conductive segments, the one or more coplanar outer conductive segments having second portions surrounding the perimeter of the area adapted to receive a semiconductor die, and connecting the one or more outer conductive segments to one or more external elements centrally located on the bottom surface of the printed wiring board substrate; (e) disposing a plurality of bond fingers around the periphery of the one or more outer conductive segments, the plurality of bond fingers adapted for connection to one or more external elements; (f) disposing a semiconductor die above the one or more inner conductive segments and within the perimeter of the area adapted to receive the semiconductor die, the semiconductor die having bond pads thereon; and (g) connecting each inner and outer conductive segment to a respective bond pad, and connecting the other remaining bond pads to the plurality of bond fingers.

Claim 20

A method of making a semiconductor device assembly, comprising: (a) providing a printed wiring board substrate having a top and bottom surface; (b) disposing a plurality of external elements on the bottom surface of the substrate; (c) centrally locating a conductive plane on the top surface of the substrate; (d) connecting the conductive plane to one or more external elements that are centrally disposed on the bottom surface of the substrate and which provide a ground connection; (e) disposing one or more coplanar conductive rings around the periphery of the conductive plane, the one or more coplanar conductive rings surrounding a perimeter of an area adapted to receive a semiconductor die; (f) connecting the one or more conductive rings to one or more external elements that are centrally disposed on the bottom surface of the substrate and which provide at least one power source connection; (g) disposing a plurality of bond fingers around the periphery of the one or more conductive rings, the plurality of bond fingers adapted for connection to other of the plurality of external elements; (h) disposing a semiconductor die above the conductive plane while exposing the periphery of the conductive plane and within the perimeter of the area adapted to receive the semiconductor die, the semiconductor die having bond pads thereon; and (i) connecting at least one of the bond pads to the conductive plane, connecting at least one other of the bond pads to the one or more conductive rings, and connecting the remaining bond pads to the plurality of bond fingers.

Claim 21

A method of making a semiconductor device assembly, comprising: (a) providing a printed wiring board substrate having a top and bottom surface; (b) disposing a plurality of external elements on the bottom surface of the substrate; (c) centrally locating a conductive plane on the top surface of the substrate; (d) connecting the conductive plane to one or more external elements that are centrally disposed on the bottom surface of the substrate and which provide a ground connection; (e) disposing one or more coplanar conductive rings around the periphery of the conductive plane, the one or more coplanar conductive rings surrounding a perimeter of an area adapted to receive a semiconductor die; (f) connecting the one or more conductive rings to one or more external elements that are centrally disposed on the bottom surface of the substrate and which provide at least one power source connection; (g) disposing a plurality of bond fingers around the periphery of the one or more conductive rings, the plurality of bond fingers adapted for connection to other of the plurality of external elements; (h) disposing a semiconductor die above the conductive plane while exposing the periphery of the conductive plane and within the perimeter of the area adapted to receive the semiconductor die, the semiconductor die having bond pads thereon; and (i) connecting at least one of the bond pads to the conductive plane, connecting at least one other of the bond pads to the one or more conductive rings, and connecting the remaining bond pads to the plurality of bond fingers.