US5150193A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Resin-encapsulated semiconductor device having a particular mounting structure
Assignee: Hitachi Ltd
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Filing: 1991-02-11
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Granted: 1992-09-22
•
Expires: 2011-02-11
Abstract
Abstract The present invention consists in that a through hole of large area is provided in a die pad or a tab, thereby to prevent a resin from cracking at the rear surface of a surface-packaging resin package in a high-temperature soldering atmosphere of vapor-phase reflow or the like, whereby a resin-molded surface-packaged IC of high reliability is provided.
Inventors
- 👤 Toshihiro Yasuhara
- 👤 Masachika Masuda
- 👤 Gen Murakami
- 👤 Kunihiko Nishi
- 👤 Masanori Sakimoto
- 👤 Ichio Shimizu
- 👤 Akio Hoshi
- 👤 Sumio Okada
- 👤 Tooru Nagamine
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 10:13
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/417; H10W70/421; H10W72/00; H10W72/01; H10W72/015; H10W72/01551; H10W72/071; H10W72/0711; H10W72/07141; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07338; H10W72/075; H10W72/07511; H10W72/07521; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/30; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/50; H10W72/521; H10W72/522; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/547; H10W72/5473; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W72/555; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/921; H10W72/923; H10W72/931; H10W72/932; H10W72/934; H10W72/951; H10W72/952; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; H10W99/00
Claims Analysis
Total Claims: 33
Claim 1
Independent Claim
160 words
A lead frame for a semiconductor device comprising: a quadrangular-shaped chip supporting member for mounting a semiconductor chip on a chip mounting surface thereof, wherein said chip supporting member has a pair of first sides facing each other and a pair of second sides facing each other; at least two first elongated through-holes arranged on a line parallel to one of said second sides, and at least two second elongated through-holes arranged on line parallel to one of said first sides; and a plurality of leads arranged adjacent to said chip supporting member, wherein said chip supporting member includes adhering portions for adhering said semiconductor chip thereon, each surrounded by one of said first sides, one of said second sides, one of said first through-holes and one of said second through-holes, and wherein one of said adhering portions is joined with another of said adhering portions at a portion of said chip supporting member located between said first elongated through-holes.
Claim 2
Dependent Claim
160 words
A lead frame for a semiconductor device comprising: a quadrangular-shaped chip supporting member for mounting a semiconductor chip on a chip mounting surface thereof, wherein said chip supporting member has a pair of first sides facing each other and a pair of second sides facing each other; at least two first elongated through-holes arranged on a line parallel to one of said second sides, and at least two second elongated through-holes arranged on line parallel to one of said first sides; and a plurality of leads arranged adjacent to said chip supporting member, wherein said chip supporting member includes adhering portions for adhering said semiconductor chip thereon, each surrounded by one of said first sides, one of said second sides, one of said first through-holes and one of said second through-holes, and wherein one of said adhering portions is joined with another of said adhering portions at a portion of said chip supporting member located between said first elongated through-holes.
Claim 3
Dependent Claim
30 words
A lead frame according to claim 1, wherein a groove is formed in said chip mounting surface of said chip supporting member to surround at least one of said through-holes.
Claim 4
Dependent Claim
237 words
A resin-encapsulated semiconductor device comprising: a quadrangular-shaped semiconductor chip having a main surface and rear surface, wherein a plurality of external terminals are arranged at a peripheral area of said main surface; a quadrangular-shaped chip supporting member for mounting said semiconductor chip on a chip mounting surface thereof, wherein said chip supporting member has a pair of first sides facing each other and a pair of second sides facing each other; at least two first elongated through-holes arranged on a line parallel to one of said second sides, and at least two second elongated through-holes arranged on a line parallel to one of said first sides; a binder layer which adheres said rear surface of said chip and said chip supporting member; a plurality of leads arranged adjacent to said external terminals, each of said leads having inner and outer lead portions, respectively; a plurality of wires electrically connected between said external terminals and said inner lead portions, respectively; and a resin member for encapsulating said semiconductor chip, said chip supporting member, said inner lead portions and said wires, wherein said chip supporting member includes adhering portions surrounded by one of said first sides, one of said second sides, one of said first through-holes and one of said second through-holes, and wherein one of said adhering portions is joined with another adhering portions at a portion of said chip supporting member located between said first elongated through-holes.
Claim 5
Dependent Claim
237 words
A resin-encapsulated semiconductor device comprising: a quadrangular-shaped semiconductor chip having a main surface and rear surface, wherein a plurality of external terminals are arranged at a peripheral area of said main surface; a quadrangular-shaped chip supporting member for mounting said semiconductor chip on a chip mounting surface thereof, wherein said chip supporting member has a pair of first sides facing each other and a pair of second sides facing each other; at least two first elongated through-holes arranged on a line parallel to one of said second sides, and at least two second elongated through-holes arranged on a line parallel to one of said first sides; a binder layer which adheres said rear surface of said chip and said chip supporting member; a plurality of leads arranged adjacent to said external terminals, each of said leads having inner and outer lead portions, respectively; a plurality of wires electrically connected between said external terminals and said inner lead portions, respectively; and a resin member for encapsulating said semiconductor chip, said chip supporting member, said inner lead portions and said wires, wherein said chip supporting member includes adhering portions surrounded by one of said first sides, one of said second sides, one of said first through-holes and one of said second through-holes, and wherein one of said adhering portions is joined with another adhering portions at a portion of said chip supporting member located between said first elongated through-holes.
Claim 6
Dependent Claim
18 words
A resin-encapsulated semiconductor device according to claim 3, wherein said binder layer is a silicon rubber type binder.
Claim 7
Dependent Claim
17 words
A resin-encapsulated semiconductor device according to claim 3, wherein said binder layer is an epoxy resin adhesive.
Claim 8
Dependent Claim
35 words
A resin-encapsulated semiconductor device according to claim 5, wherein said epoxy resin adhesive is a composition consisting of a bisphenol type epoxy resin, a phenol novolac type epoxy resin, imidazoles, butyl cellosolve and silver powder.
Claim 9
Dependent Claim
34 words
A resin-encapsulated semiconductor device according to claim 5, wherein said epoxy resin adhesive is a composition consisting of a bisphenol type epoxy resin, a phenol novolac type epoxy resin, imidazoles, N-methyl-2-pyrrolidone and silver powder.
Claim 10
Dependent Claim
248 words
A resin-encapsulated semiconductor device comprising: a quadrangular-shaped semiconductor chip having a main surface and rear surface, wherein a plurality of external terminals are arranged at a peripheral area of said main surface; a quadrangular-shaped chip supporting member for mounting said semiconductor chip on a chip mounting surface thereof, wherein said chip supporting member has a pair of first sides facing each other and a pair of second sides facing each other; at least two first elongated through-holes arranged on a line parallel to one of said second sides, and at least two second elongated through-holes arranged on a line parallel to one of said first sides; a binder layer which adheres said rear surface of said chip to said chip supporting member, wherein said binder layer is a epoxy resin adhesive; a plurality of leads arranged adjacent to said external terminals, each of said leads having inner and outer lead portions, respectively; a plurality of wires electrically connected between said external terminals and said inner lead portions, respectively; and a resin member for encapsulating said semiconductor chip, said chip supporting member, said inner lead portions and said wires, wherein said chip supporting member includes adhering portions surrounded by one of said first sides, one of said second sides, one of said first through-holes and one of said second through-holes, and wherein one of said adhering portions is joined with another of said adhering portions at a portion of said chip supporting member located between said first elongated through-holes.
Claim 11
Dependent Claim
248 words
A resin-encapsulated semiconductor device comprising: a quadrangular-shaped semiconductor chip having a main surface and rear surface, wherein a plurality of external terminals are arranged at a peripheral area of said main surface; a quadrangular-shaped chip supporting member for mounting said semiconductor chip on a chip mounting surface thereof, wherein said chip supporting member has a pair of first sides facing each other and a pair of second sides facing each other; at least two first elongated through-holes arranged on a line parallel to one of said second sides, and at least two second elongated through-holes arranged on a line parallel to one of said first sides; a binder layer which adheres said rear surface of said chip to said chip supporting member, wherein said binder layer is a epoxy resin adhesive; a plurality of leads arranged adjacent to said external terminals, each of said leads having inner and outer lead portions, respectively; a plurality of wires electrically connected between said external terminals and said inner lead portions, respectively; and a resin member for encapsulating said semiconductor chip, said chip supporting member, said inner lead portions and said wires, wherein said chip supporting member includes adhering portions surrounded by one of said first sides, one of said second sides, one of said first through-holes and one of said second through-holes, and wherein one of said adhering portions is joined with another of said adhering portions at a portion of said chip supporting member located between said first elongated through-holes.
Claim 12
Dependent Claim
34 words
A resin-encapsulated semiconductor device according to claim 5, wherein said epoxy resin adhesive is a composition consisting of a bisphenol type resin, a phenol novolac type epoxy resin, imidazoles, butyl cellosolve and silver powder.
Claim 13
Dependent Claim
33 words
A resin-encapsulated semiconductor device according to claim 5, wherein said epoxy resin is a composition consisting of a bisphenol type epoxy resin, a phenol novolac type epoxy resin, imidazoles, N-methyl-2-pyrrolidone and silver powder.
Claim 14
Dependent Claim
254 words
A semiconductor comprising: A resin-encapsulated semiconductor device which comprises; a quadrangular-shaped semiconductor chip having a main surface and a rear surface, wherein a plurality of external terminals are arranged at a peripheral area of said main surface; a quadrangular-shaped chip supporting member for mounting said semiconductor chip on a chip mounting surface thereof, wherein said chip supporting member has a pair of first sides facing each other and a pair of second sides facing each other; at least two first elongated through-holes arranged on a line parallel to one of said second sides, and at least two second elongated through-holes arranged on a line parallel to one of said first sides; a binder layer which adheres said rear surface of said chip to said chip supporting member; a plurality of leads arranged adjacent to said external terminals, each of said leads having inner and outer lead portions, respectively; a plurality of wires electrically connected between said external terminals and said inner lead portions, respectively; and a resin member for encapsulating said semiconductor chip, said chip supporting member, said inner lead portions and said wires; and a circuit board for mounting said resin-encapsulated semiconductor device, wherein said chip supporting member includes adhering portions surrounded by one of said first sides, one of said second sides, one of said first through-holes and one of said second through-holes, and wherein one of said adhering portions is joined with another of said adhering portions at a portion of said chip supporting member located between said first elongated through-holes.
Claim 15
Dependent Claim
254 words
A semiconductor comprising: A resin-encapsulated semiconductor device which comprises; a quadrangular-shaped semiconductor chip having a main surface and a rear surface, wherein a plurality of external terminals are arranged at a peripheral area of said main surface; a quadrangular-shaped chip supporting member for mounting said semiconductor chip on a chip mounting surface thereof, wherein said chip supporting member has a pair of first sides facing each other and a pair of second sides facing each other; at least two first elongated through-holes arranged on a line parallel to one of said second sides, and at least two second elongated through-holes arranged on a line parallel to one of said first sides; a binder layer which adheres said rear surface of said chip to said chip supporting member; a plurality of leads arranged adjacent to said external terminals, each of said leads having inner and outer lead portions, respectively; a plurality of wires electrically connected between said external terminals and said inner lead portions, respectively; and a resin member for encapsulating said semiconductor chip, said chip supporting member, said inner lead portions and said wires; and a circuit board for mounting said resin-encapsulated semiconductor device, wherein said chip supporting member includes adhering portions surrounded by one of said first sides, one of said second sides, one of said first through-holes and one of said second through-holes, and wherein one of said adhering portions is joined with another of said adhering portions at a portion of said chip supporting member located between said first elongated through-holes.
Claim 16
Dependent Claim
17 words
A semiconductor device according to claim 11, wherein said binder layer is a silicone rubber type binder.
Claim 17
Dependent Claim
16 words
A semiconductor device according to claim 11, wherein said binder layer is an epoxy resin adhesive.
Claim 18
Dependent Claim
34 words
A semiconductor device according to claim 13, wherein said epoxy resin adhesive is a composition consisting of a bisphenol type epoxy resin, a phenol novolac type epoxy resin, imidazoles, butyl cellosolve and silver powder.
Claim 19
Dependent Claim
33 words
A semiconductor device according to claim 13, wherein said epoxy resin adhesive is a composition consisting of a bisphenol type epoxy resin, a phenol novolac type epoxy resin, imidazoles, N-methyl-2-pyrrolidone and silver powder.
Claim 20
Dependent Claim
16 words
A lead frame according to claim 1, wherein said quadrangular-shaped chip supporting member is a rectangle.
Claim 21
Dependent Claim
16 words
A lead frame according to claim 1, wherein said quadrangular-shaped chip supporting member is a square.
Claim 22
Dependent Claim
17 words
A resin-encapsulated semiconductor device according to claim 3, wherein said quadrangular-shaped chip supporting member is a rectangle.
Claim 23
Dependent Claim
17 words
A resin-encapsulated semiconductor device according to claim 3, wherein said quadrangular-shaped chip supporting member is a square.
Claim 24
Dependent Claim
17 words
A resin-encapsulated semiconductor device according to claim 18, wherein said quadrangular-shaped chip supporting member is a rectangle.
Claim 25
Dependent Claim
17 words
A resin-encapsulated semiconductor device according to claim 18, wherein said quadrangular-shaped chip supporting member is a square.
Claim 26
Dependent Claim
16 words
A semiconductor device according to claim 11, wherein said quadrangular-shaped chip supporting member is a rectangle.
Claim 27
Dependent Claim
16 words
A semiconductor device according to claim 11, wherein said quadrangular-shaped chip supporting member is a square.
Claim 28
Dependent Claim
37 words
A lead frame according to claim 1, wherein said portion of said chip supporting member located between the first elongated through-holes is substantially in the center of said chip supporting member, and also forms an adhering portion.
Claim 29
Dependent Claim
38 words
A resin-encapsulated semiconductor device according to claim 18, wherein said portion of said chip supporting member located between the first elongated through-holes is substantially in the center of said chip supporting member, and also forms an adhering portion.
Claim 30
Dependent Claim
38 words
A resin-encapsulated semiconductor device according to claim 20, wherein said portion of said chip supporting member located between the first elongated through-holes is substantially in the center of said chip supporting member, and also forms an adhering portion.
Claim 31
Dependent Claim
37 words
A semiconductor device according to claim 22, wherein said portion of said chip supporting member located between the first elongated through-holes is substantially in the center of said chip supporting member, and also forms an adhering portion.
Claim 32
Dependent Claim
173 words
A lead frame for a semiconductor device comprising: a quadrangular-shaped chip supporting member for mounting a semiconductor chip on a chip mounting surface thereof, wherein said chip supporting member has a pair of first sides facing each other and a pair of second sides facing each other; at least two first elongated through-holes arranged on a line parallel to one of said second sides, and at least two second elongated through-holes arranged on line parallel to one of said first sides; and a plurality of leads arranged adjacent to said chip supporting member, wherein said chip supporting member includes adhering portions for adhering said semiconductor chip thereon, wherein each of said adhering portions is surrounded by at least one of said first or second sides, at least one of said first elongated through-holes and at least one of said second elongated through-holes, and wherein one of said adhering portions is joined to another of said adhering portions at a portion of said chip supporting member located between two of said first elongated through-holes.
Claim 33
Dependent Claim
173 words
A lead frame for a semiconductor device comprising: a quadrangular-shaped chip supporting member for mounting a semiconductor chip on a chip mounting surface thereof, wherein said chip supporting member has a pair of first sides facing each other and a pair of second sides facing each other; at least two first elongated through-holes arranged on a line parallel to one of said second sides, and at least two second elongated through-holes arranged on line parallel to one of said first sides; and a plurality of leads arranged adjacent to said chip supporting member, wherein said chip supporting member includes adhering portions for adhering said semiconductor chip thereon, wherein each of said adhering portions is surrounded by at least one of said first or second sides, at least one of said first elongated through-holes and at least one of said second elongated through-holes, and wherein one of said adhering portions is joined to another of said adhering portions at a portion of said chip supporting member located between two of said first elongated through-holes.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-09-22 | 1996-03-23 | 1996-09-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-09-22 | 2000-03-23 | 2000-09-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-09-22 | 2004-03-23 | 2004-09-22 | $7700.00 | Window Closed / Lapsed |