US5021865A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Lead frame for semiconductor device
Assignee: Mitsubishi Electric Corp
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Filing: 1989-09-07
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Granted: 1991-06-04
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Expires: 2009-09-07
Abstract
Abstract A lead frame of a package cast from mold resin is composed of a die bond pad section on which a semiconductor chip is placed and connected to a plurality of leads placed around the die bond pad section. The die bond pad section is formed of a length of an elongated material of a reduced width, i.e., having a line-like form disposed as a pattern in the form of a Peano curve. The die bond pad section has one or a plurality of such supporting sections integrally connected to and supported by one or more extension lead or leads. The die bond pad section formed by the elongated material has a low stiffness, and thus serves to prevent cracks from being formed in the package or in the semiconductor ship due to thermal contraction effects.
Inventors
- 👤 Yoshiharu Takahashi
- 👤 Shuichi Osaka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 13:46
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
84 words
A lead frame for a semiconductor device, comprising: a die bond pad section on the upper surface of which a semiconductor chip is placed and secured; and a lead section including a plurality of leads arranged about said die bond pad section, wherein said die bond pad section comprises a material having a Peano curve form that is disposed over the die bond pad section such that said semiconductor chip may be placed on the upper surface of the die pad section thus provided.
Claim 2
Dependent Claim
84 words
A lead frame for a semiconductor device, comprising: a die bond pad section on the upper surface of which a semiconductor chip is placed and secured; and a lead section including a plurality of leads arranged about said die bond pad section, wherein said die bond pad section comprises a material having a Peano curve form that is disposed over the die bond pad section such that said semiconductor chip may be placed on the upper surface of the die pad section thus provided.
Claim 3
Dependent Claim
27 words
A lead frame for a semiconductor device according to claim 1, wherein: said Peano curve form comprises a continuous non-intersecting line-like length that does not intersect itself.
Claim 4
Dependent Claim
26 words
A lead frame for a semiconductor device according to claim 1, wherein: said Peano curve form is integrally connected with a desired one of said leads.
Claim 5
Dependent Claim
61 words
A lead frame for a semiconductor device according to claim 1, wherein: said Peano curve form comprises a plurality of independent continuous line-like lengths of the material each of which independent lengths is integrally connected with one of said leads, each of said independent lengths being disposed so as to not intersect either itself or any of the other independent lengths.
Claim 6
Dependent Claim
26 words
A lead frame for a semiconductor device according to claim 2, wherein: said Peano curve form is integrally connected to a desired one of said leads.
Claim 7
Dependent Claim
35 words
A lead frame for a semiconductor device according to claim 2, wherein: said Peano curve form comprises a plurality of independent continuous line-like lengths, each of which is integrally connected with one of said leads.
Claim 8
Dependent Claim
61 words
A lead frame for a semiconductor device according to claim 2, wherein: said Peano curve form comprises a single continuous Peano curve, the starting and terminal points of said continuous Peano curve being respectively connected integrally with one of said leads, and each of two intermediate points on said continuous Peano curve are respectively connected integrally with another of said leads.
Claim 9
Dependent Claim
46 words
A lead frame for a semiconductor device according to claim 7, wherein: two predetermined points on the continuous Peano curve of said elongated material are connected together by another length of elongated material in such a manner that the continuous Peano curve does not intersect itself.
Claim 10
Dependent Claim
74 words
A lead frame for a semiconductor device according to claim 2, wherein: said Peano curve form comprises a plurality of independent continuous lengths each formed as an individual Peano curve, the starting and terminal points of each of said continuous lengths are respectively connected integrally with a corresponding one of said leads, and a selected point on the individual Peano curve of each of said continuous lengths is connected with another of said leads.
Claim 11
Dependent Claim
43 words
A lead frame for a semiconductor device according to claim 2, wherein: said Peano curve form comprises a plurality of independent continuous lengths, and one end of each of said independent continuous lengths is integrally connected with a corresponding one of said leads.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-06-03 | 1994-12-03 | 1995-06-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-06-03 | 1998-12-03 | 1999-06-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-06-03 | 2002-12-03 | 2003-06-04 | $7700.00 | Window Closed / Lapsed |