US4965653A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device and method of mounting the semiconductor device
Assignee: Hitachi Ltd
•
Filing: 1990-02-28
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Granted: 1990-10-23
•
Expires: 2010-02-28
Abstract
Abstract The present invention discloses a suitable mounting of a wafer scale LSI (wafer scale integration) (WSI) in which a slit formed in a wafer is fit to a connector, a U-shaped reinforcing rubber member is disposed at the circumferential edge of the wafer, or a flexible adhesive is used for bonding a substrate formed with through-holes and a wafer, to provide a WSI mounting structure of high integration degree and high reliability. Furthermore, a method of efficient mounting by conducting the wiring of the wafer and the connection with the external terminal of the chip in one identical production step is disclosed.
Inventors
- 👤 Kanji Otsuka
- 👤 Shigeo Kuroda
- 👤 Katsuyuki Sato
- 👤 Hisashi Nakamura
- 👤 Shinichi Shouji
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 19:37
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/121; H10D; H10D62/00; H10D62/10; H10D62/117; H10W70/00; H10W70/01; H10W70/05; H10W70/08; H10W70/09; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W78/00; H10W90/00; H10W46/00; H10W46/201; H10W70/67; H10W70/68; H10W70/681; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/941; H10W72/9413; H10W74/00; H10W74/10; H10W74/131; H10W74/142; H10W90/20; H10W90/288; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
77 words
A wafer scale semiconductor device comprising: (a) a wafer scale substrate having a main surface constituted with circuits, a rear surface and a substantially circular peripheral surface; (b) a slit formed from a part of said peripheral surface to a center of said substrate in a direction of a radius, wherein said slit passes through the main surface to the rear surface; and (c) a plurality of electrodes disposed along said slit and on said main surface.
Claim 2
Dependent Claim
77 words
A wafer scale semiconductor device comprising: (a) a wafer scale substrate having a main surface constituted with circuits, a rear surface and a substantially circular peripheral surface; (b) a slit formed from a part of said peripheral surface to a center of said substrate in a direction of a radius, wherein said slit passes through the main surface to the rear surface; and (c) a plurality of electrodes disposed along said slit and on said main surface.
Claim 3
Dependent Claim
24 words
A wafer scale semiconductor device according to claim 1, wherein an end of said slit at the center of said substrate is made circular.
Claim 4
Dependent Claim
43 words
A wafer scale semiconductor device according to claim 1, further comprising: (d) a connector having concave portions, and connector electrode portions formed along said concave portions, wherein said plurality of electrodes on the main surface are electrically connected with said connector electrode portions.
Claim 5
Dependent Claim
88 words
A wafer scale semiconductor device according to claim 1, further comprising: (e) a plurality of bump electrodes on which said electrodes are formed; and (f) a package having a front surface, a back surface and a side surface, said slit is formed from a part of said side surface to a center of the package, and a plurality of electrode leads connected to said bump electrodes, wherein said package includes said wafer scale substrate therein as to correspond to each slit formed within said substrate and said package.
Claim 6
Dependent Claim
63 words
A wafer scale semiconductor device according to claim 4, further comprising: (g) a connector having a first surface and a second surface and a side surface, a plurality of external leads and a plurality of connector electrode portions formed on said first surface and said second surface, wherein said plurality of electrode leads are electrically connected with said plurality of connected electrode portions.
Claim 7
Dependent Claim
99 words
A wafer scale semiconductor device comprising: (a) a wafer scale semiconductor device having a main surface constituted with integrated circuits, a rear surface and a peripheral surface, wherein said peripheral surface is comprised of two surfaces, one of which is a substantially circular portion and another of which is a substantially flat portion; (b) a plurality of electrodes disposed to said flat portion of the peripheral surface; and (c) a reinforcing rubber member having a U-shaped cross-section formed so as to cover a part of said main and rear surfaces, and said circular portion of the peripheral surface therebetween.
Claim 8
Dependent Claim
99 words
A wafer scale semiconductor device comprising: (a) a wafer scale semiconductor device having a main surface constituted with integrated circuits, a rear surface and a peripheral surface, wherein said peripheral surface is comprised of two surfaces, one of which is a substantially circular portion and another of which is a substantially flat portion; (b) a plurality of electrodes disposed to said flat portion of the peripheral surface; and (c) a reinforcing rubber member having a U-shaped cross-section formed so as to cover a part of said main and rear surfaces, and said circular portion of the peripheral surface therebetween.
Claim 9
Dependent Claim
20 words
A wafer scale semiconductor device according to claim 6, wherein the reinforcing rubber member is made of a silicone resin.
Claim 10
Dependent Claim
133 words
A wafer scale semiconductor device comprising: (a) a wafer scale semiconductor device having a main surface constituted with integrated circuits and including a plurality of input/output terminals, a rear surface and a peripheral surface, wherein said peripheral surface is comprised of two surfaces, one of which is a substantially circular portion and another of which is a substantially flat portion; and (b) a reinforcing rubber member having a U-shaped cross-section formed so as to cover a part of said main and rear surface, and said circular portion of the peripheral surface therebetween, wherein said reinforcing rubber member comprises electroconductive rubber and insulation rubber members, wherein said electroconductive rubber and insulation rubber members are disposed alternately with each other and said electroconductive rubber members are connected so as to correspond with said input/output terminals.
Claim 11
Dependent Claim
133 words
A wafer scale semiconductor device comprising: (a) a wafer scale semiconductor device having a main surface constituted with integrated circuits and including a plurality of input/output terminals, a rear surface and a peripheral surface, wherein said peripheral surface is comprised of two surfaces, one of which is a substantially circular portion and another of which is a substantially flat portion; and (b) a reinforcing rubber member having a U-shaped cross-section formed so as to cover a part of said main and rear surface, and said circular portion of the peripheral surface therebetween, wherein said reinforcing rubber member comprises electroconductive rubber and insulation rubber members, wherein said electroconductive rubber and insulation rubber members are disposed alternately with each other and said electroconductive rubber members are connected so as to correspond with said input/output terminals.
Claim 12
Dependent Claim
21 words
A wafer scale semiconductor device according to claim 8, wherein the electroconductive rubber member is made of a butadiene-acrylonitrile copolymer rubber.
Claim 13
Dependent Claim
20 words
A wafer scale semiconductor device according to claim 8, wherein the insulation rubber member is made of a silicone rubber.
Claim 14
Dependent Claim
28 words
A wafer scale semiconductor device according to claim 8, wherein the connection between the electroconductive rubber member and the input/output terminals is made by way of aluminum wirings.
Claim 15
Dependent Claim
144 words
A wafer scale semiconductor device comprising: (a) a wafer scale substrate having a main surface constituted with circuits, a rear surface and a substantially circular peripheral surface; (b) a plurality of electrodes disposed on said main surface; (c) an insulation substrate having a first surface and a second surface, said first surface being arranged for bonding to secure said wafer scale substrate and metal layers, wherein a plurality of through-holes are formed from said first surface to said second surface under an area of said wafer scale substrate; (d) an adhesive for bonding said wafer scale substrate onto said insulation substrate; and (e) a plurality of wires electrically connecting said electrodes and said metal layers formed on said first surface of the insulation substrate, wherein said adhesive is formed between said wafer scale substrate and at least said first surface of the insulation substrate.
Claim 16
Dependent Claim
144 words
A wafer scale semiconductor device comprising: (a) a wafer scale substrate having a main surface constituted with circuits, a rear surface and a substantially circular peripheral surface; (b) a plurality of electrodes disposed on said main surface; (c) an insulation substrate having a first surface and a second surface, said first surface being arranged for bonding to secure said wafer scale substrate and metal layers, wherein a plurality of through-holes are formed from said first surface to said second surface under an area of said wafer scale substrate; (d) an adhesive for bonding said wafer scale substrate onto said insulation substrate; and (e) a plurality of wires electrically connecting said electrodes and said metal layers formed on said first surface of the insulation substrate, wherein said adhesive is formed between said wafer scale substrate and at least said first surface of the insulation substrate.
Claim 17
Dependent Claim
24 words
A wafer scale semiconductor device according to claim 12, further comprising: (g) a frame member disposed at a position surrounding said wafer scale substrate.
Claim 18
Dependent Claim
29 words
A wafer scale semiconductor device according to claim 12, wherein the insulation substrate is made of glass, kepler or silica glass fiber-reinforced biphenyltriazine substrate, epoxy substrate or polyimide substrate.
Claim 19
Dependent Claim
17 words
A wafer scale semiconductor device according to claim 12, wherein the adhesive is soft and flexible material.
Claim 20
Dependent Claim
24 words
A wafer scale semiconductor device according to claim 12, wherein the soft and flexible material is a silicone type gel a silicone type rubber.
Claim 21
Dependent Claim
29 words
A wafer scale semiconductor device according to claim 12, further comprising: (f) sealing material for sealing said main surface of said wafer scale substrate, said electrodes and said wires.
Claim 22
Dependent Claim
18 words
A wafer scale semiconductor device according to claim 12, wherein the sealing material is a silicon type gel.
Claim 23
Dependent Claim
25 words
A wafer scale semiconductor device according to claim 12, further comprising: (h) a cap bonded to said frame member for sealing said wafer scale substrate.
Claim 24
Dependent Claim
25 words
A wafer scale semiconductor device according to claim 12, wherein said plurality of electrodes are arranged along said peripheral surface of said wafer scale substrate.
Claim 25
Dependent Claim
119 words
A wafer scale semiconductor device comprising: (a) a wafer scale substrate having a main surface constituted with circuits, a rear surface and a substantially circular peripheral surface; (b) a plurality of electrodes disposed on said main surface; (c) an insulation substrate having a first surface and a second surface, said first surface being arranged for bonding to secure said wafer scale substrate and metal layers, wherein a plurality of through-holes are formed from said first surface to said second surface under an area of said wafer scale substrate; and (d) an adhesive for bonding said wafer scale substrate onto said insulation substrate, wherein said plurality of electrodes are electrically connected with said metal layers arranged on said first surface.
Claim 26
Dependent Claim
119 words
A wafer scale semiconductor device comprising: (a) a wafer scale substrate having a main surface constituted with circuits, a rear surface and a substantially circular peripheral surface; (b) a plurality of electrodes disposed on said main surface; (c) an insulation substrate having a first surface and a second surface, said first surface being arranged for bonding to secure said wafer scale substrate and metal layers, wherein a plurality of through-holes are formed from said first surface to said second surface under an area of said wafer scale substrate; and (d) an adhesive for bonding said wafer scale substrate onto said insulation substrate, wherein said plurality of electrodes are electrically connected with said metal layers arranged on said first surface.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-10-22 | 1994-04-23 | 1994-10-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-10-22 | 1998-04-23 | 1998-10-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-10-22 | 2002-04-23 | 2002-10-23 | $7700.00 | Window Closed / Lapsed |