Patent US6072239A successfully refreshed from Google Patents.
US6072239A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Device having resin package with projections
Assignee: Socionext Inc
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Filing: 1996-11-06
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Granted: 2000-06-06
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Expires: 2016-11-06
Abstract
Abstract A device includes a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the metallic films.
Inventors
- 👤 Yoshiyuki Yoneda
- 👤 Kazuto Tsuji
- 👤 Seiichi Orimo
- 👤 Hideharu Sakoda
- 👤 Ryuji Nomoto
- 👤 Masanori Onodera
- 👤 Junichi Kasai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:49
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/042; H10W72/00; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K3/305; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3442; H10D; H10D62/00; H10D62/10; H10D62/117; H10P; H10P72/00; H10P72/04; H10P72/0444; H10P72/70; H10P72/72; H10P72/722; H10W74/00; H10W74/01; H10W74/014; H10W74/016; H10W74/019; H10W74/10; H10W74/111; H10W90/00; H05K1/00; H05K1/18; H05K1/181; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09045; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10727; H05K2201/10954; H05K2201/10977; H05K3/3436; H10W70/60; H10W72/01; H10W72/012; H10W72/01221; H10W72/01225; H10W72/0198; H10W72/071; H10W72/0711; H10W72/07141; H10W72/07173; H10W72/072; H10W72/07251; H10W72/073; H10W72/075; H10W72/07502; H10W72/07504; H10W72/07511; H10W72/07521; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/20; H10W72/251; H10W72/50; H10W72/521; H10W72/522; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5434; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/553; H10W72/555; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W72/951; H10W72/952; H10W74/131; H10W74/142; H10W90/20; H10W90/288; H10W90/701; H10W90/751; H10W90/754; H10W90/756; H10W99/00; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
84 words
A device comprising: a chip; a resin package sealing said chip, said resin package having resin projections located on a mount-side surface of the resin package; metallic films respectively provided in continuous surface contact with said resin projections; and connecting parts electrically connecting electrode pads of said chip and the metallic films, wherein said resin projections have surfaces which are parallel to the mount-side surface of the resin package, and wherein the metallic films are formed on the entire surfaces of the resin projections.
Claim 2
Independent Claim
84 words
A device comprising: a chip; a resin package sealing said chip, said resin package having resin projections located on a mount-side surface of the resin package; metallic films respectively provided in continuous surface contact with said resin projections; and connecting parts electrically connecting electrode pads of said chip and the metallic films, wherein said resin projections have surfaces which are parallel to the mount-side surface of the resin package, and wherein the metallic films are formed on the entire surfaces of the resin projections.
Claim 3
Dependent Claim
22 words
The device as claimed in claim 1, wherein each of said metallic films comprises a plurality of metallic layers which are stacked.
Claim 4
Dependent Claim
26 words
The device as claimed in claim 1, wherein said connecting parts respectively comprise bonding wires, which are bonded to the electrode pads and said metallic films.
Claim 5
Dependent Claim
23 words
The device as claimed in claim 1, wherein said resin package is a molded package so that the resin projections are integrally formed.
Claim 6
Dependent Claim
41 words
The device as claimed in claim 1, wherein: said metallic films respectively have lead portions, which are sealed by the resin package and extend toward the chip; and said connecting parts include bonding wires which are bonded to said lead portions.
Claim 7
Dependent Claim
27 words
The device as claimed in claim 5, further comprising a heat radiating member sealed by the resin package, the chip being provided on said heat radiating member.
Claim 8
Independent Claim
106 words
A device comprising: a chip; a resin package sealing said chip, said resin package having resin projections located on a mount-side surface of the resin package, said resin projections extending downwards from the mount-side surface and laterally extending from at least one side surface of the resin package; metallic films respectively provided in continuous surface contact with said resin projections; and connecting parts electrically connecting electrode pads of said chip and the metallic films, wherein said resin projections have surfaces which are parallel to the mount-side surface of the resin package, and wherein the metallic films are formed on the entire surfaces of the resin projections.
Claim 9
Independent Claim
106 words
A device comprising: a chip; a resin package sealing said chip, said resin package having resin projections located on a mount-side surface of the resin package, said resin projections extending downwards from the mount-side surface and laterally extending from at least one side surface of the resin package; metallic films respectively provided in continuous surface contact with said resin projections; and connecting parts electrically connecting electrode pads of said chip and the metallic films, wherein said resin projections have surfaces which are parallel to the mount-side surface of the resin package, and wherein the metallic films are formed on the entire surfaces of the resin projections.
Claim 10
Dependent Claim
22 words
The device as claimed in claim 7, wherein each of said metallic films comprises a plurality of metallic layers which are stacked.
Claim 11
Dependent Claim
26 words
The device as claimed in claim 7, wherein said connecting parts respectively comprise bonding wires, which are bonded to the electrode pads and said metallic films.
Claim 12
Dependent Claim
23 words
The device as claimed in claim 7, wherein said resin package is a molded package so that the resin projections are integrally formed.
Claim 13
Independent Claim
105 words
A device comprising: a chip; a resin package sealing said chip, said resin package having resin projections located on a mount-side surface of the resin package, said resin projections extending downwards from the mount-side surface and being substantially flush with a side surface of the resin package; metallic films respectively provided in continuous surface contact with said resin projections; and connecting parts electrically connecting electrode pads of said chip and the metallic films, wherein said resin projections have surfaces which are parallel to the mount-side surface of the resin package, and wherein the metallic films are formed on the entire surfaces of the resin projections.
Claim 14
Independent Claim
105 words
A device comprising: a chip; a resin package sealing said chip, said resin package having resin projections located on a mount-side surface of the resin package, said resin projections extending downwards from the mount-side surface and being substantially flush with a side surface of the resin package; metallic films respectively provided in continuous surface contact with said resin projections; and connecting parts electrically connecting electrode pads of said chip and the metallic films, wherein said resin projections have surfaces which are parallel to the mount-side surface of the resin package, and wherein the metallic films are formed on the entire surfaces of the resin projections.
Claim 15
Dependent Claim
55 words
The device as claimed in claim 11, wherein: said resin projections comprise first projections and second projections being laterally longer than the first projections so that the second projections extend below the chip; and said metallic films comprise first metallic films provided on the first projections, and second metallic films provided on the second projections.
Claim 16
Dependent Claim
53 words
The device as claimed in claim 11, further comprising a spacer to be provided to the mount-side surface of said resin package, wherein said spacer is in contact with another device when said device is supported on a circuit board so that said side surface of the resin package faces the circuit board.
Claim 17
Dependent Claim
15 words
The device as claimed in claim 13, wherein said spacer is a heat radiating member.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-06-06 | 2003-12-06 | 2004-06-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-06-06 | 2007-12-06 | 2008-06-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-06-06 | 2011-12-06 | 2012-06-06 | $7700.00 | Window Closed / Lapsed |