US6057597A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor package with pre-fabricated cover
Assignee: Micron Technology Inc
•
Filing: 1998-10-14
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Granted: 2000-05-02
•
Expires: 2018-10-14
Abstract
Abstract A semiconductor package includes a substrate having one or more dice mounted thereto, and a cover adapted to protect and form a sealed space for the dice. The cover can be pre-fabricated of molded plastic, or stamped metal, and attached to the substrate using a cured seal. A hole can also be provided through the substrate to permit pressure equalization during formation of the seal. The cover can be prefabricated in an enclosed configuration for attachment directly to the substrate, or in a planar configuration for attachment to a peripheral ridge on the substrate. In either embodiment, the cover is removable to permit defective dice to be replaced or repaired.
Inventors
- 👤 Warren M. Farnworth
- 👤 David R. Hembree
- 👤 Derek Gochnour
- 👤 Salman Akram
- 👤 John O. Jacobson
- 👤 James M. Wark
- 👤 Steven G. Thummel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 16:10
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/60; H10W76/10; H10W76/12; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W70/67; H10W70/68; H10W70/681; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20
Claims Analysis
Total Claims: 33
Claim 1
Independent Claim
88 words
A semiconductor package comprising: a substrate comprising an external contact; a ridge on the substrate comprising a photopatterned resist; a semiconductor die on the substrate in electrical communication with the external contact and encompassed by the ridge; a cover attached to the ridge to form an enclosed space on the substrate for the die; a seal between the cover and the substrate configured to attach the cover to the ridge and to seal the space; and a vent hole in the substrate in flow communication with the space.
Claim 2
Dependent Claim
88 words
A semiconductor package comprising: a substrate comprising an external contact; a ridge on the substrate comprising a photopatterned resist; a semiconductor die on the substrate in electrical communication with the external contact and encompassed by the ridge; a cover attached to the ridge to form an enclosed space on the substrate for the die; a seal between the cover and the substrate configured to attach the cover to the ridge and to seal the space; and a vent hole in the substrate in flow communication with the space.
Claim 3
Dependent Claim
31 words
The package of claim 1 wherein the seal comprises a material selected from the group consisting of silicone adhesives, room temperature vulcanizing materials, thermosetting resins, cyanoacrylate adhesives, and anaerobic acrylic adhesives.
Claim 4
Dependent Claim
12 words
The package of claim 1 wherein the cover comprises a planar member.
Claim 5
Dependent Claim
20 words
The package of claim 1 wherein the cover comprises a material selected from the group consisting of plastic and metal.
Claim 6
Dependent Claim
13 words
The package of claim 1 wherein the external contact comprises an edge connector.
Claim 7
Dependent Claim
24 words
The package of claim 1 wherein the substrate comprises a plurality of external contacts in a grid array in electrical communication with the die.
Claim 8
Dependent Claim
78 words
A semiconductor package comprising: a substrate comprising an edge connector; a semiconductor die on the substrate in electrical communication with the edge connector; a cover attached to the substrate to form an enclosed space on the substrate for the die; a seal between the cover and the substrate comprising a polymer material configured to attach the cover to the substrate and to seal the space; and a vent hole in the substrate in flow communication with the space.
Claim 9
Dependent Claim
78 words
A semiconductor package comprising: a substrate comprising an edge connector; a semiconductor die on the substrate in electrical communication with the edge connector; a cover attached to the substrate to form an enclosed space on the substrate for the die; a seal between the cover and the substrate comprising a polymer material configured to attach the cover to the substrate and to seal the space; and a vent hole in the substrate in flow communication with the space.
Claim 10
Dependent Claim
91 words
A semiconductor package comprising: a substrate comprising an external contact; a semiconductor die mounted to the substrate in electrical communication with the external contact; a deposited polymer ridge on the substrate surrounding the die and having a first height greater than a second height of the die on the substrate; a planar cover attached to the ridge to form an enclosed space on the substrate for the die; and a polymer seal between the cover and the ridge configured to attach the cover to the ridge and to seal the space.
Claim 11
Dependent Claim
91 words
A semiconductor package comprising: a substrate comprising an external contact; a semiconductor die mounted to the substrate in electrical communication with the external contact; a deposited polymer ridge on the substrate surrounding the die and having a first height greater than a second height of the die on the substrate; a planar cover attached to the ridge to form an enclosed space on the substrate for the die; and a polymer seal between the cover and the ridge configured to attach the cover to the ridge and to seal the space.
Claim 12
Dependent Claim
23 words
The package of claim 8 wherein the die comprises a bumped die or a chip scale package flip chip mounted to the substrate.
Claim 13
Dependent Claim
19 words
The package of claim 8 wherein the die comprises a plurality of bond pads wire bonded to the substrate.
Claim 14
Dependent Claim
27 words
The package of claim 8 further comprising a vent hole in the substrate in flow communication with the space configured to equalize a pressure in the space.
Claim 15
Dependent Claim
20 words
The package of claim 8 further comprising a sealed vent hole in the substrate in flow communication with the space.
Claim 16
Dependent Claim
16 words
The package of claim 8 wherein the polymer ridge comprises a deposited, patterned and developed resist.
Claim 17
Dependent Claim
32 words
The package of claim 8 wherein the polymer seal comprises a material selected from the group consisting of silicone adhesives, room temperature vulcanizing materials, thermosetting resins, cyanoacrylate adhesives, and anaerobic acrylic adhesives.
Claim 18
Dependent Claim
111 words
A semiconductor package comprising: a substrate comprising a plurality of die mounting sites including a replacement die mounting site; an edge connector on the substrate comprising a plurality of external contacts; a plurality of semiconductor dice on the die mounting sites in electrical communication with the external contacts; a first cover attached to the substrate configured to form a first sealed space for the dice; a replacement die on the replacement die mounting site in electrical communication with the external contacts and configured to replace a defective die of the semiconductor dice; and a second cover attached to the substrate configured to form a second sealed space for the replacement die.
Claim 19
Dependent Claim
111 words
A semiconductor package comprising: a substrate comprising a plurality of die mounting sites including a replacement die mounting site; an edge connector on the substrate comprising a plurality of external contacts; a plurality of semiconductor dice on the die mounting sites in electrical communication with the external contacts; a first cover attached to the substrate configured to form a first sealed space for the dice; a replacement die on the replacement die mounting site in electrical communication with the external contacts and configured to replace a defective die of the semiconductor dice; and a second cover attached to the substrate configured to form a second sealed space for the replacement die.
Claim 20
Dependent Claim
30 words
The package of claim 15 further comprising a first polymer seal attaching the first cover to the substrate and a second polymer seal attaching the second cover to the substrate.
Claim 21
Dependent Claim
28 words
The package of claim 15 further comprising a first ridge between the first cover and the substrate and a second ridge between the second cover and the substrate.
Claim 22
Dependent Claim
96 words
A semiconductor package comprising: a substrate comprising an external contact; a semiconductor die mounted to the substrate in electrical communication with the external contact and having a first height on the substrate; a ridge on the substrate surrounding the die and having a second height on the substrate greater than the first height, the ridge comprising a deposited, patterned and developed resist; a planar cover attached to the ridge, the cover and the ridge forming a space for enclosing the die; a polymer seal between the cover and the ridge attaching the cover to the substrate.
Claim 23
Dependent Claim
96 words
A semiconductor package comprising: a substrate comprising an external contact; a semiconductor die mounted to the substrate in electrical communication with the external contact and having a first height on the substrate; a ridge on the substrate surrounding the die and having a second height on the substrate greater than the first height, the ridge comprising a deposited, patterned and developed resist; a planar cover attached to the ridge, the cover and the ridge forming a space for enclosing the die; a polymer seal between the cover and the ridge attaching the cover to the substrate.
Claim 24
Dependent Claim
27 words
The package of claim 18 further comprising a vent hole in the substrate in flow communication with the space configured to equalize a pressure in the space.
Claim 25
Dependent Claim
18 words
The package of claim 18 wherein the die comprises a bumped die flip chip mounted to the substrate.
Claim 26
Dependent Claim
13 words
The package of claim 18 wherein the die comprises a chip scale package.
Claim 27
Dependent Claim
144 words
A semiconductor package comprising: a substrate comprising an electrical connector, a plurality of die mounting sites surrounded by a first polymer ridge having a first height, and a replacement die mounting site surrounded by a second polymer ridge having the first height; a plurality of semiconductor dice mounted to the die mounting sites in electrical communication with the electrical connector and having a second height on the substrate which is less than the first height; a first cover attached to the first ridge and configured to enclose the dice within a first space on the substrate; a replacement die mounted to the replacement die mounting site in place of a defective die of the semiconductor dice and having the second height; and a second cover attached to the second ridge and configured to enclose the replacement die within a second space on the substrate.
Claim 28
Dependent Claim
144 words
A semiconductor package comprising: a substrate comprising an electrical connector, a plurality of die mounting sites surrounded by a first polymer ridge having a first height, and a replacement die mounting site surrounded by a second polymer ridge having the first height; a plurality of semiconductor dice mounted to the die mounting sites in electrical communication with the electrical connector and having a second height on the substrate which is less than the first height; a first cover attached to the first ridge and configured to enclose the dice within a first space on the substrate; a replacement die mounted to the replacement die mounting site in place of a defective die of the semiconductor dice and having the second height; and a second cover attached to the second ridge and configured to enclose the replacement die within a second space on the substrate.
Claim 29
Dependent Claim
15 words
The package of claim 22 wherein the package comprises a single in line memory module.
Claim 30
Dependent Claim
17 words
The package of claim 22 wherein the first ridge and the second ridge comprise a patterned resist.
Claim 31
Dependent Claim
18 words
The package of claim 22 wherein the first cover and the second cover comprise molded plastic or metal.
Claim 32
Dependent Claim
27 words
The package of claim 22 further comprising a first vent hole in flow communication with the first space configured to equalize a pressure in the first space.
Claim 33
Dependent Claim
27 words
The package of claim 22 further comprising a second vent hole in flow communication with the second space configured to equalize a pressure in the second space.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-05-02 | 2003-11-01 | 2004-05-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-05-02 | 2007-11-01 | 2008-05-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-05-02 | 2011-11-01 | 2012-05-02 | $7700.00 | Window Closed / Lapsed |