Method of making an assembly package having an air tight cavity and a product made by the method

Claim 1

A method of making an assembly package comprising the steps of: (a) forming a dielectric base comprising the steps of: (a1) placing a conductive lead frame comprising a frame pad and a plurality of conductive leads, each of said leads having an inner end, an intermediate portion and an outer end, inside a die, said die comprising (1) a top interior surface, (2) a bottom interior surface, (3) at least one post having a top surface, said post protruding from said bottom interior surface toward said top interior surface, and (4) a pin protruding from said top interior surface and extending to said top surface of said post, said plurality of conductive leads being positioned within said die such that said top surface of said post presses the inner end of each of said plurality of conductive leads against said top interior surface of said die, whereby the cavity created within the interior of the die is configured to form a dielectric base of a predetermined shape, (a2) filling said cavity space with a thermally setting liquefied epoxy, (a4) curing the injected epoxy to form said dielectric base, whereby said dielectric base includes a pin hole made by said pin and a recess made by said post, and (a5) removing said die; (b) plating said plurality of conductive leads and said frame pad; (c) bonding a circuitry to said frame pad and wire bonding said circuitry to said inner end of each said plurality of conductive leads; (d) dispensing a thermally setting liquefied epoxy onto said intermediate portion of each of said plurality of conductive leads and onto said dielectric base disposed between said conductive leads; (e) positioning a shell having a rim about the periphery thereof onto the dispensed epoxy to bond said rim to said plurality of conductive leads and to said dielectric base disposed between said conductive leads and heating and curing said epoxy to bond said shell to said dielectric base and conductive leads; (f) dispensing a thermally setting liquefied epoxy into said pin hole and said recess; and (g) curing the epoxy disposed in said pin hole and said recess to form an air tight cavity housing said circuitry.

Claim 2

A method of making an assembly package comprising the steps of: (a) forming a dielectric base comprising the steps of: (a1) placing a conductive lead frame comprising a frame pad and a plurality of conductive leads, each of said leads having an inner end, an intermediate portion and an outer end, inside a die, said die comprising (1) a top interior surface, (2) a bottom interior surface, (3) at least one post having a top surface, said post protruding from said bottom interior surface toward said top interior surface, and (4) a pin protruding from said top interior surface and extending to said top surface of said post, said plurality of conductive leads being positioned within said die such that said top surface of said post presses the inner end of each of said plurality of conductive leads against said top interior surface of said die, whereby the cavity created within the interior of the die is configured to form a dielectric base of a predetermined shape, (a2) filling said cavity space with a thermally setting liquefied epoxy, (a4) curing the injected epoxy to form said dielectric base, whereby said dielectric base includes a pin hole made by said pin and a recess made by said post, and (a5) removing said die; (b) plating said plurality of conductive leads and said frame pad; (c) bonding a circuitry to said frame pad and wire bonding said circuitry to said inner end of each said plurality of conductive leads; (d) dispensing a thermally setting liquefied epoxy onto said intermediate portion of each of said plurality of conductive leads and onto said dielectric base disposed between said conductive leads; (e) positioning a shell having a rim about the periphery thereof onto the dispensed epoxy to bond said rim to said plurality of conductive leads and to said dielectric base disposed between said conductive leads and heating and curing said epoxy to bond said shell to said dielectric base and conductive leads; (f) dispensing a thermally setting liquefied epoxy into said pin hole and said recess; and (g) curing the epoxy disposed in said pin hole and said recess to form an air tight cavity housing said circuitry.

Claim 13

A method of making an assembly package having an air tight cavity for housing a circuitry, said assembly having a plurality of conductive leads extending outwardly from a conductive pad, each of said conductive leads having an inner end portion said method comprising the steps of: (a) forming a dielectric base by transfer molding by injecting a thermally setting epoxy into the cavity space of a mold die, said space being shaped to hold said conductive pad and said inner end portion of each of said plurality of conductive leads in a mold die, wherein a pin is disposed within said mold die such that the resulting dielectric base formed by transfer molding has a pin hole formed therein; (b) bonding said circuitry to the conductive pad; (c) wire bonding the conductive leads to said circuitry; (d) covering the circuitry with a plastic shell having a rim disposed about the periphery thereof; (e) bonding said rim of said shell to said plurality of conductive leads and said dielectric base with a thermally setting epoxy; (f) heating to a first elevated temperature and curing said epoxy bonding said rim of said shell to said plurality of conductive leads and said dielectric base wherein said pin hole in said dielectric base provides a path for the heated air in the cavity formed by the shell and the electric base to escape; (g) heating said assembly having a second elevated temperature; (h) cooling said assembly to a third elevated temperature, said third elevated temperature being lower than said second elevated temperature; (i) filling said pin hole with a thermally setting epoxy to seal the cavity formed by the shell and the dielectric base while the assembly is being cooled to said lower third temperature; and (j) gelling, hardening and curing the epoxy in the pin hole, thereby forming and air tight cavity housing said circuitry.

Claim 14

A method of making an assembly package having an air tight cavity for housing a circuitry, said assembly having a plurality of conductive leads extending outwardly from a conductive pad, each of said conductive leads having an inner end portion said method comprising the steps of: (a) forming a dielectric base by transfer molding by injecting a thermally setting epoxy into the cavity space of a mold die, said space being shaped to hold said conductive pad and said inner end portion of each of said plurality of conductive leads in a mold die, wherein a pin is disposed within said mold die such that the resulting dielectric base formed by transfer molding has a pin hole formed therein; (b) bonding said circuitry to the conductive pad; (c) wire bonding the conductive leads to said circuitry; (d) covering the circuitry with a plastic shell having a rim disposed about the periphery thereof; (e) bonding said rim of said shell to said plurality of conductive leads and said dielectric base with a thermally setting epoxy; (f) heating to a first elevated temperature and curing said epoxy bonding said rim of said shell to said plurality of conductive leads and said dielectric base wherein said pin hole in said dielectric base provides a path for the heated air in the cavity formed by the shell and the electric base to escape; (g) heating said assembly having a second elevated temperature; (h) cooling said assembly to a third elevated temperature, said third elevated temperature being lower than said second elevated temperature; (i) filling said pin hole with a thermally setting epoxy to seal the cavity formed by the shell and the dielectric base while the assembly is being cooled to said lower third temperature; and (j) gelling, hardening and curing the epoxy in the pin hole, thereby forming and air tight cavity housing said circuitry.