US5369552A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multi-chip module with multiple compartments
Assignee: Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Filing: 1992-07-14
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Granted: 1994-11-29
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Expires: 2012-07-14
Abstract
Abstract The present invention provides a multi-chip module having multiple compartments. Circuitry is arranged on a substrate in such a manner that circuit components requiring specific operating environments are located in discrete areas dedicated to accommodate the circuit components. A cover, having multiple chambers that align with the discrete areas on the substrate, is secured to the substrate to define the multiple compartments. The compartments are separated by material that effectively isolates the compartments relative to one another.
Inventors
- 👤 Lawrence C. Barnes
- 👤 Gary R. Thornberg
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 06:33
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H10; H10W; H10W90/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49133; Y10T29/49137
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
86 words
A multi-chip module, comprising a substrate; a plurality of circuit components arranged on said substrate in such a manner that circuit components requiring specific and similar operating environments are grouped together, each group of circuit components being located in a separate and discrete area of said substrate: a cover having multiple chambers that align with said discrete areas on said substrate, said cover being secured to said substrate to define multiple compartments, each one of said compartments providing an operating environment independent of all other compartments.
Claim 2
Dependent Claim
86 words
A multi-chip module, comprising a substrate; a plurality of circuit components arranged on said substrate in such a manner that circuit components requiring specific and similar operating environments are grouped together, each group of circuit components being located in a separate and discrete area of said substrate: a cover having multiple chambers that align with said discrete areas on said substrate, said cover being secured to said substrate to define multiple compartments, each one of said compartments providing an operating environment independent of all other compartments.
Claim 3
Dependent Claim
23 words
A multi-chip module according to claim 1, wherein said chambers are separated by material that effectively isolates said chambers relative to one another.
Claim 4
Dependent Claim
23 words
A multi-chip module according to claim 1, wherein said compartments are separated by material that effectively isolates said compartments relative to one another.
Claim 5
Dependent Claim
20 words
The multi-chip module in accordance with claim 1, further comprising: means for heating at least one of said multiple compartments.
Claim 6
Dependent Claim
20 words
The multi-chip module in accordance with claim 1, further comprising: means for cooling at least one of said multiple compartments.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-11-28 | 1998-05-30 | 1998-11-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-11-28 | 2002-05-30 | 2002-11-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-11-28 | 2006-05-30 | 2006-11-29 | $7700.00 | Window Closed / Lapsed |