Radiation shielding of three dimensional multi-chip modules

Claim 2

A radiation shielded multi-chip module, comprising: (a) a base constructed from a radiation shielding material with a plurality of non-conducting feedthroughs; and (b) a substrate with a plurality of integrated circuit devices attached to a top side of said substrate and a plurality of integrated circuit devices attached to a bottom side of said substrate, wherein said substrate is attached to the inside of said base; and (c) lid constructed from a radiation shielding material, wherein said base is secured to an inner surface of said base member; and (d) a plurality of package leads passing through said plurality of non-conducting feed throughs in said base and electrically attached to said plurality of integrated circuit devices; and (e) wherein said radiation shielding material is comprised of a combination of a high Z material having an atomic number greater than about 40 and a low Z material having an atomic number less than about 40.

Claim 3

A radiation shielded multi-chip module according to claim 1, wherein a plurality of die attach slugs composed of radiation shielding material are disposed between and attached to said substrate and said plurality of integrated circuit die.

Claim 4

A radiation shielded multi-chip module as recited in claim 1, wherein a thickness of said base and said lid is determined by, a calculation of the radiation for a specific task; and a total radiation dose tolerance of all integrated circuits attached to said base; and a radiation transport calculation, wherein the thickness of said shielding material is calculated as a function of said radiation for a specific task, said total radiation dose tolerance, and the density and thickness of said shielding material and is derived from said radiation transport calculation.

Claim 5

A radiation shielded multi-chip module, comprising: (a) top lid and side-wall combination composed of radiation shielding material; and (b) a bottom lid and side-wall combination composed of a radiation shielding material; and (c) a substrate with a plurality of integrated circuit devices attached to a top side of said substrate and a plurality of integrated circuit devices attached to a bottom side of said substrate, wherein said substrate is attached to said top and said bottom lid and side-wall combination by a seal ring on said substrates top and bottom surface; and (d) a plurality of package leads attached electrically to said plurality of integrated circuit devices and mechanically attached to said substrate; and (e) wherein the thickness of said base and said lid is determined by, (1) a calculation of the radiation for a specific task; and (2) a total radiation dose tolerance of all integrated circuits attached to said base; and (3) a radiation transport calculation, wherein the thickness of said shielding material is calculated as a function of said radiation for a specific task, said total radiation dose tolerance, and the density and thickness of said shielding material and is derived from said radiation transport calculation.

Claim 6

A radiation shielded multi-chip module, comprising: (a) top lid and side-wall combination composed of radiation shielding material; and (b) a bottom lid and side-wall combination composed of a radiation shielding material; and (c) a substrate with a plurality of integrated circuit devices attached to a top side of said substrate and a plurality of integrated circuit devices attached to a bottom side of said substrate, wherein said substrate is attached to said top and said bottom lid and side-wall combination by a seal ring on said substrates top and bottom surface; and (d) a plurality of package leads attached electrically to said plurality of integrated circuit devices and mechanically attached to said substrate; and (e) wherein the thickness of said base and said lid is determined by, (1) a calculation of the radiation for a specific task; and (2) a total radiation dose tolerance of all integrated circuits attached to said base; and (3) a radiation transport calculation, wherein the thickness of said shielding material is calculated as a function of said radiation for a specific task, said total radiation dose tolerance, and the density and thickness of said shielding material and is derived from said radiation transport calculation.

Claim 7

A radiation shielded multi-chip module, comprising: (a) a top lid and side-wall combination composed of radiation shielding material; and (b) a bottom lid and side-wall combination composed of a radiation shielding material; and (c) a substrate with a plurality of integrated circuit devices attached to a top side of said substrate and a plurality of integrated circuit devices attached to a bottom side of said substrate, herein said substrate is attached to said bottom lid and side-wall combination by a seal ring on said substrates top and bottom surface; and (d) a plurality of package leads attached electrically to said plurality of integrated circuit devices and mechanically attached to said substrate; and (e) wherein said radiation shielding material is comprised of a combination of a high Z material having an atomic number greater than about 40 and a low Z material having an atomic number less than about 40.

Claim 8

A radiation shielded multi-chip module, comprising: (a) a top lid and side-wall combination composed of radiation shielding material; and (b) a bottom lid and side-wall combination composed of a radiation shielding material; and (c) a substrate with a plurality of integrated circuit devices attached to a top side of said substrate and a plurality of integrated circuit devices attached to a bottom side of said substrate, herein said substrate is attached to said bottom lid and side-wall combination by a seal ring on said substrates top and bottom surface; and (d) a plurality of package leads attached electrically to said plurality of integrated circuit devices and mechanically attached to said substrate; and (e) wherein said radiation shielding material is comprised of a combination of a high Z material having an atomic number greater than about 40 and a low Z material having an atomic number less than about 40.

Claim 9

A radiation shielded multi-chip module, comprising: (a) a top lid and side-wall combination composed of radiation shielding material; and (b) a bottom lid and side-wall combination composed of a radiation shielding material; and (c) a substrate with a plurality of integrated circuit devices attached to a top side of said substrate and a plurality of integrated circuit devices attached to a bottom side of said substrate, wherein said substrate is attached to said top and said bottom lid and side-wall combination by a seal ring on said substrates top and bottom surface; and (d) a plurality of package leads attached electrically to said plurality of integrated circuit devices and mechanically attached to said substrate; and (e) wherein said seal ring makes a hermetic seal between said top and said bottom lid and side-wall combination and said substrate.

Claim 10

A radiation shielded multi-chip module, comprising: (a) a top lid and side-wall combination composed of radiation shielding material; and (b) a bottom lid and side-wall combination composed of a radiation shielding material; and (c) a substrate with a plurality of integrated circuit devices attached to a top side of said substrate and a plurality of integrated circuit devices attached to a bottom side of said substrate, wherein said substrate is attached to said top and said bottom lid and side-wall combination by a seal ring on said substrates top and bottom surface; and (d) a plurality of package leads attached electrically to said plurality of integrated circuit devices and mechanically attached to said substrate; and (e) wherein said seal ring makes a hermetic seal between said top and said bottom lid and side-wall combination and said substrate.

Claim 11

A radiation shielded multi-chip module, comprising: (a) a top lid and side-wall combination composed of radiation shielding material; and (b) a bottom lid and side-wall combination composed of a radiation shielding material; and (c) a substrate with a plurality of integrated circuit devices attached to a top side of said substrate and a plurality of integrated circuit devices attached to a bottom side of said substrate, wherein said substrate is attached to said top and said bottom lid and side-wall combination by a seal ring on said substrates top and bottom surface; and (d) a plurality of package leads attached electrically to said plurality of integrated circuit devices and mechanically attached to said substrate; and (e) wherein said top lid and side-wall combination or said bottom lid and side-wall combination has a small hole to allow for venting during sealing, and said small hole is subsequently sealed to maintain a hermetic seal.

Claim 12

A radiation shielded multi-chip module, comprising: (a) a top lid and side-wall combination composed of radiation shielding material; and (b) a bottom lid and side-wall combination composed of a radiation shielding material; and (c) a substrate with a plurality of integrated circuit devices attached to a top side of said substrate and a plurality of integrated circuit devices attached to a bottom side of said substrate, wherein said substrate is attached to said top and said bottom lid and side-wall combination by a seal ring on said substrates top and bottom surface; and (d) a plurality of package leads attached electrically to said plurality of integrated circuit devices and mechanically attached to said substrate; and (e) wherein said top lid and side-wall combination or said bottom lid and side-wall combination has a small hole to allow for venting during sealing, and said small hole is subsequently sealed to maintain a hermetic seal.

Claim 13

A radiation shielded multi-chip module, (a) a top lid and side-wall combination composed of radiation shielding material; and (b) a bottom lid and side-wall combination composed of a radiation shielding material; and (c) a substrate with a plurality of integrated circuit devices attached to a top side of said substrate and a plurality of integrated circuit devices attached to a bottom side of said substrate, wherein said substrate is attached to said top and said bottom lid and side-wall combination by a seal ring on said substrates top and bottom surface; and (d) a plurality of package leads attached electrically to said plurality of integrated circuit devices and mechanically attached to said substrate; and (e) wherein said plurality of integrated circuit devices are electrically attached by a plurality of screened interconnects within said substrate, said screened interconnects are electrically attached to said plurality of package leads.

Claim 14

A radiation shielded multi-chip module, (a) a top lid and side-wall combination composed of radiation shielding material; and (b) a bottom lid and side-wall combination composed of a radiation shielding material; and (c) a substrate with a plurality of integrated circuit devices attached to a top side of said substrate and a plurality of integrated circuit devices attached to a bottom side of said substrate, wherein said substrate is attached to said top and said bottom lid and side-wall combination by a seal ring on said substrates top and bottom surface; and (d) a plurality of package leads attached electrically to said plurality of integrated circuit devices and mechanically attached to said substrate; and (e) wherein said plurality of integrated circuit devices are electrically attached by a plurality of screened interconnects within said substrate, said screened interconnects are electrically attached to said plurality of package leads.

Claim 15

A radiation shielded multi-chip module, comprising: (a) A top side-wall; and (b) A bottom side-wall; and (c) A substrate comprised of a plurality of integrated circuit devices attached to a top side of said substrate and a plurality of integrated circuit devices attached to a bottom side of said substrate, wherein said top side of said substrate is attached to the bottom side of said top side-wall, and said bottom side of said substrate is attached to the top surface of said bottom side-wall; and (d) A top lid constructed from a radiation shielding material, wherein said top lid is hermetically sealed to the top surface of said top side-wall; and (e) A bottom lid constructed from a radiation shielding material, wherein said bottom lid is hermetically sealed to the bottom surface of said bottom side-wall; and (f) A plurality of package leads attached electrically to said plurality of integrated circuit devices.

Claim 16

A radiation shielded multi-chip module, comprising: (a) A top side-wall; and (b) A bottom side-wall; and (c) A substrate comprised of a plurality of integrated circuit devices attached to a top side of said substrate and a plurality of integrated circuit devices attached to a bottom side of said substrate, wherein said top side of said substrate is attached to the bottom side of said top side-wall, and said bottom side of said substrate is attached to the top surface of said bottom side-wall; and (d) A top lid constructed from a radiation shielding material, wherein said top lid is hermetically sealed to the top surface of said top side-wall; and (e) A bottom lid constructed from a radiation shielding material, wherein said bottom lid is hermetically sealed to the bottom surface of said bottom side-wall; and (f) A plurality of package leads attached electrically to said plurality of integrated circuit devices.

Claim 17

A radiation shielded multi-chip module as recited in claim 9, wherein top lid and said bottom lid are composed of a combination of a high Z material having an atomic number greater than about 40 and a low Z material having an atomic number less than about 40.

Claim 18

A radiation shielded multi-chip module as recited in claim 9, wherein said top lid and said bottom lid are composed of a high Z material having an atomic number greater than about 40.

Claim 19

A radiation shielded multi-chip module as recited in claim 9, wherein said top lid and said bottom lid are composed of a Copper Tungsten alloy.

Claim 20

A radiation shielded multi-chip module as recited in claim 9, wherein said top lid and said bottom lid are composed of a Tungsten.

Claim 21

A radiation shielded multi-chip module as recited in claim 9, wherein (a) said top lid is comprised of (1) a first top lid which is composed of a packaging material and (2) an inner top lid composed of a radiation shielding material attached to said first top lid, wherein said first top lid makes a seal with said top surface of said side wall; and (b) said bottom lid is comprised of (1) a first bottom lid which is composed of a packaging material and (2) an inner bottom lid composed of a radiation shielding material and attached to said first bottom lid, wherein said first bottom lid makes a seal with said bottom surface of said side wall.

Claim 22

A radiation shielded multi-chip module as recited in claim 14, wherein said radiation shielding material is comprised of a combination of a high Z material having an atomic number greater than about 40 and a low Z material having an atomic number less than about 40.

Claim 23

A radiation shielded multi-chip module as recited in claim 14, wherein said radiation shielding material is comprised of a Copper Tungsten alloy.

Claim 24

A radiation shielded multi-chip module according to claim 9, further including, a plurality of die attach slugs composed of radiation shielding material attached to said substrate between said substrate and said plurality of integrated circuit die.

Claim 25

A radiation shielded multi-chip module as recited in claim 9, wherein a shielding ring composed of a radiation shielding material is attached to said top and said bottom surface of said substrate.

Claim 26

A radiation shielded multi-chip module, comprising: (a) a dual cavity base with a top well and a bottom well and with a plurality of non-conducting feed throughs; and (b) a top substrate with a plurality of integrated circuit devices attached to a top side of said top substrate, wherein said top substrate is attached to the inside surface of said top well on said dual cavity base; and (c) a bottom substrate with a plurality of integrated circuit devices attached to a bottom side of said bottom substrate wherein said bottom substrate is attached to the inside surface of said bottom cavity of said dual cavity base; and (d) a top lid comprised of radiation shielding material which is attached to said top well of said dual cavity base forming a sealed cavity; and (e) a bottom lid comprised of radiation shielding material which is attached to said bottom well of said dual cavity base forming a sealed cavity; and (f) a plurality of package leads passing through said plurality of non-conducting feed throughs in said dual cavity base and electrically attached to said plurality of integrated circuit devices.

Claim 27

A radiation shielded multi-chip module, comprising: (a) a dual cavity base with a top well and a bottom well and with a plurality of non-conducting feed throughs; and (b) a top substrate with a plurality of integrated circuit devices attached to a top side of said top substrate, wherein said top substrate is attached to the inside surface of said top well on said dual cavity base; and (c) a bottom substrate with a plurality of integrated circuit devices attached to a bottom side of said bottom substrate wherein said bottom substrate is attached to the inside surface of said bottom cavity of said dual cavity base; and (d) a top lid comprised of radiation shielding material which is attached to said top well of said dual cavity base forming a sealed cavity; and (e) a bottom lid comprised of radiation shielding material which is attached to said bottom well of said dual cavity base forming a sealed cavity; and (f) a plurality of package leads passing through said plurality of non-conducting feed throughs in said dual cavity base and electrically attached to said plurality of integrated circuit devices.

Claim 28

A radiation shielded multi-chip module as recited in claim 19, wherein said radiation shielding material is comprised of a combination of a high Z having an atomic number greater than about 40 and a low Z material having an atomic number less than about 40.

Claim 29

A radiation shielded multi-chip module as recited in claim 19, wherein said radiation shielding material is comprised of a Copper Tungsten alloy.

Claim 30

A radiation shielded multi-chip module as recited in claim 19, wherein said radiation shielding material is comprised of Tungsten.

Claim 31

A radiation shielded multi-chip module as recited in claim 19, wherein said radiation shielding material is comprised of a high Z material having an atomic number greater than about 40.

Claim 32

A radiation shielded multi-chip module as recited in claim 19, wherein (a) said top lid is comprised of (1) a first top lid which is composed of a packaging material and (2) an inner top lid composed of a radiation shielding material attached to said first top lid, wherein said first top lid makes a seal with a top surface of said dual cavity base; and (b) said bottom lid is comprised of (1) a first bottom lid which is composed of a packaging material and (2) an inner bottom lid composed of a radiation shielding material attached to said first bottom lid, wherein said first bottom lid makes a seal with a bottom surface of said dual cavity base.