High-frequency circuit package

Claim 2

A high-frequency circuit package comprising: a conductive substrate; a first shielding case associated with a first surface of the conductive substrate to define therein a first shielding chamber; a second shielding case associated with a surface opposite the first surface of the conductive substrate to define therein a second shielding chamber; a pair of high-frequency circuits, one of which is mounted on the first surface of the conductive substrate within the first shielding case, and the other of which is mounted on the opposite surface of the conductive substrate within the second shielding case, said conductive substrate having a through-opening for receiving therein a dielectric, a feed-through terminal extending through a through-opening formed in the dielectric tool aisle one of said high-frequency circuits to be electrically connected to the other high-frequency circuit, said through opening of the conductive substrate having two steps, one of which supports thereon the dielectric.

Claim 3

A high-frequency circuit package as set forth in claim 1, wherein one end portion of said feedthrough terminal is arranged within said first shielding chamber, and another end portion of said feedthrough terminal is arranged within said second shielding chamber.

Claim 4

A high-frequency circuit package as set forth in claim 1, wherein said first shielding case has a plurality of through openings through which leads extend, said leads connecting said high-frequency circuits to an outside circuit.

Claim 5

A high-frequency circuit package as set forth in claim 3, wherein a portion of each of said leads is arranged between upper and lower dielectrics which are received within said through opening of the first shielding case.

Claim 6

A high-frequency circuit package as set forth in claim 4, wherein each of said leads has a narrow portion which is arranged between said upper and lower dielectrics.

Claim 7

A high-frequency circuit package comprising: a conductive substrate; a first shielding case associated with a first surface of the conductive substrate to define therein a first shielding chamber; a second shielding case associated with a surface opposite the first surface of the conductive substrate to define therein a second shielding chamber; a pair of high-frequency circuits, one of which is mounted on the first surface of the conductive substrate within the first shielding case, and the other of which is mounted on the opposite surface of the conductive substrate within the second shielding case; a feed through terminal which extends through the conductive substrate to allow one of said high-frequency circuits to be electrically connected to the other high-frequency circuit; and a through opening in said conductive substrate for receiving therein a dielectric, said dielectric having a feed-through terminal extending through a through-opening formed in the dielectric to allow one of said high-frequency circuits to be electrically connected to the other high-frequency circuit, said through opening of the conductive substrate having two steps, one of which supports thereon the dielectric.

Claim 8

A high-frequency circuit package comprising: a conductive substrate; a first shielding case associated with a first surface of the conductive substrate to define therein a first shielding chamber; a second shielding case associated with a surface opposite the first surface of the conductive substrate to define therein a second shielding chamber; a pair of high-frequency circuits, one of which is mounted on the first surface of the conductive substrate within the first shielding case, and the other of which is mounted on the opposite surface of the conductive substrate within the second shielding case; a feed through terminal which extends through the conductive substrate to allow one of said high-frequency circuits to be electrically connected to the other high-frequency circuit; and a through opening in said conductive substrate for receiving therein a dielectric, said dielectric having a feed-through terminal extending through a through-opening formed in the dielectric to allow one of said high-frequency circuits to be electrically connected to the other high-frequency circuit, said through opening of the conductive substrate having two steps, one of which supports thereon the dielectric.

Claim 9

A high-frequency circuit package as set forth in claim 6, wherein said first shielding case has a plurality of through openings through which leads extend, said leads connecting said high-frequency circuits to an outside circuit.

Claim 10

A high-frequency circuit package as set forth in claim 7, wherein a portion of each of said leads is arranged between upper and lower dielectrics which are received within said through opening of the first shielding case.

Claim 11

A high-frequency circuit package as set forth in claim 8, wherein each of said leads has a narrow portion which is arranged between said upper and lower dielectrics.

Claim 12

A high-frequency circuit package comprising: a conductive substrate; a first shielding case associated with a first surface of the conductive substrate to define therein a first shielding chamber; a second shielding case associated with a surface opposite the first surface of the conductive substrate to define therein a second shielding chamber; a pair of high-frequency circuits, one of which is mounted on the first surface of the conductive substrate within the first shielding case, and the other of which is mounted on the opposite surface of the conductive substrate within the second shielding case; a feed through terminal which extends through the conductive substrate to allow one of said high-frequency circuits to be electrically connected to the other high-frequency circuit; a through opening in said conductive substrate for receiving therein a dielectric, said dielectric having a feed-through terminal extending through a through opening formed in the dielectric to allow one of said high-frequency circuits to be electrically connected to the other high-frequency circuit, said through opening of the conductive substrate having two steps, one of which supports therein the dielectric; and a plurality of through openings and said shielding case through said leads extend, said leads connecting said high-frequency circuits to an outside circuit.

Claim 13

A high-frequency circuit package comprising: a conductive substrate; a first shielding case associated with a first surface of the conductive substrate to define therein a first shielding chamber; a second shielding case associated with a surface opposite the first surface of the conductive substrate to define therein a second shielding chamber; a pair of high-frequency circuits, one of which is mounted on the first surface of the conductive substrate within the first shielding case, and the other of which is mounted on the opposite surface of the conductive substrate within the second shielding case; a feed through terminal which extends through the conductive substrate to allow one of said high-frequency circuits to be electrically connected to the other high-frequency circuit; a through opening in said conductive substrate for receiving therein a dielectric, said dielectric having a feed-through terminal extending through a through opening formed in the dielectric to allow one of said high-frequency circuits to be electrically connected to the other high-frequency circuit, said through opening of the conductive substrate having two steps, one of which supports therein the dielectric; and a plurality of through openings and said shielding case through said leads extend, said leads connecting said high-frequency circuits to an outside circuit.

Claim 14

A high-frequency circuit package as set forth in claim 10, wherein one end portion of said feedthrough terminal is arranged within said first shielding chamber, and another end portion of said feedthrough terminal is arranged within said second shielding chamber.

Claim 15

A high-frequency circuit package as set forth in claim 11, wherein a portion of each of said leads is arranged between upper and lower dielectrics which are received within said through opening of the first shielding case.

Claim 16

A high-frequency circuit package as set forth in claim 11, wherein each of said leads has a narrow portion which is arranged between said upper and lower dielectrics.